A microelectromechanical system (MEMS) sensor package includes a laminate that provides physical support and electrical connection to a MEMS sensor. A resin layer is embedded within an opening of the laminate and a MEMS support layer is embedded within the opening by the resin layer. A MEMS structure of the MEMS sensor is located on the upper surface of the MEMS support layer.

A microelectromechanical device includes a substrate, a first structural layer, and a second structural layer of semiconductor material. A sensing mass extends in the first structural layer and is coupled to the substrate by first elastic connections to enable oscillation of the sensing mass in a sensing direction perpendicular to the substrate by a maximum amount relative to a resting position of the sensing mass. An out-of-plane stopper structure includes an anchorage fixed to the substrate and a mechanical end-of-travel structure, which extends in the second structural layer, faces the sensing mass, and is separated therefrom by a gap having a width smaller than the maximum displacement distance of the sensing mass. The mechanical end-of-travel structure is coupled to the anchorage by second elastic connections that enable movement of the mechanical end-of-travel structure in the sensing direction in response to an impact of the sensing mass.

In described examples, a bondline structure is arranged along a periphery of a cavity. The bondline structure extends from a first substrate and is configured to bond with an interposer arranged on a second substrate. A diffusion barrier is arranged on the first substrate for contacting the interposer. The diffusion barrier is arranged to impede a contaminant against migrating from the bondline structure and entering the cavity.

A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate having a first surface and a second surface arranged opposite to the first surface; a stress-sensitive sensor disposed at the first surface of the substrate, where the stress-sensitive sensor is sensitive to mechanical stress; a stress-decoupling trench that has a vertical extension that extends from the first surface into the substrate, where the stress-decoupling trench vertically extends partially into the substrate towards the second surface although not completely to the second surface; and a plurality of particle filter trenches that vertically extend from the second surface into the substrate, wherein each of the plurality of particle filter trenches have a longitudinal extension that extends orthogonal to the vertical extension of the stress-decoupling trench.

A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.

An encapsulation chip manufacturing method includes forming first and second dicing grooves in a surface of a cap wafer and aligning the cap wafer and a device substrate such that the surface of the cap wafer faces a surface of the device substrate. The device substrate includes a device affixed to the surface and a bond pad on the surface and coupled to the device. The cap wafer is bonded to the device substrate and partially diced at the first and second dicing grooves such that the bond pad is exposed. Aligning the cap wafer and the device substrate includes aligning the first and second dicing grooves between the bond pad and a bonding area at which the cap wafer is bonded to the device substrate. A width of the first and second dicing grooves prevents cap wafer dust formed during the partial dicing from falling on the bond pad.

The present disclosure relates to a micro-electromechanical system (MEMS) structure including one or more semiconductor devices arranged on or within a first substrate and a MEMS substrate having an ambulatory element. The MEMS substrate is connected to the first substrate by a conductive bonding structure. A capping substrate is arranged on the MEMs substrate. The capping substrate includes a semiconductor material that is separated from the first substrate by the MEMS substrate. One or more conductive polysilicon vias include a polysilicon material that continuously extends from the conductive bonding structure, completely through the MEMS substrate, and to within the capping substrate. The semiconductor material of the capping substrate covers opposing sidewalls of the polysilicon material and an upper surface of the polysilicon material that is between the opposing sidewalls.

The present disclosure provides a micro electro mechanical system (MEMS) structure, including a device substrate having a first region and a second region different from the first region, a capping substrate bonded over the device substrate, a first cavity in the first region and between the device substrate and capping substrate, wherein the first cavity has a first cavity pressure, a second cavity in the second region and between the device substrate and capping substrate, wherein the second cavity has a second cavity pressure lower than the first cavity pressure, an outgassing material, wherein the outgassing material includes a top surface and a sidewall exposed to the first cavity, the outgassing material is free from being in direct contact with the capping substrate, wherein the outgassing material includes a trench, and a passivation layer disposed over the device substrate, and is in direct contact with the outgassing material.

The present invention relates to the field of medical devices, and specifically to a packaging structure and a packaging method for a retinal prosthesis implanted chip, including a high-density stimulation electrode component processed by a glass substrate, wherein the stimulation electrode component comprises the glass substrate, and a plurality of stimulation electrodes and a pad structure provided on the glass substrate; the stimulation electrodes are formed through cutting out metal pins on the metal and then pouring with glass; the stimulation electrode component is connected to an ASIC chip; a glass packaging cover is covered on the ASIC chip, the glass packaging cover is provided with a metal feedthrough structure for communicating with the stimulation chip; and the packaging cover covers and encapsulates the pad structure. In the packaging structure of the present invention, the substrate and the packaging cover are both made of a glass material, and thereby enable manufacture of a high-density stimulation electrode array, and the metal feedthrough structure is directly used on the glass cover, which facilitates wiring and achieves good sealing performance of the package cover.

The invention relates to a sensing module and a manufacturing method thereof, which firstly provides a transparent substrate, and then a sensor, a colloid, and an optical cover body disposed on a first surface of the transparent substrate. The colloid is surrounded the encrypted chip and is connected with the transparent substrate and the optical cover. Finally, a light source irradiates the colloid through a second surface of the transparent substrate to cure the colloid for obtaining the sensing module.