System and methods for applying a liquid coating to a substrate are disclosed herein. One exemplary method includes a flow control routine in which the velocity of an applicator, or other parameter affecting the amount of material applied to the substrate, is iteratively adjusted. The amount of the adjustment performed in each iteration is tracked. When the sum of the adjustments by the flow control routine exceeds a predetermined threshold, a fan width control routine is initiated in which the fan width of the stream of material applied by the applicator is adjusted.

A jetting dispensing module includes a module body with a fluid bore. A nozzle element is coupled to the module body. The nozzle element includes a fluid reservoir communicating with the fluid bore of the module body and a dispensing passage. A guide element includes a main guide bore and an internal fluid space in fluid communication with the fluid bore. A plunger is mounted for reciprocating movement within the module body. The plunger extends through the main guide bore and into the internal fluid space, and includes a distal end moveable between a fully retracted position spaced from the fluid reservoir and a fully extended position within the fluid reservoir but out of contact with the nozzle element.

A jetting device and/or fluid module include a module body defining a passageway extending through the module body and also partially defining a fluid chamber, a nozzle supported by the module body, a valve element at least partially within the fluid chamber, a biasing element contacting the valve element and also contacting the module body, and a sealing member contacting the periphery of the valve element and configured to partially define the fluid chamber. The nozzle defines a fluid outlet that is in fluid communication with the fluid chamber. The valve element has an upper portion outside of the fluid chamber that is adapted for contact with the drive pin, and the biasing element is configured to apply a spring force to the valve element. The valve element is configured to cause a droplet of the fluid to be jetted from the fluid outlet when the valve element is moved in the direction toward the nozzle.

Application of liquid material is carried out without causing variations in discharge amount even on a stage under heating while temperature of a liquid material is adjusted by a temperature control device. A liquid material discharge device includes a discharge port, a liquid chamber in communication with the discharge port, and a temperature control device adjusting a temperature of the liquid chamber, the liquid material discharge device discharging the liquid material from the discharge port while a workpiece and the discharge port are moved relative to each other. The liquid material discharge device also includes a coolant flow path through which a coolant for heat exchange with the temperature control device flows, and a discharge control device controlling a discharge operation. An application device including the liquid material discharge device and an application method using the application device are also provided.

The invention relates to a dosing system (1) for dosing a dosing material. The dosing system (1) has a housing (11), comprising a nozzle (70) and a supply channel (62) for dosing material, and a discharge element (80) movably mounted in the housing (11) and an actuator unit (10) coupled to the discharge element. The actuator unit (10) comprises an actuator (12) having a membrane (13) which can be pressurized by means of a pressure medium in order to move the discharge element (80) in a discharge direction (RA). The discharge element (80) is formed separately and, for coupling to the actuator unit (10), is pressed by means of a force acting on the discharge element (80) against a side surface (19) of the membrane (13) pointing in the direction of the discharge element (80). Furthermore, the invention relates to a method for controlling a dosing system (1).

Jetting devices and methods for dispensing a fluid material from a fluid supply. A jetting device includes a fluid module configured to be coupled with the fluid supply and to dispense the fluid material. The fluid module includes a valve seat and a valve element configured to move relative to the valve seat over a stroke length, and a valve stop configured to position the valve element relative to the valve seat for determining the stroke length. The jetting device further includes a drive module configured to actuate the fluid module and includes a drive pin configured to move the valve element toward the valve seat. The drive pin is configured to be rotated to cause rotation of the valve stop for adjustment of the stroke length. The drive pin may be rotated by a rotation device comprising a motor.

A system for applying a coating composition is provided herein. The system includes a first high transfer efficiency applicator defining a first nozzle orifice and a second high transfer efficiency applicator defining a second nozzle orifice. The system further includes a reservoir. The system further includes a substrate defining a first target area and a second target area. The first high transfer efficiency applicator and the second high transfer efficiency applicator are configured to receive the coating composition from the reservoir and configured to expel the coating composition through the first nozzle orifice to the first target area of the substrate and to expel the coating composition through the second nozzle orifice to the second target area of the substrate.

An apparatus includes a hopper configured to receive a plurality of solder microspheres, and a moveable singulation device positioned proximate to and below the hopper. The moveable singulation device is configured to receive the plurality of solder microspheres from the hopper as the plurality of microspheres exit the hopper. The movable singulation device includes a plurality of holes, with each of the plurality of holes configured to receive a single solder microsphere of the plurality of solder micro spheres. The apparatus further includes a piezoelectric vibration device configured to provide ultrasonic vibrations to the singulation device, thereby preventing agglomeration of the plurality of solder microspheres in the hopper.

A method for controlling an ejector is disclosed, wherein the ejector comprises an actuator arrangement configured to eject a droplet of viscous medium onto a substrate, and wherein the droplet forms part of a sequence of a plurality of droplets. The method comprises obtaining a control parameter for controlling the operation of the actuator arrangement, and operating the actuator arrangement, using the control parameter, in order to eject the droplet. The obtained control parameter is based on at least one of: a time period between the droplet and a previous droplet in the sequence, a difference in target size of the droplet and a size of the previous droplet in the sequence, and the droplets position in the sequence.

A device for intermittent coating of a substrate moving in a transport direction relative to the device includes a nozzle body comprising two nozzle jaws; an insertion film having a cut-out provided between the two nozzle jaws, wherein the cut-out in the insertion film forms a nozzle slot within the nozzle body, wherein the nozzle slot extends transversely to the transport direction of the substrate and in parallel with the substrate, and wherein the nozzle slot ends in an outlet gap; and a supply channel, wherein the outlet gap is in flow connection with the supply channel via the nozzle slot. A first of the two nozzle jaws is provided with at least two openings which lead into the nozzle slot in series between the supply channel and the outlet gap and which are closed in a fluid-tight manner toward the nozzle slot by at least two elastically deformable elements.