The invention relates to a device (100) for supporting one or more MEMS components (160), comprising a base component (110), which substantially consists of a first material with a first coefficient of expansion ?.sub.1, an interposer (120), which is integrally bonded to the base component (110) in one or more first connection regions (140) and substantially consists of a second material with a second coefficient of expansion ?.sub.2, and a support substrate (130), which is integrally bonded to the interposer (120) in one or more second connection regions (150) and substantially consists of a third material with a third coefficient of expansion ?.sub.3, wherein the support substrate (130) is configured to support the one or more MEMS components (160), and for the coefficients of expansion the following holds true: ?.sub.1>?.sub.2??.sub.3, preferably ?.sub.1>?.sub.2=?.sub.3. The invention also relates to a system (105) comprising a device (100) according to the invention and the one or more MEMS components (160), and to a method for producing a device (100) according to the invention.

The invention relates to a method for producing optical components, wherein a first contact surface is formed by bringing a deformation element into contact with a carrier; and a second contact surface is formed by applying a functional element to the deformation element; said second contact surface at least partially overlapping the first contact surface, so that a deformation zone is formed by the area of the deformation element that lies between the overlapping areas of the two contact surfaces, wherein at least one portion of the deformation zone is heated and deformed in such a way that the functional element is deflected, in particular, shifts and/or tilts, and the functional element is joined with the deformation element during the process step of applying the functional element to the deformation element and/or during the process step of heating and deforming the deformation zone.

Provided is a method for bonding wafers, which can bond the wafers to each other with high reliability while reducing the influence on the wafers. The method for bonding wafers includes the steps of: preparing a first wafer that has, on the surface thereof, a first metal layer with a first rigidity modulus, and a second wafer that has, on the surface thereof, a second metal layer with a second rigidity modulus higher than the first rigidity modulus; removing an oxide film at the surface of the second metal layer while an oxide film at the surface of the first metal layer is not removed; and bonding the surface of the first wafer to the surface of the second wafer.

Provided are a laminate that can be used as a microchannel chip that maintains joint strength while also displaying good external appearance and having reduced risk of liquid leakage from a channel and a method for manufacturing the same. The laminate includes a channel-equipped substrate having a cycloolefin polymer as a material and a cover material having a cycloolefin polymer as a material that are joined via a joining agent having a mixture of two or more cycloolefin polymers as a material. A glass-transition temperature of the mixture of cycloolefin polymers that is a material of the joining agent is not less than 20 C. lower than both a glass-transition temperature of the cycloolefin polymer that is a material of the channel-equipped substrate and a glass-transition temperature of the cycloolefin polymer that is a material of the cover material and is not lower than 68 C. and not higher than 138 C.

An apparatus includes a first acoustic sensing resonator formed from a silicon substrate and has a first microelectromechanical system. The apparatus also includes a second acoustic sensing resonator formed from the silicon substrate and has a second microelectromechanical system. The second acoustic sensing resonator is arranged on the silicon substrate at a ninety degree (90) angle with respect to the first acoustic sensing resonator and together the first acoustic sensing resonator and second acoustic sensing resonator form a torque sensor. A high temperature bonding surface is connected to the torque sensor for directly connecting the torque sensor to a metal object.

A method for producing a first and second micromirror device. A silicon oxide layer is applied to at least the front side of a silicon wafer. The silicon oxide layer is removed so that a first and second separation region of the silicon oxide layer are generated, which are arranged spatially separated from each other along a separation plane. A silicon layer is applied to the front side of the silicon wafer and to the silicon oxide layer. An etching mask is applied to the rear side of the silicon wafer, the etching mask having a first opening along the separation plane of the first and second separation region. The silicon layer and the silicon wafer are removed, according to the etching mask on the rear side of the silicon wafer and according to the silicon oxide layer of the first and second separation region.