A process includes providing a reactor containing a compound of the formula SiO.sub.x, wherein 0x2, and receiving, at the reactor, fluorinated gas. The process also includes obtaining a gaseous mixture formed at an elevated temperature in the reactor and removing silicon tetrafluoride from the gaseous mixture. An apparatus includes a reactor containing a compound of the formula SiO.sub.x, wherein 0x2, a component for receiving fluorinated gas at the reactor, a heating element for heating the compound of the formula SiO.sub.x and the fluorinated gas in the reactor, and a separation component for removing silicon tetrafluoride from a gaseous mixture formed in the reactor. A process of semiconductor manufacturing includes defluorinating exhaust gas using the process. A system for semiconductor manufacturing includes a set of components for carrying out the process.

A processing system is provided for capturing and recycling process gases from semiconductor manufacturing operations. The system includes a process chamber configured to process a substrate and an exhaust system coupled to the process chamber and configured to remove process effluent from the process chamber. An abatement system including a first metal-organic framework (MOF) container is coupled downstream of the exhaust system, where the first MOF container is configured to capture a first gas species of the process effluent.

Systems and methods for recovery of gaseous substances from molten salt electrolysis are generally described. Certain systems comprise a cell configured for molten salt electrolysis; a collector fluidically connected to the cell and configured to collect volatilized molten salt from the cell; and a gas scrubber fluidically connected to the collector and configured to at least partially remove a gas from an effluent stream of the cell. Some methods comprise, using a pressure gradient: transporting a gas comprising molten salt vapor from an electrolytic cell to and through a collector such that at least a portion of the molten salt vapor forms a solid within the collector; and transporting some or all of the gas from the collector through a gas scrubber.

Embodiments include a method for reducing corrosion in a pump exhaust foreline of a processing system. The method begins with the operation of a plasma processing system and evacuating a fluorine or chlorine containing gas into a processing chamber exhaust foreline as effluent. The effluent is abated in a plasma abatement system with a hydrogen containing reagent in a vacuum environment. The abated effluent contains one or more of HF or HCl at vacuum pressure. A controller runs a program to determine if a condition for condensation of HCl or HF exist based on a characteristic, flow rate and pressure of the effluent. A non-condensable gas is injected into the effluent. The abated effluent is pumped to a pump exhaust foreline coupled to an outlet of the pump, wherein the pump exhaust foreline is at atmospheric pressure.