A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

Aspects relate to an integrated optical probe card and a system for performing wafer testing of optical micro-electro-mechanical systems (MEMS) structures with an in-plane optical axis. On-wafer optical screening of optical MEMS structures may be performed utilizing one or more micro-optical bench components to redirect light between an out-of-plane direction that is perpendicular to the in-plane optical axis to an in-plane direction that is parallel to the in-plane optical axis to enable testing of the optical MEMS structures with vertical injection of the light.

A redeposited material is removed so as to electrically observe a microelement without causing foreign matters or metal contamination. An FIB device (charged particle beam device) includes an FIB barrel which discharges the focused ion beam (charged particle beam), a stage which holds a sample (substrate), a microcurrent measuring device (current measuring unit) which measures a leakage current from the sample, and a timer (time measuring unit) which measures a time to emit the focused ion beam and a time to measure the leakage current. Further, the FIB device includes a system control unit (control unit) which synchronizes a time to emit the focused ion beam and a time to measure the leakage current by the microcurrent measuring device.

A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.

A redeposited material is removed so as to electrically observe a microelement without causing foreign matters or metal contamination. An FIB device (charged particle beam device) includes an FIB barrel which discharges the focused ion beam (charged particle beam), a stage which holds a sample (substrate), a microcurrent measuring device (current measuring unit) which measures a leakage current from the sample, and a timer (time measuring unit) which measures a time to emit the focused ion beam and a time to measure the leakage current. Further, the FIB device includes a system control unit (control unit) which synchronizes a time to emit the focused ion beam and a time to measure the leakage current by the microcurrent measuring device.

Methods and apparatuses are provided for evaluating or testing stiction in Microelectromechanical Systems (MEMS) devices utilizing a mechanized shock pulse generation approach. In one embodiment, the method includes the step or process of loading a MEMS device, such as a multi-axis MEMS accelerometer, into a socket provided on a Device-Under-Test (DUT) board. After loading the MEMS device into the socket, a series of controlled shock pulses is generated and transmitted through the MEMS device utilizing a mechanized test apparatus. The mechanized test apparatus may, for example, repeatedly move the DUT board over a predefined motion path to generate the controlled shock pulses. In certain cases, transverse vibrations may also be directed through the tested MEMS device in conjunction with the shock pulses. An output of the MEMS device is then monitored to determine whether stiction of the MEMS device occurs during each of the series of controlled shock pulses.

A probe card fits in a system for testing a micro-electro-mechanical device having an element sensitive to a magnetic field. The probe card is formed by a PCB having a through-opening and probe tips for electrically contacting the micro-electro-mechanical device. A housing structure is received within the through-opening. The housing structure includes a planar peripheral region surrounding seats that protrude and extend at least partly into the through-opening. Magnetic elements are arranged in the seats, with the magnetic elements configured to generate a test magnetic field for testing operation of the micro-electro-mechanical device.

A system for testing a device under a high gravitational force including a centrifuge with a rotating member and method of operation thereof. An operating power can be applied to a device, which can be coupled to the rotating member. The system can include a rotational control that can be coupled to the centrifuge. This rotational control can be configured to rotate the rotating member in response to a controlled number of revolutions per time period. The system can also include an analysis device for monitoring one or more signals from the device with respect to the controlled number of revolutions per time period. The analysis device can be configured to determine a stiction force associated with the DUT (Device Under Test) in response to the time-varying gravitational forces and to the one or more signals from the DUTs.

A method of testing sensors includes providing a test sheet that includes a plurality of sensor assemblies, a plurality of test pads, and traces extending from the sensor assemblies to the plurality of test pads. A sensor is positioned on each sensor assembly. Each sensor is connected to the sensor assembly with wire bonds. An enclosure is formed over the plurality of sensor assemblies. An electrical signal is detected from each of the plurality of sensor assemblies at the test pads.

The present disclosure provides a semiconductor structure includes a sensing element configured to receive a signal from a sensing target, a molding surrounding the sensing element, a through via in the molding, a front side redistribution layer disposed at a front side of the sensing element and electrically connected thereto, and a back side redistribution layer disposed at a back side of the sensing element, the front side redistribution layer and the back side redistribution layer are electrically connected by the through via. The present disclosure also provides a method for manufacturing the semiconductor structure described herein.