A method and apparatus for coating an electrode is disclosed herein. In some embodiments, an apparatus for coating an electrode slurry includes a coating die configured to coat an electrode slurry on one surface of a current collector, a thickness measuring sensor spaced apart from the current collector by a predetermined interval and configured to measure a thickness of the coated electrode slurry in real time after coating by the coating die; and a controller which controls a coated amount of the electrode slurry in real time according to the measured thickness.

A method includes receiving a model of the material dispenser and, at a first characterization period of a material bead dispensing operation, communicating, to the material dispenser, a first characterization flow rate input. The method also includes, at a second characterization period of the material bead dispensing operation, communicating, to the material dispenser, a second characterization flow rate input. The method also includes generating, using at least one sensor, three-dimensional data associated with a material bead corresponding to the material bead dispensing operation. The method also includes characterizing at least one parameter of the model of the material dispenser using at least the first characterization flow rate input, the second characterization flow rate input, and the three-dimensional data associated with the material bead.

Disclosed is droplet ejecting apparatus that ejects droplets of a functional liquid onto a workpiece to draw a pattern. The droplet ejecting apparatus includes: a workpiece table; a droplet ejecting head configured to eject the droplets onto the workpiece placed on the workpiece table; a movement mechanism configured to relatively move the workpiece table and the droplet ejecting head in a main scanning direction and a sub-scanning direction; and a control unit configured to: detect a position of the workpiece or a position of the workpiece table while relatively moving the workpiece table and the droplet ejecting head along a plurality of scanning lines extending in the main scanning direction and set side by side in the sub-scanning direction; and create, based on a detection result, a correction table that indicates a correlation between a position of the movement mechanism and a positional correction amount of the workpiece table.

Systems and methods for controlling adhesive application are disclosed. The systems and methods may include a controller and one or more sensors configured to measure an amount of adhesive applied to a plurality of substrates by a pump, detect a number of the substrates, determine an amount of adhesive applied per substrate, compare the adhesive applied per substrate to a target value, and adjust a pressure of the pump based on the comparison. The sensor(s) may include one or more of a valve sensor coupled to an adhesive supply, a flow rate sensor coupled to a manifold, a flow rate sensor coupled to one or more hoses, and a flow rate sensors coupled to a gun.

A gravure coater test apparatus includes a gravure roll and a backup roll which are circumscribed to each other, a motor which drives the gravure roll partially submerged in a water-based pressure-sensitive adhesive for coating, a controller which adjusts the rotational speed of the motor, a doctor blade which is selected from a plurality of types to scrape the water-based pressure-sensitive adhesive from the surface of the gravure roll being rotated, and an infrared analyzer which allows at least one of the type of the water-based pressure-sensitive adhesive corresponding to the selected doctor blade, the uniformity of the coating surface, and the amount of the coated water-based pressure-sensitive adhesive to be confirmed.

A substrate processing apparatus 1 is configured to supply a processing liquid to a peripheral portion of a wafer W being rotated. The substrate processing apparatus 1 includes a rotating/holding unit 21 configured to rotate and hold the wafer W; a processing liquid discharging unit 73 configured to discharge the processing liquid toward the peripheral portion of the wafer W held by the rotating/holding unit 21; a variation acquiring unit configured to acquire information upon a variation amount of a deformation of the peripheral portion of the wafer W; and a discharge controller 7 configured to control a discharge angle and a discharge position of the processing liquid from the processing liquid discharging unit 73 onto the peripheral portion based on the information upon the variation amount of the deformation of the peripheral portion acquired by the variation acquiring unit.

A control parameter setting method for setting control parameters of film forming modules included, includes: acquiring a first parameter group including control parameters for controlling a film forming process in a first film forming module, and a second parameter group including control parameters for controlling a film forming process in a second film forming module; acquiring a film thickness value of a processed film on a substrate subjected to film formation by the first film forming module based on the first parameter group, and a film thickness value of a processed film on a substrate subjected to film formation by the second film forming module based on the second parameter group; and updating the first parameter group and the second parameter group so that a difference between the film thickness values acquired in the first film forming module and the second film forming module is reduced.

Systems and methods for producing, applying and evaluating coating compositions are disclosed. The amounts of components contained in the coating compositions may be monitored, along with processing parameters when the coating compositions are applied to various substrates. In certain embodiments, the characteristics of a produced sample coating are compared with the characteristics of a target or reference coating to determine if they are sufficiently matched.

An apparatus for processing a substrate is provided. The apparatus includes: a levitation stage transferring a substrate in a first direction and including first areas and second areas, which are arranged in a second direction that is different from the first direction; a plurality of rollers installed in the first areas and transferring the substrate; a plurality of first vacuum holes installed in the first areas and sucking the air at first pressure; and a plurality of second vacuum holes installed in the second areas and sucking the air at second pressure that is different from the first pressure.

Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treating unit that liquid-treats a substrate by supplying a liquid onto a substrate, a weight measuring unit that measures a weight of the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treating unit and the weight measuring unit. Accordingly, the weight of the remained liquid may be measured more promptly.