According to the invention there is provided a method of producing a structure comprising the steps of: a) providing a substrate comprising one or more features that correspond to the shape of the structure to be produced, wherein the one or more features comprise a hydrophobic polydimethylsiloxane (PDMS) surface; b) exposing at least a part of the hydrophobic PDMS surface to a plasma so that the part of the hydrophobic PDMS surface that is exposed to the plasma forms a hydrophilic PDMS surface; c) depositing a seed layer onto the hydrophilic PDMS surface by electroless deposition; d) depositing one or more metallic layers onto the seed layer by electrochemical deposition to form the structure; and e) removing the structure from the substrate.

Method of manufacturing a micromechanical component intended to cooperate with another micromechanical component, the method comprising the steps of providing a substrate, forming a mould on said substrate, said mould defining sidewalls arranged to delimit said micromechanical component, providing particles on at least said sidewalls, depositing a metal in said mould so as to form said micromechanical component, and liberating said micromechanical component from said mould and removing said particles.

Method for manufacturing a horology component, including manufacturing (E1) a first structure (10) from a first photosensitive resin (31) having at least one layer of photosensitive resin having a first pattern obtained by polymerizing the first photosensitive resin by irradiation through at least one mask (4), then developing the first photosensitive resin; and transforming (E2) the first structure (10) into a second structure (1) by structuring at least one surface of the first structure by the addition of a second photosensitive resin (32) to the at least one surface, the second structure (1) being intended to at least partially form a manufacturing mold for the horology component.

The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.

Process for manufacturing a hybrid timepiece component, comprising structuring at least one wafer (14) of a first micromachinable material so as to form at least one through-opening (15) within the wafer (14), said structured wafer (14) being intended to form a first part (4) of the hybrid timepiece component; and depositing a metal by electroforming, so that the metal extends through the through-opening (15) and over the two upper and lower faces of the wafer (14) as a single piece resulting from one and the same electroforming step, the electroformed metal being intended to form a second part (8) of the hybrid timepiece component.

According to one embodiment, a method of manufacturing a microchannel includes coating a silicone resin onto a mold corresponding to a microchannel and a first opening communicating with the microchannel, curing the silicone resin by light using a mask having a light shielding portion corresponding to the first opening, removing an uncured silicone resin, and releasing the cured silicone resin from the mold.

The invention relates to a method of manufacturing of a microneedle array comprising the steps of selecting a soft production mold comprising a set of microscopic incisions defining geometry of the microneedles, said soft production mold being capable of providing the microneedle array integrated into a base plate; using a filler material for abundantly filling the microscopic incisions of the soft production mold thereby producing the microneedle array with pre-defined geometry integrated into the base plate; wherein for the filler material a water or alcohol based ceramic or polymer-ceramic slurry is selected. The invention further relates to a microneedle array 16, a composition comprising a microneedle array, a system for enabling transport of a substance through a barrier and a system for measuring an electric signal using an electrode.

A method of fabricating a nozzle that includes casting and curing a first material using a patterned nip roller to form a first microstructured pattern of discrete microstructures, deforming at least one of the discrete microstructures; replicating the first microstructured pattern, including the at least one deformed discrete microstructure, in a second material different than the first material to make a replicated structure comprising a plurality of blind holes formed in the second material, removing second material of the replicated structure to expose tops of microstructures in the first microstructured pattern, and removing the first material from the replicated structure, resulting in a nozzle having a plurality of through-holes in the second material and corresponding to the first microstructured pattern.

A flexible patch pump for controllable accurate subcutaneous delivery of one or more medicaments to a patient includes a laminated layered structure. The pump may have a rigid reservoir layer including a number of rigid reservoirs disposed in a flexible material; a flexible microfluidic layer including a compliant membrane for sealing the rigid reservoirs, a network of microfluidic channels connecting the rigid reservoirs, and a number of inlet and/or outlet valves corresponding to the rigid reservoirs; and a flexible-rigid electronic circuit layer including a number of individually-addressable actuators. In operation, the rigid reservoirs may contain medicament that is dispensed in precise volumes at appropriate times due, for example, to a pressure change in an addressed reservoir caused by displacement of the compliant membrane or other actuation element.

Process for manufacturing a hybrid timepiece component, comprising structuring at least one wafer (14) of a first micromachinable material so as to form at least one through-opening (15) within the wafer (14), said structured wafer (14) being intended to form a first part (4) of the hybrid timepiece component; and depositing a metal by electroforming, so that the metal extends through the through-opening (15) and over the two upper and lower faces of the wafer (14) as a single piece resulting from one and the same electroforming step, the electroformed metal being intended to form a second part (8) of the hybrid timepiece component.