An example fluid applicator device includes an applicator assembly, and a reservoir assembly configured to store a fluid and is rotatable, relative to the applicator assembly, to control a valve mechanism that controls a flow of the fluid from the reservoir assembly to the applicator assembly, wherein the applicator assembly is configured to apply the fluid to a surface

A thin-film coating applicator assembly is disclosed for coating substrates in outdoor applications. The innovative thin-film coating applicator assembly is adapted to apply performance enhancement coatings on installed photovoltaic panels and glass windows in outdoor environments. The coating applicator is adapted to move along a solar panel or glass pane while applicator mechanisms deposit a uniform layer of liquid coating solution to the substrate's surface. The applicator assembly comprises a conveyance means disposed on a frame. Further disclosed are innovative applicator heads that comprise a deformable sponge-like core surrounded by a microporous layer. The structure, when in contact with a substrate surface, deposits a uniform layer of coating solution over a large surface.

A slot-die coating apparatus for manufacturing a patterned coating layer (3) on a substrate (1) comprises a substrate carrier (6), a coating device, a sensor facility (70) and a controller (80). The substrate carrier (6) is arranged on a support for providing the substrate (1). The coating device comprises a head-side unit and a support-side unit (50, 55; 52 resp.) that are mutually movable with respect to each other by a motor (52, 56). The head-side unit comprises a translator part (52) and a slot-die coating head (2). The support-side unit (55) comprises a stator part (56) of the motor. The controller (80) controls the motor (52) to position the slot-die coating head at a desired distance (Ds). The support-side unit (55) has a mass that is at least equal to the mass of the head-side unit (50), and the support-side unit (55) is flexibly coupled to the support (60).

The present invention relates to a slot die coating apparatus. A slot die coating apparatus according to an embodiment of the present invention includes: a slot die configured to perform a coating process by applying ink to a substrate; an image capturing unit disposed adjacent to the slot die and configured to capture a state of the slot die and a state of ink applied to the substrate during the coating process; and a control unit configured to compare an image captured by the image capturing unit with a reference image and control an operation of the slot die and a transfer of the substrate.

An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An applicator for dispensing adhesive is disclosed. The applicator includes a manifold, at least one dispensing module coupled to the manifold, a supply channel configured to contain at least a portion of the adhesive, a recirculation channel configured to contain at least a portion of the adhesive, and a recirculation pump assembly connected to the manifold. The recirculation pump assembly includes an inlet in fluid communication with the recirculation channel, an outlet in fluid communication with the supply channel, a gear assembly, and a drive motor coupled to the gear assembly and operable to pump the adhesive, where the drive motor is configured to operate at an adjustable number of revolutions per minute (RPM). The recirculation pump assembly can be configured to move at least a portion of the adhesive from the recirculation channel to the supply channel, such that a first pressure of the adhesive in the recirculation channel is substantially equal to a second pressure of the adhesive in the supply channel.

An applicator for dispensing adhesive and a method of diverting flow in an applicator are disclosed. The applicator includes a plurality of pump assemblies each having an inlet and an outlet, a plurality of dispensing modules each having an inlet, and a flow diverter plate in fluid communication with the plurality of pump assemblies. The flow diverter plate defines a body having a first surface in fluid communication with the plurality of pump assemblies, a second surface opposite the first surface in fluid communication with the plurality of dispensing modules, and a plurality of diverter passages extending from the first surface to the second surface. Each of the plurality of diverter passages has a first opening on the first surface and a second opening on the second surface, and the first opening is in fluid communication with the outlet of one of the plurality of pump assemblies, and the second opening is in fluid communication with the inlet of at least one of the plurality of dispensing modules.

A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

An embodiment of the present disclosure is an applicator for dispensing adhesive onto a substrate. The applicator includes a manifold and at least one dispensing module coupled to the manifold. The applicator may include a least one pump assembly removably mounted the manifold. Each pump assembly having an outlet in flow communication with the manifold, and an inlet in flow communication with the adhesive. The pump assembly includes a gear assembly for pumping adhesive from said inlet to said outlet and a drive motor with a drive shaft connected to the gear assembly. The drive motor has a shaft with an axis that intersects said front surface of the pump assembly. In another example, the shaft has an axis that does not intersect both of a first side and a second side of said manifold.

There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.