Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

A crystal oscillator is coupled to a digital automatic gain control (AGC) having oscillation detection and amplitude control loops. The oscillation detection loop may increase the transconductance (gm) of the oscillator transistor until oscillation is detected therefrom. Then the amplitude control loop detects the amplitudes of oscillations from the crystal oscillator, compares these amplitudes to high and low voltage references and generates digital signals to find a critical transconductance (gm) for an oscillator amplifier and control this gm to maintain a constant oscillation waveform amplitude therefrom. An up/down counter defines the servo control loop bandwidth/update-rate according to an update clock rate thereto. Loop stability is achieved when the control loop bandwidth is less than the start-up time required for the oscillation envelope of the crystal oscillator to grow for oscillation. An oscillator failure detector may also be provided.

An apparatus includes a manifold plate-like structure having two end regions and an opening located in the recessed region configured to allow fluid flow therethrough and a clamping device. The clamping device includes a first clamping block and a first mechanical fastener to couple the first clamping block and the manifold. The apparatus also includes a vibratory separator including a basket having support structure therein, the manifold coupled to the support structure with a clamping device. A pan is disposed above the manifold and coupled to the manifold and a screen is disposed on the pan. A pressure differential device is coupled to the manifold and configured to provide a pressure differential across the screen. A method includes coupling the manifold to the support structure, disposing the pan on the support structure, and coupling the pan to the manifold.

An apparatus includes a manifold plate-like structure having two end regions and an opening located in the recessed region configured to allow fluid flow therethrough and a clamping device. The clamping device includes a first clamping block and a first mechanical fastener to couple the first clamping block and the manifold. The apparatus also includes a vibratory separator including a basket having support structure therein, the manifold coupled to the support structure with a clamping device. A pan is disposed above the manifold and coupled to the manifold and a screen is disposed on the pan. A pressure differential device is coupled to the manifold and configured to provide a pressure differential across the screen. A method includes coupling the manifold to the support structure, disposing the pan on the support structure, and coupling the pan to the manifold.

Multiple wires run parallel to one another. Each of wires is spaced apart from each adjacent wire at a distance less than a width of an encased microchip. Each of the plurality of wires includes a plurality of straight segments in a plane and bent segments that connect two of the plurality of straight segments. For each of the wires, each bent segments includes a first end, a second end, and a curved portion curved away from the plane. The first end is connected to at least one of the straight segments and separated from the second end a distance greater than the width of the encased microchip. The curved portion includes a diameter greater than the width of the encased microchip.

An apparatus includes a manifold plate-like structure having two end regions and an opening located in the recessed region configured to allow fluid flow therethrough and a clamping device. The clamping device includes a first clamping block and a first mechanical fastener to couple the first clamping block and the manifold. The apparatus also includes a vibratory separator including a basket having support structure therein, the manifold coupled to the support structure with a clamping device. A pan is disposed above the manifold and coupled to the manifold and a screen is disposed on the pan. A pressure differential device is coupled to the manifold and configured to provide a pressure differential across the screen. A method includes coupling the manifold to the support structure, disposing the pan on the support structure, and coupling the pan to the manifold.