B05D3/042

Method and device for producing a structured varnish surface

The invention relates to a method for producing a structured, at least partly optically transparent varnish surface on a surface of a substrate board, preferably of a wood material board, having a decoration. The steps of the method include applying a transparent or at least partly transparent varnish to an applicator roll thereby producing a structured varnish surface and transferring the structured varnish surface to a substrate board having a decoration. The varnish is applied to the applicator roll by a plurality of digitally controlled nozzles in a distribution defining a structure and/or is transformed on the applicator roll into a distribution defining a structure. Furthermore, a device for carrying out the method is described.

METHOD AND DEVICE FOR COATING THE INNER SURFACE OF A CONTAINER AND CONTAINER OBTAINED WITH SUCH A METHOD
20170326586 · 2017-11-16 · ·

A method for coating at least one portion of the inner surface of a container with a curable liquid material, a device for implementing said method; and a container obtained by said method. The container is positioned on a holder and secured thereto; a tool for applying the coating is inserted into the container and the coating liquid is applied using the tool on the inner surface of the container. The container is tilted at a first angle determined in relation to the vertical and rotated relative to the tool at a first predetermined speed V, while heating said container to a predetermined temperature. The liquid coating material is uniformly applied to the inner surface of the container to obtain a uniform, substantially identical thickness.

ALTERNATING CURRENT ELECTROSPRAY MANUFACTURING AND PRODUCTS THEREOF
20220048053 · 2022-02-17 ·

Provided in certain embodiments herein are alternating current electrospray systems and processes for manufacturing depositions, such as thin layer depositions. In some embodiments, processes and systems provided herein are suitable for and configured to manufacture uniform depositions, such as having uniform thickness.

Transparent electrically conductive substrate and manufacturing method thereof

Method of manufacturing a transparent electrically conductive substrate having an application process whereby a wet layer is formed by applying onto a substrate film a coating liquid comprising metallic nanowires dispersed in a solvent, and a drying process whereby the solvent contained in the abovementioned wet layer is removed by drying, characterised in that the abovementioned drying process includes a process whereby the orientation of the abovementioned metallic nanowires is altered by introducing a forced draft facing towards the substrate from a direction that is different from the longitudinal direction of the substrate film.

Plating adhesion amount control mechanism and method for controlling an adhesion amount by comparing a plating adhesion amount estimation value at an upstream position and a plating adhesion actual amount at a downstream position

When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.

Process and apparatus for extruding bands of material onto a substrate

A extrusion process and apparatus for the deposition of precise, usually small amounts of extrudate (4) for adhesion to a substrate (1) comprising an extruder (2) positioned close to the substrate (1) and a jet of hot gas (6) directed onto the extrudate (1) between the extruder (2) and the substrate (1) in order to retain the adhesive properties between the extrudate (4) and the substrate (1).

Razor Blade and Method of Making It
20210387367 · 2021-12-16 ·

In the method for coating a razor blade with a lubricating material, a razor blade is provided having a body portion and a tip end defined by at least one tip surface and a cutting edge. The lubricating material is sprayed on the tip end of the razor blade, wherein spraying the lubricating material is performed steam-aided in that the lubricating material is introduced into a superheated water steam directed towards the tip end of the razor blade. Moreover, a method of making a razor blade by using the afore-mentioned method for coating the razor blade with a lubricating material is provided. Finally, also a razor blade coated in accordance with these methods, and a shaving razor provided with such a razor blade are described.

Layer-by-layer coating apparatus and method

Apparatus and method useful for, among other things, providing a layer by layer coating of materials on a substrate.

Process and Apparatus for Extruding Bands of Material onto a Substrate
20220118477 · 2022-04-21 ·

A extrusion process and apparatus for the deposition of precise, usually small amounts of extrudate (4) for adhesion to a substrate (1) comprising an extruder (2) positioned close to the substrate (1) and a jet of hot gas (6) directed onto the extrudate (1) between the extruder (2) and the substrate (1) in order to retain the adhesive properties between the extrudate (4) and the substrate (1).

ANISOTROPY REDUCTION IN COATING OF CONDUCTIVE FILMS
20210362183 · 2021-11-25 ·

Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.