In the piezoelectric vibrator element, a larger area of the electrode part making a contribution to the vibration of the piezoelectric vibrator element is ensured. The piezoelectric vibrator element is a tuning-fork piezoelectric vibrator element, provided with a pair of vibrating arm parts extending from a base, and a groove part constant in width is formed on each of principal surfaces (reverse and obverse surfaces) in the longitudinal direction of the vibrating arm part. On the side surfaces and the principal surfaces, and in the groove part of the vibrating arm part, there are formed two systems of excitation electrodes. In the case of defining a width of a bank part formed by a side surface of the vibrating arm part and a side surface of the groove part as W0, and the distance between the excitation electrodes formed on the principal surface of the vibrating arm part as an electrode separation width W1, the electrode separation width W1 is formed in a range of 1 μm<W1<3 μm so as to fulfill W0>W1. By making the electrode separation width narrower than 3 μm, it is possible to increase the width of each of the excitation electrodes formed on the principal surface (on the bank part) of the vibrating arm part. Thus, the area of the electrode part making a contribution to the vibration can be increased, and the piezoelectric effect can be improved.

A vibration device that includes a first elastic plate having a first end portion and a second end portion, and a first surface and a second surface facing each other and connecting the first and second end portions. A second elastic plate is laminated to the second end portion of the first elastic plate, and a piezoelectric vibration element is provided on at least one of the first surface and the second surface of the first elastic plate. On a portion where the first elastic plate and the second elastic plate are laminated, a first bonding portion and a second bonding portion that bond the first elastic plate and the second elastic plate to each other are provided. The second bonding portion is located closer to the first end portion than the first bonding portion.

The vibration device includes a diaphragm, and a plurality of piezoelectric films that are arranged at predetermined intervals in a first direction of the diaphragm to face the diaphragm and extend parallel to a second direction orthogonal to the first direction. The diaphragm has at least one slit formed therein and dividing the diaphragm into respective regions. Each of the piezoelectric films are fixed to a respective region of the diaphragm while extending along the second direction in a tensioned state. The piezoelectric films expand and contract in a plane direction when a voltage is applied thereto.

A MEMS speaker suitable for generating audible sound waves, includes a bimetallic strip actuation system extending in a first plane and an amplification capsule including a membrane extending in a second plane, parallel to the first plane, the membrane including a rigid interior zone and a flexible exterior zone, and a rigid coupling wall, fastened at the periphery of the bimetallic strip actuation system to make the exterior zone of the membrane integral with said actuation system.

There is provided a vibration generating apparatus including: an elastic member having both end portions fixed to a housing; a piezoelectric element installed on one surface of the elastic member; and a circuit board connected to the piezoelectric element, wherein the elastic member has support parts formed on both side surfaces of both end portions thereof and bent downwardly in order to be installed in the housing, and a portion of the circuit board passing between the support parts has a flat panel shape.

There are provided a vibrator and an electronic device including the same. The vibrator includes: a housing having an internal space; an elastic member having both ends fixed to the housing so as to be disposed in the internal space in a state in which elastic deformation is possible; and a piezoelectric element mounted on one surface of the elastic member, wherein the piezoelectric element is fixed to the elastic member by soldering.

Provided is a piezoelectric material that is free of lead and potassium, has satisfactory insulation property and piezoelectricity, and has a high Curie temperature. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1): General formula (1) (Na.sub.xM.sub.1-y)(Zr.sub.z(Nb.sub.1-wTa.sub.w).sub.y(Ti.sub.1-vSn.sub.v).sub.(1-y-z))O.sub.3 where M represents at least any one of Ba, Sr, and Ca, and relationships of 0.80≦x≦0.95, 0.85≦y≦0.95, 0<z≦0.03, 0≦v<0.2, 0≦w<0.2, and 0.05≦1−y−z≦0.15 are satisfied.

Apparatus and techniques are described, such as for obtaining information indicative of an acoustic characteristic of a formation, including using a transducer assembly, comprising a base plate, a first piezoelectric slab and a second piezoelectric slab. The base plate includes a first region extending axially in a first direction beyond the first and second piezoelectric slabs along a specified axis of the base plate and a second region extending axially in a second direction, opposite the first direction, beyond the first and second piezoelectric slabs. In various examples, a length of the first region along the specified axis is different than a length of the second region to provide an asymmetric configuration. In various examples, an anchoring element is mechanically coupled to the base plate at a location corresponding to a node location of a specified acoustic vibration mode.

Provided is a method for bonding wafers, which can bond the wafers to each other with high reliability while reducing the influence on the wafers. The method for bonding wafers includes the steps of: preparing a first wafer that has, on the surface thereof, a first metal layer with a first rigidity modulus, and a second wafer that has, on the surface thereof, a second metal layer with a second rigidity modulus higher than the first rigidity modulus; removing an oxide film at the surface of the second metal layer while an oxide film at the surface of the first metal layer is not removed; and bonding the surface of the first wafer to the surface of the second wafer.

A low-profile ultrasonic wave generation device is provided that includes a drive unit having a piezoelectric member and an electrode formed on a surface of the piezoelectric member. The drive unit as a whole vibrates flexurally. The connection member is connected to a portion of the drive unit that includes a point of maximum displacement of the drive unit when the drive unit is subjected to flexural vibration. The vibrating unit is connected to the connection member. The vibrating unit vibrates due to the flexural vibration of the drive unit being transmitted by the connection member and thereby generates ultrasonic waves.