Application of liquid material is carried out without causing variations in discharge amount even on a stage under heating while temperature of a liquid material is adjusted by a temperature control device. A liquid material discharge device includes a discharge port, a liquid chamber in communication with the discharge port, and a temperature control device adjusting a temperature of the liquid chamber, the liquid material discharge device discharging the liquid material from the discharge port while a workpiece and the discharge port are moved relative to each other. The liquid material discharge device also includes a coolant flow path through which a coolant for heat exchange with the temperature control device flows, and a discharge control device controlling a discharge operation. An application device including the liquid material discharge device and an application method using the application device are also provided.

A pipe doping system for applying pipe dope to the external threads of a pin end member may comprise a pump fluidly coupled to a dope-containing reservoir and a dope manifold, the pump positioned to pump pipe dope from the reservoir to the dope manifold; an ejector coupled to the dope manifold and positioned to supply a fixed volume of pipe dope from the dope manifold to a dope distribution line; a dope applicator, the dope applicator fluidly coupled to a dope distribution line positioned to deposit pipe dope on the external threads, the dope applicator being located apart from the ejector and including a nozzle positioned to receive a flow of pipe dope from the dope distribution line and apply the pipe dope onto the threaded connection. The system may include a power source to increase the pressure of the pipe dope as it is dispensed by the ejector.

A deposition device includes: a cooling unit that cools workpieces; a rotating table main body that rotates around a vertical axis, this rotating table main body having a cooling unit placement portion on which the cooling unit is placed and workpiece placement portions which are arranged so as to surround the periphery of the cooling unit placement portion and on which the workpieces are placed respectively; a lifting mechanism that lifts and lowers the cooling unit, inside the space, between a first position in which the cooling unit is placed on the rotating table main body and a second position in which the cooling unit is spaced upward from the rotating table main body and faces side surfaces of the workpieces placed on the workpiece placement portions; and refrigerant piping attached to the chamber and detachably connected to the cooling unit to supply the refrigerant to the cooling unit.

Processing apparatus for processing a workpiece surface in form of an internal coating of cylinder bores which are arranged in a row. The apparatus includes a shield unit which is provided to separate from one anotherat least during operationa part region of the workpiece surface provided for the processing and an adjacently arranged part region of the workpiece surface, whereby the shield unit has at least one blocking nozzle which is provided to generate a fluid flow for separating the at least two part regions, wherein the blocking nozzle is positioned such that the fluid flow flows along the workpiece surface and the blocking nozzle is directed to the part region between two cylinder bores.

The present application provides a dispensing method for a display panel and a dispensing device for the display panel. The dispensing method for the display panel includes: scanning an outline of a position to be dispensed of the display panel to obtain a dispensing parameter of the display panel; determining whether the dispensing parameter satisfies a preset dispensing condition; dispensing glue on the display panel when the dispensing parameter satisfies the preset dispensing condition. The dispensing method for the display panel provided in the present application can monitor the display panel to be dispensed, so as to dispense glue on the display panel meeting the dispensing condition, thereby improving product yield of the display panel.

A resin applying machine includes a processing chamber, a temperature measuring unit, and a controller. The processing chamber houses therein a holder for holding the wafer, a table that faces the holder, a resin supply unit for supplying a liquid resin to the table, a moving unit for relatively moving the holder and the table closely to each other, and a hardening unit for hardening the liquid resin that has coated the wafer. The temperature measuring unit measures a temperature in the processing chamber. The controller includes a correlation data storage unit for recording therein correlation data with respect to the temperature in the processing chamber and a moved distance by which the holder and the table are relatively moved by the moving unit at the temperature.

A coating treatment apparatus for applying a coating solution to a peripheral portion of a substrate, includes: a holding and rotating part holding and rotating the substrate; a coating solution supply nozzle supplying the coating solution to the peripheral portion of the substrate; a moving mechanism moving the coating solution supply nozzle; and a controller controlling the holding and rotating part, coating solution supply nozzle, and moving mechanism, wherein the controller performs control of, while rotating the holding and rotating part: by controlling the moving mechanism while supplying the coating solution by the coating solution supply nozzle, both moving the coating solution supply nozzle from an outside of a perimeter of the substrate to a predetermined position at a periphery on the substrate at a first speed and then moving the coating solution supply nozzle from the predetermined position to the outside of the perimeter at a higher second speed.

A method of depositing an extrudable substance onto a surface. The method comprises the step of delivering the extrudable substance from a cartridge to a flow-bypass assembly. The method further comprises the step of selectively controlling the flow-bypass assembly to purge air from the extrudable substance before the extrudable substance enters a delivery tube. The method further comprises the step of selectively controlling the flow-bypass assembly to deliver the extrudable substance from the flow-bypass assembly to a valve assembly via the delivery tube. The method further comprises the step of controlling flow of the extrudable substance from the valve assembly to a nozzle.

In a substrate processing method, a substrate holding unit holds a substrate in a horizontal position, a processing liquid supplying unit supplies first and second processing liquids to the surface of the substrate held by the substrate holding unit, a substrate rotating unit rotates the substrate held by the substrate holding unit, a heater opposes the substrate held by the substrate holding unit, and a moving unit moves at least one of the substrate holding unit and the heater supporting member such that the heater and the substrate are held in two different relative positions.

A liquid material is discharged in a constant amount per unit time regardless of a relative moving speed. The liquid material application apparatus includes a discharge head, a robot moving the discharge head relative to a workpiece, a movement control unit controlling relative movement of the discharge head and the workpiece, and a discharge control unit controlling an operation of discharging a liquid material from a discharge head, wherein the discharge control unit executes, in a switchable manner in accordance with an application program, first mode discharge control of changing a discharge amount of the liquid material, which is discharged from the discharge head per unit time, depending on a relative moving speed between the discharge head and the workpiece, and second mode discharge control of operating the discharge head to discharge the liquid material in a predetermined discharge amount per unit time regardless of the relative moving speed.