A deposition system includes a multipurpose deposition chamber, a pre-treatment source and a post-treatment source. The multipurpose deposition chamber is configured to deposit parylene on a plurality of electronic devices. The multipurpose deposition chamber is configured to process pre-treatment of the plurality of electronic devices prior to deposition of the parylene. The multipurpose deposition chamber is configured to process post-treatment of the plurality of electronic devices after deposition of the parylene.

A novel physical vapor deposition (PVD) layer structure for chrome-look coatings on plastic substrates shows very good adhesion. The PVD coating is embedded in an organic UV cured base coat applied to the substrate prior to PVD coating and a similar organic UV cured top coat to protect the PVD coating and to adjust the gloss level. The novel PVD coating structure consists of different metallic layers such as i.e. chromium, zirconium and aluminum and a new adhesion layer consisting of silicon monoxide (SiO) and silicon.

A coating method is provided, in which at least one emulsion and/or one solution is applied at least to a first partial area of a surface of a component, said emulsion and/or solution containing at least one layer-forming substance, and then the component is heat-treated, wherein at least one second partial area of the first partial area is subsequently exposed to a plasma, wherein the carbon content of the coating decreases to less than about 80% or less than about 75% or less than about 70% or less than about 60% of the initial value prior to the plasma treatment. A workpiece and a method for the production thereof is provided.

A versatile, thermally stable and economically effective corrosion inhibition treatment for copper (Cu) metal and selected metals surface through a single step chemical vapor deposition (CVD) of selected inhibitor compounds at temperatures as low as 100-200 C. is described in this invention. The resulting CVD deposited inhibition coating is thermally stable to 300 C. and protects Cu and selected metals from active corrosion in various technologically important operational environments. The selective coating for copper metal is achieved by controlling the chemistry of bonding between the Copper metal surface and inhibitor material used. The technique can be accomplished by using one or more inhibitors separately or in combination in order to create an all-terrain stable & robust corrosion prevention coating for copper metal.

Provided herein is a film and methods of producing the same. The film includes a substrate and a layer adjacent to the substrate, wherein a surface of the layer comprises spaced apart protrusions. The methods include providing a substrate, depositing a layer on at least a portion of the substrate, decomposing the layer to form at least a first phase of material and a second phase of material, and removing at least a portion of the second phase from the decomposed layer to form a structured layer.

The invention relates to self-assembled organosilane coatings for resorbable medical implant devices. The coatings can be prepared from coating compositions containing organosilane and can be applied to metal or metal alloy substrates. Prior to applying the coatings, the surfaces of the substrates can be pretreated. The coatings can be functionalized with a binding compound that is coupled with an active component. The coatings can be selectively removed, e.g., patterned, to expose portions of the uncoated substrate. Selecting different patterns can provide the ability to regulate or control various properties, such as, corrosion and hydrogen generation.

A method of manufacturing a plastic stent according to an embodiment of the present invention includes a first process of cleaning a surface of the stent including a plastic material to perform pretreatment, a second process of plasma-treating the pretreated surface of the stent, and a third process of introducing a hydrophilic functional group to the plasma-pretreated surface of the stent.

Herein discussed is a method of sintering a ceramic comprising (a) providing an electromagnetic radiation (EMR) source; (b) (i) providing a layer of intermixed ceramic particles and absorber particles, wherein the absorber particles have a volume fraction in the intermixed particles in the range of no less than 3%; or (ii) providing a first layer comprising ceramic particles and a second layer comprising absorber particles in contact with at least a portion of the first layer, wherein the second layer is farther from the EMR source than the first layer; (c) heating (i) the layer of intermixed particles or (ii) the first layer using EMR; and (d) controlling the EMR such that at least a portion of the ceramic particles are sintered wherein (i) the layer of intermixed particles becomes impermeable or (ii) the first layer becomes impermeable, wherein the absorber particles have greater EMR absorption than the ceramic particles.

Methods and apparatus for vapor deposition of an organic film are configured to vaporize an organic reactant at a first temperature, transport the vapor to a reaction chamber housing a substrate, and maintain the substrate at a lower temperature than the vaporization temperature. Alternating contact of the substrate with the organic reactant and a second reactant in a sequential deposition sequence can result in bottom-up filling of voids and trenches with organic film in a manner otherwise difficult to achieve. Deposition reactors conducive to depositing organic films are provided.

The present disclosure provides a hard coat film comprising: a hard coat layer and a primer layer; wherein the primer layer includes a first layer of which transmittance with respect to light having a wavelength of 380 nm is 30% or below, and a second layer of which transmittance with respect to light having a wavelength of 340 nm is 10% or below; the first layer and the second layer are layered, in no particular order, in the position of one surface of the hard coat layer; and a substrate layer is included in the position of the surface of the hard coat layer which is opposite side surface to the primer layer side surface, or in the position of the surface of the primer layer which is opposite side surface to the hard coat layer side surface.