A microfluidic valve comprising an adhesive tape, an outlet disposed at one end of a first microfluidic channel, an inlet disposed at one end of a second microfluidic channel, wherein the inlet and the outlet are disposed in a proximity to each other, wherein the adhesive tape covers both the outlet and the inlet. A method of operating the microfluidic valve is also disclosed.

In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.

A method of manufacturing a MEMS device comprising a main body and a protrusion. To provide a generic method of manufacturing a protrusion with reduced vulnerability, the method includes creating a recess in a wafer substrate, said recess having an upper recess section and a lower recess section. The upper recess section is created using anisotropic etching and the lower recess section is formed using corner lithography followed by directional etching. Finally, a filler material is introduced in the recess and at least part of the wafer substrate material is removed so as to expose the filler material introduced in the recess. Additionally, the method allows for the batch-wise production of protrusions having oblique ends.

A wearable glove for interacting with virtual objects in an artificial-reality environment is described herein. The wearable glove comprises a matrix made of an elastic polymer, the matrix including a plurality of voids, each respective void (i) including at least one fluidic actuator and ii) not being fluidically coupled with a positionally adjacent void of the plurality of voids included in the matrix. The wearable glove further comprises at least one fluidic control device coupled to the at least one fluidic actuator. The at least one fluidic control device provides (i) a first fluid pressure to the at least one fluidic actuator, which causes the at least one fluidic actuator to enter a high-pressure state and (ii) a second fluid pressure to the at least one fluidic actuator, which causes the at least one fluidic actuator to enter a low-pressure state.

In one example, an electronic device can comprise (a) a first substrate comprising a first encapsulant extending from the first substrate bottom side to the first substrate top side, and a first substrate interconnect extending from the substrate bottom side to the substrate top side and coated by the first encapsulant, (b) a first electronic component embedded in the first substrate and comprising a first component sidewall coated by the first encapsulant, (c) a second electronic component coupled to the first substrate top side, (d) a first internal interconnect coupling the second electronic component to the first substrate interconnect, and (e) a cover structure on the first substrate and covering the second component sidewall and the first internal interconnect. Other examples and related methods are also disclosed herein.

In a method for manufacturing a micro vibration body having a three-dimensional curved surface, a mold defining a recess part is prepared, and a plate-shaped reflow material is arranged on the mold so as to cover the recess part. Pressure of a space defined by the recess part covered with the reflow material is reduced, and the reflow material is deformed by heating from an upper surface side opposite to a lower surface facing the recess part and by means of the pressure reduced. When the reflow material is deformed, a part of the mold is heated and/or cooled. As another example, when the reflow material is deformed, a mold having a different heat capacity portion is used to generate a temperature gradient in the mold.