A method of processing a substrate may include preparing the substrate, polishing the substrate, and cleaning the substrate using a double nozzle, which is configured to provide a spray and a chemical solution onto the substrate. The spray may include a deionized water, and the chemical solution may be diluted with the deionized water. The chemical solution and the spray may be spaced apart from each other by a distance of 7 cm to 12 cm.

The invention includes a gas supplier for discharging a gas into a space sandwiched between a substrate and a shielding plate by supplying the gas to a gas discharge nozzle provided in the shielding plate to form a flow of the gas from a central part toward a radially outer side of the substrate. This gas supplier is controlled such that a flow velocity of the gas into a discharge space at a peripheral edge part of the substrate becomes larger than zero.

In processing a peripheral edge part of a substrate by a processing liquid, upward scattered liquid droplets may be produced. Accordingly, in the invention, the processing liquid is caused to land on the peripheral edge part of the substrate from a discharge port while the discharge port is positioned to a bevel processing position lower than an eaves part of a cup in a vertical direction with the peripheral edge part of the substrate covered vertically from above by the eaves part. Thus, the eaves part collects upward scattered liquid droplets. As a result, the re-adhesion of the upward scattered liquid droplets to the substrate and the scattering thereof to a surrounding atmosphere are suppressed.

The invention includes an upper sealing member fixed near a ceiling wall of a processing chamber and a lower sealing member provided movably in a vertical direction below the upper sealing member. A sealed space is formed by moving down the lower sealing member to a lower limit position where an upper end part of the lower sealing member is aligned or partially overlapped with a lower end part of the upper sealing member in the vertical direction. On the other hand, a conveyance space for carrying the substrate to and from a substrate holder is formed by moving up the lower sealing member to a retracted position above the lower limit position.

A single-substrate electroless (EL) plating apparatus including a workpiece chuck that is rotatable about rotation axis and inclinable about an axis of inclination. The chuck inclination may be controlled to a non-zero inclination angle during a dispense of plating solution to improve uniformity in the surface wetting and/or plating solution residence time across the a surface of a workpiece supported by the chuck. The angle of inclination may be only a few degrees off-level with the plating solution dispensed from a nozzle that scans over a high-side of the chuck along a radius of the workpiece while the chuck rotates. The angle of inclination may be actively controlled during dispense of the plating solution. The inclination angle may be larger at commencement of the plating solution dispense than at cessation of the dispense.

A method for plasma coating an object includes an object profile, having the steps of: a) manufacturing a replaceable shield comprising a jet inlet, a nozzle outlet and a sidewall extending from the jet inlet to the nozzle outlet, wherein the nozzle outlet includes an edge essentially congruent to at least part of the object profile; b) detachably attaching the replaceable shield to a jet outlet of a plasma jet generator; c) placing the object at the nozzle outlet such that the object profile fits closely to the nozzle outlet edge; d) plasma coating the object with a low-temperature, oxygen-free plasma at an operating pressure which is higher than the atmospheric pressure by providing a plasma jet in the shield via the plasma jet generator and injecting coating precursors in the plasma jet in the shield.

An apparatus for manufacturing golf balls each having an exterior pattern includes a conveying device and a spraying device. The spraying device is disposed at one side of a first processing area. The conveying device is configured to convey a ball-shaped body into the first processing area along a predetermined path, and to rotate the ball-shaped body at a predetermined speed. The spraying device includes a first sprayer and a second sprayer. The first sprayer and the second sprayer are configured to apply a color paint to the ball-shaped body from each of an upper position and a lower position.

The inventive concept provides a substrate treating apparatus. According to an embodiment, the substrate treating apparatus may include a liquid supply unit that supplies a treatment liquid onto a to-be-treated surface of the substrate, and the liquid supply unit may include a support shaft spaced apart from the spin chuck by a specific distance, and extending to have a specific length in a direction that is perpendicular to a ground surface, a nozzle support, one end of which is coupled to an upper end of the support shaft, and extending to have a specific length in a direction that is parallel to the ground surface, a nozzle installed at an opposite end of the nozzle support and that supplies the treatment liquid to the substrate, and a motion sensor that detects any one or more of a deflection, a distortion, and a vibration of the liquid supply unit.

Method and system for thermal transfer printing are disclosed. The system comprises a transfer member having an imaging surface on the front side, a coating station at which a monolayer of particles made of, or coated with, a thermoplastic polymer is applied to the imaging surface, an imaging station at which electromagnetic radiation (EM) is applied via the rear side of the transfer member to selected regions of the particles-coated imaging surface to render the particles thereon tacky within the selected regions, and a transfer station at which only the regions of the particles coating that have been rendered tacky are transferred to a substrate. The transfer member includes on its rear side a body transparent to EM radiation and on its front side an EM radiation absorbing layer, the imaging surface being formed on, or as part of, the absorbing layer.

An apparatus for treating a substrate includes a support unit that supports the substrate and a nozzle that dispenses liquid plasma to etch a film formed on the substrate supported on the support unit.