A fine concavo-convex structure product (10) is provided with an etching layer (11), and a resist layer (12) comprised of a heat-reactive resist material for dry etching provided on the etching layer (11), a concavo-convex structure associated with opening portions (12a) formed in the resist layer (12) is formed in the etching layer (11), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 m, a pattern depth H of the fine pattern ranges from 1 nm to 10 m, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.

The present invention relates to a method of forming an imprint on a metal substrate. The method comprises a step of providing a mold having a defined imprint surface pattern in the nano-sized or micro-sized range and a step of pressing the metal substrate against the mold at hot-working temperature to form a nano-sized or micro-sized imprint thereon.

In a general aspect, an apparatus can include a substrate and a post disposed on the substrate. The post can include a plurality of nanotubes and extend substantially vertically from the substrate. The post can have an aspect ratio of a height of the post to a diameter of the post of greater than or equal to 25:1.

A fine concavo-convex structure product (10) is provided with an etching layer (11), and a resist layer (12) comprised of a heat-reactive resist material for dry etching provided on the etching layer (11), a concavo-convex structure associated with opening portions (12a) formed in the resist layer (12) is formed in the etching layer (11), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 m, a pattern depth H of the fine pattern ranges from 1 nm to 10 m, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.

A fine concavo-convex structure product (10) is provided with an etching layer (11), and a resist layer (12) comprised of a heat-reactive resist material for dry etching provided on the etching layer (11), a concavo-convex structure associated with opening portions (12a) formed in the resist layer (12) is formed in the etching layer (11), a pattern pitch P of a fine pattern of the concavo-convex structure ranges from 1 nm to 10 m, a pattern depth H of the fine pattern ranges from 1 nm to 10 m, and a pattern cross-sectional shape of the fine pattern is a trapezoid, a triangle or a mixed shape thereof. The heat-reactive resist material for dry etching has, as a principal constituent element, at least one species selected from the group consisting of Cu, Nb, Sn, Mn, oxides thereof, nitrides thereof and NiBi.

A method for manufacturing a micromechanical timepiece part starting from a silicon-based substrate, including, forming pores on the surface of at least one part of a surface of said silicon-based substrate of a determined depth, entirely filling the pores with a material chosen from diamond, diamond-like carbon, silicon oxide, silicon nitride, ceramics, polymers and mixtures thereof, in order to form, in the pores, a layer of the material of a thickness at least equal to the depth of the pores. A micromechanical timepiece part including a silicon-based substrate which has, on the surface of at least one part of a surface of the silicon-based substrate, pores of a determined depth, the pores being filled entirely with a layer of a material chosen from diamond, diamond-like carbon, silicon oxide, silicon nitride, ceramics, polymers and mixtures thereof, of a thickness at least equal to the depth of the pores.

A method for fabricating an imprint master 1 comprises a first forming step of forming micro-protrusion-and-recess structures 23 having a first average pitch on one surface of a substrate 10 and a second forming step of forming main recesses 21 or main protrusions 22 having a second average pitch larger than the first average pitch on the one surface of the substrate 10 having the micro-protrusion-and-recess structures 23 formed thereon, in a manner maintaining a shape of at least a portion of the micro-protrusion-and-recess structures 23 in the main recesses 21 or the main protrusions 22 while the main recesses 21 or the main protrusions 22 are being formed.

A method of forming a microstructured surface includes the operations of depositing electrodes on a surface of a substrate and securing a mold against the surface of the substrate containing the electrodes with a tight contact with the electrodes, the mold containing a plurality of cavities therein. Pressure is applied between the mold and the substrate to force material from the substrate into the plurality of cavities around the electrodes to form a plurality of microfeatures. The mold is separated from the substrate.

In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and/or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.

Laminated microfluidic structures and methods for manufacturing the same are provided. In some instances, a laminated microfluidic structure is provided which includes a distended region having a sipper port at the bottom and an internal channel that fluidically connects the sipper port to a location outside of the distended region. Thermoforming and/or injection molding techniques for manufacturing such laminated microfluidic structures are provided. In other instances, a laminated microfluidic structure may be co-molded with a polymeric material to produce an integrated laminated microfluidic structure and housing.