Patent classifications
B01D2257/2066
METHOD AND APPARATUS FOR RECYCLING HEPTAFLUOROISOBUTYRONITRILE
A method and device for purifying heptafluoroisobutyronitrile and a dilution gas from a used gas mixture comprising heptafluoroisobutyronitrile, a dilution gas and arcing by-products. The method comprising the steps of (a) contacting the used gas mixture with at least one adsorbent material to generate a gas stream depleted in arcing by-products; (b) contacting the gas stream depleted in by-products with a first membrane to obtain a first permeate stream rich in the dilution gas, and a first retentate stream rich in heptafluoroisobutyronitrile; (c) contacting the first permeate stream rich in the dilution gas with a second membrane to obtain a second permeate stream rich in the dilution gas and a second retentate stream rich in heptafluoroisobutyronitrile; and (d) combining the first and second retentate streams rich in heptafluoroisobutyronitrile.
Air filters comprising polymeric sorbents for reactive gases
An air filter including a filter support that supports polymeric sorbent particles. The polymeric sorbent is the reaction product of a divinylbenzene/maleic anhydride precursor polymeric material with a nitrogen-containing compound. The air filter may be used for capturing e.g. reactive gases.
COMPOSITIONS AND METHODS FOR REMOVAL OF PER- AND POLYFLUOROALKYL SUBSTANCES (PFAS)
The invention relates to composite compositions including a carbonaceous material and a photocatalyst. The invention includes compositions and various methods, including methods for removing one or more contaminants from a substance such as air, soil, and water.
PLASMA ABATEMENT TECHNOLOGY UTILIZING WATER VAPOR AND OXYGEN REAGENT
Implementations of the present disclosure relate to methods and systems for abating F-gases present in the effluent of semiconductor manufacturing processes. In one implementation, a method for abating effluent exiting a processing chamber is provided. The method begins by flowing an effluent from a processing chamber into a plasma source, wherein the effluent comprises one or more F-gases. The method further includes delivering at least one abating reagent to the plasma source, the abating reagent comprising at least one of water vapor and oxygen-containing gas, at operation. The method further includes activating the effluent and the abating reagent in the presence of a plasma to convert the one or more F-gases in the effluent and the abating reagent to an abated material.
GAS MANAGEMENT SYSTEM
A gas chamber supply system includes a gas source configured to fluidly connect to a gas chamber and to supply a gas mixture to the gas chamber, the gas source including: a pre-prepared gas supply including a gas mixture, the gas mixture including a plurality of gas components and lacking a halogen; a recycled gas supply including the gas mixture; and a fluid flow switch connected to the pre-prepared gas supply and to the recycled gas supply. The gas chamber supply also includes a control system configured to: determine if the relative concentration between the gas components within the recycled gas supply is within an acceptable range; and provide a signal to the fluid flow switch to thereby select one of the pre-prepared gas supply and the recycled gas supply to as the gas source based on the determination.
GAS MANAGEMENT SYSTEM
A gas recycle system includes a gas purifier system; a gas analysis system; a gas blending system that prepares a recycled gas mixture; and a control system configured to: determine whether a measured amount of at least one intended gas component is within a first range of acceptable values; and determine whether a measured amount of the at least one impurity gas component is within a second range of acceptable values. If the measured amount of the at least one intended gas component is not within the first range of acceptable values, the control system causes the gas blending system to add an additional gas component to the purified gas mixture to prepare the recycled gas mixture; and if the measured amount of the at least one impurity gas is not within the second range of acceptable values, the control system generates an error signal.
AIR FILTERS COMPRISING POLYMERIC SORBENTS FOR REACTIVE GASES
An air filter including a filter support that supports polymeric sorbent particles. The polymeric sorbent is the reaction product of a divinylbenzene/maleic anhydride precursor polymeric material with a nitrogen-containing compound. The air filter may be used for capturing e.g. reactive gases.
PERFLUOROALKYL AND POLYFLUOROALKYL SORBENT MATERIALS AND METHODS OF USE
Sorbent materials that are treated with ions, salts, oxides, hydroxides, or carbonates of calcium, magnesium, strontium, or barium are useful in removing perfluoroalkyl and polyfluoroalkyl substances (PFAS), perfluorooctanoic acid (PFOA), perfluorooctanesulfonic acid (PFOS), 2,3,3,3,-tetrafluoro-2-(heptafluoropropoxy)propanoate and heptafluoropropyl 1,2,2,2-tetrafluoroethyl ether, and similar compounds from liquids and gases are disclosed. The sorbent materials with the disclosed treatments offer improved performance as measured against untreated sorbent materials.
SYSTEMS AND METHODS FOR IMPROVED WASTE GAS ABATEMENT
The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C.sub.2F.sub.6) and tetrafluoromethane (CF.sub.4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH.sub.4) and tetraethoxysilane (Si(OC.sub.2H.sub.5).sub.4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems. More particularly, and in one preferred embodiment, the present disclosure is directed to a waste gas abatement system that utilizes a combination of non-combustible and combustible gases (or gas mixtures) for thermal combustion, which are directed through multiple permeable interior surfaces of a reaction chamber, efficiently combusting waste gas and preventing undesirable accumulation of solid particulate matter on the chamber surfaces.
Systems and methods for improved waste gas abatement
The present disclosure generally relates to systems and methods for the combustive abatement of waste gas formed during the manufacture of semiconductor wafers. In particular, the systems described herein are capable of combusting air-polluting perfluorocarbons, including those having high greenhouse gas indexes such as hexafluoroethane (C.sub.2F.sub.6) and tetrafluoromethane (CF.sub.4), as well as particulate-forming silicon dioxide precursors, such as silane (SiH.sub.4) and tetraethoxysilane (Si(OC.sub.2H.sub.5).sub.4, abbreviated TEOS), with greater efficiency and lower energy usage than prior abatement systems. More particularly, and in one preferred embodiment, the present disclosure is directed to a waste gas abatement system that utilizes a combination of non-combustible and combustible gases (or gas mixtures) for thermal combustion, which are directed through multiple permeable interior surfaces of a reaction chamber, efficiently combusting waste gas and preventing undesirable accumulation of solid particulate matter on the chamber surfaces.