An adhesive dispensing system for applying liquid adhesive to a substrate using different nozzles with the same manifold is disclosed. The adhesive dispensing system includes a manifold having a body, a first clamp configured to engage the body of the manifold, a second clamp configured to engage the body of the manifold, and a nozzle. The first and second clamps secure the nozzle to the body of the manifold. The body of the manifold has a first contact surface that engages the first clamp and a second contact surface that engages the second clamp and the nozzle, where the second contact surface is angularly offset from the first contact surface.

An applicator for dispensing adhesive is disclosed. The applicator includes a manifold, at least one dispensing module coupled to the manifold, a supply channel configured to contain at least a portion of the adhesive, a recirculation channel configured to contain at least a portion of the adhesive, and a recirculation pump assembly connected to the manifold. The recirculation pump assembly includes an inlet in fluid communication with the recirculation channel, an outlet in fluid communication with the supply channel, a gear assembly, and a drive motor coupled to the gear assembly and operable to pump the adhesive, where the drive motor is configured to operate at an adjustable number of revolutions per minute (RPM). The recirculation pump assembly can be configured to move at least a portion of the adhesive from the recirculation channel to the supply channel, such that a first pressure of the adhesive in the recirculation channel is substantially equal to a second pressure of the adhesive in the supply channel.

An applicator for dispensing adhesive and a method of diverting flow in an applicator are disclosed. The applicator includes a plurality of pump assemblies each having an inlet and an outlet, a plurality of dispensing modules each having an inlet, and a flow diverter plate in fluid communication with the plurality of pump assemblies. The flow diverter plate defines a body having a first surface in fluid communication with the plurality of pump assemblies, a second surface opposite the first surface in fluid communication with the plurality of dispensing modules, and a plurality of diverter passages extending from the first surface to the second surface. Each of the plurality of diverter passages has a first opening on the first surface and a second opening on the second surface, and the first opening is in fluid communication with the outlet of one of the plurality of pump assemblies, and the second opening is in fluid communication with the inlet of at least one of the plurality of dispensing modules.

A method for controlling a recirculation pump assembly is disclosed. The method includes receiving a process-dependent characteristic and determining a recirculation flow rate of adhesive that flows to the recirculation pump assembly based on the process-dependent characteristic. The method further includes determining a recirculation pump speed of the recirculation pump assembly for pumping the adhesive to a supply channel using the recirculation flow rate, and adjusting an operating speed of the recirculation pump assembly to match the recirculation pump speed. A system and storage device for performing the above method are also disclosed.

An embodiment of the present disclosure is an applicator for dispensing adhesive onto a substrate. The applicator includes a manifold and at least one dispensing module coupled to the manifold. The applicator may include a least one pump assembly removably mounted the manifold. Each pump assembly having an outlet in flow communication with the manifold, and an inlet in flow communication with the adhesive. The pump assembly includes a gear assembly for pumping adhesive from said inlet to said outlet and a drive motor with a drive shaft connected to the gear assembly. The drive motor has a shaft with an axis that intersects said front surface of the pump assembly. In another example, the shaft has an axis that does not intersect both of a first side and a second side of said manifold.

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A meniscus sensor monitors a position of a meniscus of process fluid at a nozzle. The elongate bladder unit is used to maintain a position of the meniscus at a particular location by selectively expanding or contracting the bladder, thereby moving or holding a meniscus position. Expansion of the elongate bladder is also used for a suck-back action after completing a dispense action.

Techniques herein include a bladder-based dispense system using an elongate bladder configured to selectively expand and contract to assist with dispense actions. This dispense system compensates for filter-lag, which often accompanies fluid filtering for microfabrication. This dispense system also provides a high-purity and high precision dispense unit. A process fluid filter is located downstream from a process fluid source as well as a system valve. Downstream from the process fluid filter there are no valves. Dispense actions can be initiated and stop while the system valve is open by using the elongate bladder. The elongate bladder can be expanded to stop or pause a dispense action, and then be contracted to assist with a dispense action.

System and methods for calibrating a coating system are disclosed. Initially, a material is dispensed using an applicator of the coating system for a predetermined time period. A characteristic of the dispensing of the material for the predetermined time period is then determined. The characteristic of the dispensing of the material is compared to a predetermined range and it is determined that the characteristic of the dispensing of the material is outside of the predetermined range. In response, a velocity of the applicator, a pulse rate of the applicator, a temperature of the material, a pressure of the material supplied to the applicator, or a fan width of the applicator is adjusted to change the characteristic of the dispensing of the material.

Provided is a slurry dispensing apparatus for electromagnetic interference (EMI) shielding, and more particularly, a slurry dispensing apparatus for EMI shielding, wherein the slurry dispensing apparatus dispenses a slurry, in which a conductive metal powder and an adhesive are mixed, to an electronic component to form an electromagnetic wave shielding layer on the electronic component.

By using the slurry dispensing apparatus for EMI shielding, the slurry may be dispensed while preventing separation of the metal powder included in the slurry from the adhesive by precipitation, and maintaining a uniform mixture ratio in the slurry.

A temperature manipulated viscosity control module for stabilizing fluid viscosity in dispensing applications at (or near) the point-of-application. Connected to a central heating/cooling supply unit, the module both senses temperature and viscosity (and, in the case of waterborne materials, pH as well) and regulates the viscosity of the fluid being dispensed by manipulating the temperature of that fluid. This configuration is a combination of technologies applied together to maintain consistent temperature of the fluid and the sensors to assure that process conditions are consistent for measurement, control, and application.