A method comprising: creating, first conductive traces (12) over a substrate (10) by selective creation of metallization over the substrate (10) using selective direct structuring of a material configured for selective direct structuring; and creating second conductive areas (16A, 16B) over the substrate (10) directly in contact with at least darts of the first conductive traces (12).

Methods and systems for treating components are described. The methods include using a system having a controller, a laser applicator, a coating applicator, and a sensor array. The laser applicator, the coating applicator, and the sensor array are arranged on a treatment arm that is controlled by the controller. The method includes scanning a surface to be treated of the component using the sensor array, cleaning the surface to be treated using the laser applicator, defining surface texture patterns, applying laser texturing, and applying a new coating to the surface to be treated using the coating applicator.

Methods, systems and apparatuses are disclosed for at least partially curing a light-curable material within a dispenser to obtain an at least partially-cured material and dispensing the at least partially-cured material to a substrate, while retaining substantially all of the light within the dispenser.

A method of fabricating three-dimensional patterns on a workpiece includes steps of providing a transparent film and forming a three-dimensional patterns on the transparent film. A layer of adhesive is coated on the three-dimensional patterns. A heat transfer film is used in transferring the three-dimensional patterns from the heat transfer film to a main surface of the workpiece using a vacuum heat transfer printing method.

A method for forming a packaging material. The method can comprise moving a web of material in a downstream direction. The web can comprise fibrous material. The method further can comprise applying a moisturizing liquid to the web to at least partially wet the fibrous material. The applying the moisturizing liquid to the web can comprise receiving the web in a moisturizing station comprising at least, a drive roller and a transfer roller. The receiving the web in the moisturizing station can comprise moving the web between the drive roller and the transfer roller, and the applying the moisturizing liquid to the web can comprise engaging a face of the fibrous material with the moisturizing liquid on the transfer roller. The method further can comprise forming a film on the web, which can comprise applying a film-forming liquid to the web.

A film forming apparatus, a substrate processing apparatus, and a device manufacturing method are provided, which improve the film thickness uniformity of a thin film that is formed on a substrate by spraying a thin film material. The film forming apparatus which forms a thin film on a substrate is provided with a nozzle that sprays a thin film material and an exhaust unit that discharges a gas. An exhaust port of the exhaust unit is arranged on a side that is opposite to the direction in which the gravity acts with respect to the substrate. The substrate processing apparatus performs a predetermined process on the substrate using the film forming apparatus. The device manufacturing method manufactures a device using the film forming apparatus.

Methods and systems for treating components are described. The methods include using a system having a controller, a laser applicator, a coating applicator, and a sensor array. The laser applicator, the coating applicator, and the sensor array are arranged on a treatment arm that is controlled by the controller. The method includes scanning a surface to be treated of the component using the sensor array, cleaning the surface to be treated using the laser applicator, defining surface texture patterns, applying laser texturing, and applying a new coating to the surface to be treated using the coating applicator.

A multi-step system and method for curing a dielectric film in which the system includes a drying system configured to reduce the amount of contaminants, such as moisture, in the dielectric film. The system further includes a curing system coupled to the drying system, and configured to treat the dielectric film with ultraviolet (UV) radiation and infrared (IR) radiation in order to cure the dielectric film.

A liquid photocurable adhesive coating device, a method for coating a liquid photocurable adhesive with a liquid photocurable adhesive coating device, and a method for coating a liquid photocurable adhesive are provided. The liquid photocurable adhesive coating device, including: a coating head, configured to coat a liquid photocurable adhesive; a precuring light source, fixed on the coating head and configured to precure the liquid photocurable adhesive coated by the coating head while the coating head is coating the liquid photocurable adhesive.

A wire grid polarizer (WGP) can have a phosphonate conformal-coating to protect the WGP from at least one of the following: corrosion, dust, and damage due to tensile forces in a liquid on the WGP. The conformal-coating can include a chemical: ##STR00001##
where R.sup.1 can include a hydrophobic group, Z can include a bond to the ribs, and R.sup.5 can be any suitable chemical element or group. A method of applying a phosphonate conformal-coating over a WGP can include exposing the WGP to (R.sup.1).sub.iPO(R.sup.4).sub.j(R.sup.5).sub.k, where: i is 1 or 2, j is 1 or 2, k is 0 or 1, and i+j+k=3; each R.sup.1 can independently include a hydrophobic group; R.sup.4 can include a phosphonate-reactive-group; each R.sup.6 can independently include an alkyl group, an aryl group, or combinations thereof; and each R.sup.5, if any, can independently be any suitable chemical element or group.