Method for manufacturing a micro-electro-mechanical system, MEMS, integrating a first MEMS device and a second MEMS device. The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.

The present disclosure describes a process for making a three-dimensional (3D) package, which starts with providing a mold precursor module that includes a first device die and a floor connectivity die (FCD) encapsulated by a mold compound. The FCD includes a sacrificial die body and multiple floor interconnections underneath the sacrificial die body. Next, the mold compound is thinned down until the sacrificial die body of the FCD is completely consumed, such that each floor interconnection is exposed through the mold compound. The thinning down step does not affect a device layer in the first device die. A second device die, which includes a die body and multiple electrical die interconnections, is then mounted over the exposed floor interconnections. Herein, each electrical die interconnection is vertically aligned with and electrically connected to a corresponding floor interconnection from the FCD.

Embodiments of the disclosure provide methods for microfabricating an omni-view peripheral scanning system. One exemplary method may include separately fabricating a reflector and a scanning MEMS mirror, and then bonding the microfabricated reflector with the scanning MEMS mirror to form the omni-view peripheral scanning system. The microfabricated reflector may include a cone-shaped bottom portion, and a via hole across the cone-shaped bottom portion. The microfabricated scanning MEMS mirror may include a MEMS actuation platform and a scanning mirror supported by the MEMS actuation platform. The scanning MEMS mirror may face the cone-shaped bottom portion of the reflector when forming the omni-view peripheral scanning system.

The present disclosure relates to a microelectromechanical systems (MEMS) package featuring a flat plate having a raised edge around its perimeter serving as an anti-stiction device, and an associated method of formation. A CMOS IC is provided having a dielectric structure surrounding a plurality of conductive interconnect layers disposed over a CMOS substrate. A MEMS IC is bonded to the dielectric structure such that it forms a cavity with a lowered central portion the dielectric structure, and the MEMS IC includes a movable mass that is arranged within the cavity. The CMOS IC includes an anti-stiction plate disposed under the movable mass. The anti-stiction plate is made of a conductive material and has a raised edge surrounding at least a part of a perimeter of a substantially planar upper surface.

A micro-electrical-mechanical system (MEMS) assembly includes a stationary stage, a rigid stage, at least one flexure configured to slidably couple the stationary stage and the rigid stage, at least one flexible electrode coupled and essentially orthogonal to one of the stationary stage and the rigid stage, and at least one rigid electrode coupled and essentially orthogonal to the other of the stationary stage and the rigid stage.

The present application relates to structures for supporting mechanical, electrical and/or electromechanical components, devices and/or systems and to methods of fabricating such structures. The application describes a primary die comprising an aperture extending through the die. The aperture is suitable for receiving a secondary die. A secondary die may be provided within the aperture of the primary die.

A micro-electrical-mechanical system (MEMS) assembly includes a micro-electrical-mechanical system (MEMS) actuator configured to be coupled, on a lower surface, to a printed circuit board, an image sensor assembly coupled to an upper surface of the micro-electrical-mechanical system (MEMS) actuator, and a holder assembly coupled to and positioned with respect to the micro-electrical-mechanical system (MEMS) actuator.

A micro-electro-mechanical system (MEMS) package structure and a method for fabricating the MEMS package structure. The MEMS package structure includes a MEMS die (200) and a device wafer (100). A control unit and an interconnection structure (300) are formed in the device wafer (100), and a first contact pad (410) and an input-output connecting member (420) are formed on a first bonding surface (100a) of the device wafer (100). The MEMS die (200) is coupled to the first bonding surface (100a) through a bonding layer (500). The MEMS die (200) includes a closed micro-cavity (220) and a second contact pad (220). The first contact pad (410) is electrically connected to a corresponding second contact pad (220). An opening (510) that exposes the input-output connecting member (420) is formed in the bonding layer (500). The MEMS package structure allows electrical interconnection between the MEMS die (200) and the device wafer (100) with a reduced package size, compared to those produced by existing integration techniques. In addition, function integration ability of the package structure is improved by integrating a plurality of MEMS dies of the same or different structures and functions on the same device wafer.

Disclosed is a micro electrostatic motor that includes a body having a first and a second face and having a chamber. A first membrane is disposed over the first face of the body and a rotatable disk is disposed in the circular chamber about a member. The disk is disposed in the circular chamber and is free to rotate about the member. The disk has on a first surface thereof a set of three mutually electrically isolated electrodes, with each of the electrodes having a tab portion and being electrically isolated from the member. A second membrane is disposed over the second face of the body and a pair of spaced electrodes are provided on portions of the second membrane, with the pair of spaced electrodes being isolated by a gap between the pair of electrodes. A cylindrical shaped member is disposed in the chamber electrically isolated from the three mutually electrically isolated electrodes on the disc.

A substrate assembly includes a first substrate, a second substrate and a bonding member. The first substrate includes a first surface-modified region having a functionality different from that of a remainder region of the first substrate. The second substrate includes a second surface-modified region connected to the first surface-modified region through a physical interaction and having a functionality different from that of a remainder region of the second substrate. The first and second substrates cooperatively define a space therebetween. The bonding member is disposed within said space to bond said first and second substrates together. A method for bonding substrates is also disclosed.