Patent classifications
B01J2203/0685
CUTTING ELEMENTS FORMED USING LIQUID HYDROCARBONS AND HYDRATED HYDROCARBONS, AND EARTH-BORING TOOLS COMPRISING SUCH CUTTING ELEMENTS
Methods of forming polycrystalline diamond include encapsulating diamond particles and a hydrocarbon substance in a canister, and subjecting the encapsulated diamond particles and hydrocarbon substance to a pressure and a temperature sufficient to form inter-granular bonds between the diamond particles. Cutting elements for use in an earth-boring tool includes a polycrystalline diamond material formed by such processes. Earth-boring tools include such cutting elements.
POLYCRYSTALLINE COMPACTS, EARTH-BORING TOOLS INCLUDING SUCH COMPACTS, AND METHODS OF FABRICATING POLYCRYSTALLINE COMPACTS
A polycrystalline compact includes diamond, cubic boron nitride, and at least one hard material, which may be aluminum nitride, gallium nitride, silicon nitride, titanium nitride, silicon carbide, titanium carbide, titanium boride, titanium diboride, and/or aluminum boride. The diamond, the cubic boron nitride, and the hard material are intermixed and interbonded to form a polycrystalline material. An earth-boring tool includes a bit body and a polycrystalline diamond compact secured to the bit body. Methods of fabricating polycrystalline compacts include forming a mixture comprising diamond, non-cubic boron nitride, and a metal or semimetal; encapsulating the mixture in a container; and subjecting the encapsulated mixture to high-pressure and high-temperature conditions to form a polycrystalline material.
Incorporation of bulk metal foils to increase toughness of polycrystalline diamond
A cutting element include a substrate and a diamond compact including at least two polycrystalline diamond portions separated by at least one metal carbide foil portion. The cutting element is made by placing diamond powder in a reaction container, placing a thin metal layer in the reaction container above or around the diamond powder and binder, placing additional diamond powder in the reaction container above or around the thin metal layer, and placing a pre-sintered substrate containing binder into the reaction container above all diamond powder and thin metal layer components. The assembled reaction container is put into a reactor and is subjected to a high-temperature high-pressure sintering process. The binder in the pre-sintered substrate sweeps through to sinter the first diamond portion, and then reacts with the thin metal layer to form a metal carbide, and then the binder continues to sweep through to sinter the second diamond portion.
Luminescent diamond and method of making the same
Luminescent diamond is made subjecting a volume of diamond grains and catalyst material to high-pressure/high-temperature (HPHT) conditions. A pressure apparatus and/or a pressure cell is specially configured to impose a differential or asymmetric pressure onto the diamond volume during the HPHT conditions. This subjects the diamond grains to differential strain that increases the degree of plastic deformation of the diamond grains to increase the formation of nitrogen vacancy centers. Diamond pellets formed by such process and subjected to differential pressure can have an aspect ratio, or an aspect ratio change, of greater than one. The temperature of the HPHT process is 1.800 C. or less to facilitate desired nitrogen migration to preferentially promote formation of NV centers over NVN and N3 centers in the diamond pellets to provide a degree of luminescence in a red wavelength spectrum greater than diamond pellets formed by some other HPHT processes.
Diamond sintered material and tool including diamond sintered material
A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 m and less than or equal to 50 m, and a dislocation density of the diamond grains is more than or equal to 8.110.sup.13 m.sup.2 and less than 1.010.sup.16 m.sup.2.