A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

A method for providing a coated strip, which includes the steps of providing a metal or metal alloy strip, applying one or more coating layers on the metal or metal alloy strip and irradiating one or more of the applied coating layers with electromagnetic radiation, wherein one or more of the applied coating layers includes dielectric particles capable of absorbing microwave radiation and wherein microwave radiation is used to selectively heat one or more of the coating layers containing the dielectric particles to dry and/or cure and/or sinter the coating layer.

A method for curing photosensitive polyimide (PSPI) films includes the steps of: depositing a PSPI film on a selected substrate, and curing the film by microwave heating at a selected temperature from about 200 to 340 C. in a selected atmosphere containing an oxygen concentration from about 20 to 200,000 ppm. The process atmosphere may be static or flowing. The addition of oxygen improves the removal of acrylate residue and improves the T.sub.g of the cured film, while the low processing temperature characteristic of the microwave process prevents the oxygen from damaging the polyimide backbone. The method may further include the steps of photopatterning and developing the PSPI film prior to curing. The process is particularly suitable for dielectric films on silicon for electronic applications.