B81C2201/056

DEVICE ENCAPSULATION USING PHYSICAL VAPOR DEPOSITION

A method includes forming a microelectromechanical system (MEMS) device wherein the MEMS device includes a cavity and one or more release holes extending from a surface of the MEMS device to the cavity, and sealing at least a portion of the MEMS device including the one or more release holes with a film utilizing a physical vapor deposition (PVD) process.