Patent classifications
B81C99/008
MEMS DEVICES HAVING TETHERING STRUCTURES
The present disclosure relates to a method for fabricating a micro-electromechanical system (MEMS) device. In the method, a carrier wafer is received. A MEMS wafer, which includes a plurality of die, is bonded to the carrier wafer. A cavity is formed to separate an upper surface of the carrier wafer from a lower surface of a die of the MEMS wafer. A separation trench is formed to laterally surround the die, wherein formation of the cavity and the separation trench leaves a tethering structure suspending the die over the upper surface of the carrier wafer. The die and carrier wafer are translated with respect to one another to break the tethering structure and separate the die from the carrier wafer.
METHOD FOR FABRICATION OF A TIMEPIECE PROVIDED WITH A MULTI-LEVEL EXTERIOR ELEMENT
A method for fabrication of a piece including, superposing an electrically insulating layer including a first orifice, an additional layer including a first aperture, an intermediate layer including a first hole, and a base layer surmounted by a base motif, depositing a metal layer, so that at the end of this step, the metal layer forms a shell covering electrically conductive walls of the base motif, of the first orifice, of the first aperture and of the first hole, and includes a lateral area resting on the insulating layer, dissolving the insulating layer, coating the metal or alloy layer with a volume formed by a base material of the piece, so that the volume conforms to the shapes of the metal layer.
SYSTEMS AND METHODS FOR CONTROLLING RELEASE OF TRANSFERABLE SEMICONDUCTOR STRUCTURES
The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
Systems and methods for controlling release of transferable semiconductor structures
The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 1 1). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
Crystalline magnetic layer to amorphous substrate bonding
Various methods for attaching a crystalline write pole onto an amorphous substrate and the resulting structures are described in detail herein. Further, the resulting structure may have a magnetic moment exceeding 2.4 Tesla. Still further, methods for depositing an epitaxial crystalline write pole on a crystalline seed or template material to ensure that the phase of the write pole is consistent with the high moment phase of the template material are also described in detail herein.
FABRICATION AND SELF-ALIGNED LOCAL FUNCTIONALIZATION OF NANOCUPS AND VARIOUS PLASMONIC NANOSTRUCTURES ON FLEXIBLE SUBSTRATES FOR IMPLANTABLE AND SENSING APPLICATIONS
Methods for fabricating flexible substrate nanostructured devices are disclosed. The nanostructures comprise nano-pillars and metallic bulbs or nano-apertures. The nanostructures can be functionalized to detect biological entities. The flexible substrates can be rolled into cylindrical tubes for detection of fluidic samples.
Method of making a corrugated deflection diaphragm
A removable material is deposited or otherwise applied to a flat substrate surface in a pattern corresponding to desired corrugations in a membrane, e.g., a deflection diaphragm. The applied material serves as a scaffold for a polymeric material, which is applied thereover, and following cure or hardening, the polymeric material is removed to form a finished corrugated membrane.