Materials and methods of making have been developed for mass production of thermoplastic microfluidic chips. An elastomer diaphragm with a stress relieving feature can be used in microfluidic valves, pump diaphragms, and diaphragm micropumps. An optimized pump chamber design for complete fluid displacement and chamber geometry are provided. Microfluidic pressure regulators use a pneumatically actuated elastic membrane in a back-pressure regulator configuration. Microfluidic accumulators store pressurized fluid in a microfluidic chip. Removable caps for cell culture and a quick release top are described. Methods to incorporate hydrogels and ECM scaffolds have been developed. Electro pneumatic manifolds connect and control of multiple microfluidic devices vertically or on a rotary mechanism.

A method for producing damper structures on a micromechanical wafer. The method includes: providing an at least partially UV-transparent master mold for molding damper structures; inserting and pressing a micromechanical wafer into the master mold so that micromechanical structures in the wafer are aligned in relation to the damper structures; filling the master mold with UV-curing LSR and subsequent UV irradiation; and mold release and removal of the connected structure of the micromechanical wafer with attached dampers. A method for producing a singulated MEMS chip comprising a UV-cured damper is also described.

A semiconductor element is formed in a mesa portion of a semiconductor substrate. A cavity is formed in a working surface of the semiconductor substrate. The semiconductor substrate is brought in contact with a glass piece made of a glass material and having a protrusion. The glass piece and the semiconductor substrate are arranged such that the protrusion extends into the cavity. The glass piece is bonded to the semiconductor substrate. The glass piece is in-situ bonded to the semiconductor substrate by pressing the glass piece against the semiconductor substrate. During the pressing a temperature of the glass piece exceeds a glass transition temperature and the temperature and a force exerted on the glass piece are controlled to fluidify the glass material and after re-solidifying the protrusion completely fills the cavity.

The present invention discloses polymer surfaces with T-shaped microstructure and their fabrication method and applications. The polymer surfaces with the T-shaped microstructure are characterized in that T-shaped microposts arrange orderly on them, and nanobulges arrange orderly on the top surfaces of the micronails of the T-shaped microposts. A flexible insert is designed and manufactured according to the geometry of the T-shaped microposts, and nanogrooves are manufactured on the cavity surface of an injection mold according to the geometry of the nanobulges on the top surfaces of the micronails. The flexible insert is mounted on the injection mold cavity. An injection molding machine is used to inject the molten polymer into the injection mold cavity. Then the polymer surfaces with the T-shaped microposts, on the top surfaces of the micronails of which the nanobulges arrange orderly, are molded. The polymer surfaces with the T-shaped microstructure exhibit robust Cassie-Baxter state and moderate surface adhesion to water droplets, and can be used for quantitative collection, lossless transportation or micromixing of microdroplets.

Method for manufacturing fine hollow protruding tool by: bringing a projecting mold part with a heating means into contact from one surface side of a base sheet including a thermoplastic resin, and, while heat-softening the contact section, inserting the projecting mold part into the base sheet, to form a protrusion protruding from the other surface side; and, after a cooling step, withdrawing the projecting mold part from the interior of the protrusion, forming the fine hollow protruding tool. In the protrusion forming step, the protrusion is formed by using a first warp-suppressing means that suppresses warping of the base sheet when the projecting mold part is inserted into the base sheet. In the release step, the fine hollow protruding tool is formed by using a second warp-suppressing means that suppresses warping of the base sheet when the projecting mold part is withdrawn from the interior of the protrusion.

A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.

A microfluidic device includes a microfluidic channel formed in the microfluidic device and defined by a floor and a ceiling positioned vertically above the floor, wherein the microfluidic channel includes at least one fluid inlet configured to receive a fluid flow and at least one fluid outlet, and wherein at least one of the ceiling and the floor of the microfluidic channel is sloped relative to a horizontal plane.

Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.

The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

The present invention relates to a method for producing a molded body (10), comprising the following steps: a) providing a molding tool (40) which has at least one receptacle (12) in which at least one material (30) which comprises at least one shape-memory material (31) is introduced, wherein the shape-memory material (31) is present in a first state (111), wherein the material (30) at least partially fills the receptacle (12) of the molding tool (40) in such a manner that said material adjoins at least one surface of the receptacle (12); b) creating a molded body (10) in the receptacle (12) of the molding tool (40) from the material (30), wherein the shape-memory material (31) is present in a second state (112), wherein a form (11) is embossed into the molded body (10) during the second state (112); c) transferring the shape-memory material (31) to a third state (113), wherein the molded body (10) can be deformed during the third state (113) in such a manner that the molded body (10) is demolded from the receptacle (12) of the molding tool (40); and d) at least partially restoring the form (11) of the molded body (10) by transferring the shape-memory material (31) to a fourth state (114), wherein the molded body (10) at least partially resumes the form (11) according to step b) during the fourth state (114).