Various ultrasonic instruments are disclosed. The ultrasonic instruments include structures configured to indicate the cutting length of the instruments, detect when grasped tissue has extended beyond the cutting length of the instrument, and prevent tissue from extending beyond the cutting length. Several techniques for each types of structures are disclosed.

An ultrasonic transducer device includes a first substrate that is provided with a plurality of ultrasonic transducer elements arranged in a matrix, and a plurality of first wires via which the ultrasonic transducer elements are electrically connected to each other as a plurality of serial sets, and a second substrate that is provided to overlap the first substrate, and is provided with a plurality of second wires intersecting the first wires in a plan view from a thickness direction of the first substrate and third wires via which the first wires are electrically connected to the second wires.

A device and method used for inspecting and measuring coiled tubing, production tubing or drill pipe as it enters the well. Defects such as internal and external wall loss, cracking and deformation can be detected and quantified. The axial motion of the tubing can be measured allowing for depth measurements that are more accurate and reliable than what can be obtained using an encoder wheel system.

According to embodiments, an ultrasonic inspection apparatus comprises: an ultrasonic array probe having a plurality of ultrasonic elements; an estimated shape reflected wave arrival time calculator for computing the estimated shape reflected wave arrival time for the estimated shape reflected wave on the basis of the estimated sound velocity in the test object; an actual shape reflected wave arrival time extractor for extracting the actual shape reflected wave arrival time on the basis of the actual shape reflected wave; a shape reflected waves time difference calculator for computing the difference by subtracting the actual shape reflected wave arrival time from the estimated shape reflected wave arrival time as shape reflected waves time difference; and a delay time calculator for computing the delay times for mutually shifting the timings of ultrasonic wave transmission and ultrasonic wave reception by the ultrasonic elements, considering the shape reflected waves time differences.

The present disclosure provides methods to integrate piezoelectric micromachined ultrasonic transducer (pMUT) arrays with an application-specific integrated circuit (ASIC) using thermocompression or eutectic/solder bonding. In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using thermocompression, wherein any set of individual PMUTs of PMUT array is addressable. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT array and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using eutectic or solder bonding, wherein any set of individual PMUTs of the PMUT array is addressable.

The present disclosure provides methods to integrate pMUT arrays with an ASIC using solid liquid interdiffusion (SLID). In an aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, which conductive bonding pillar comprises one or more intermetallic compounds. In another aspect, the present disclosure provides a device comprising a first substrate and a second substrate, the first substrate comprising a pMUT device and the second substrate comprising an electrical circuit, wherein the first substrate and the second substrate are bonded together using a conductive bonding pillar, wherein the bonding is performed at a temperature less than the melting point of the conductive bonding pillar after the bonding.

An ultrasonic phased array transducer device with a two-dimensional hinge array structure belongs to equipment in the technical field of ultrasonic detection. A connecting rod is fixedly connected to a fixed support and a two-dimensional hinge array respectively. Voice coil motors are symmetrically arranged in a shape of the British Union Jack with the connecting rod as a center, and are fixedly connected to the fixed support. Force output rods are respectively connected to voice coil motor coils and the upper surfaces of array units. Piezoelectric array elements are fixedly connected to the lower surfaces of all the array units. The numbers of the voice coil motors and the force output rods are 2N (N=4, 8, 12, 16, 20), the number of the piezoelectric array elements is 2N+1, and different N values are selected according to the sizes of workpieces to be detected. In the disclosure, by adjusting the current of each voice coil motor coil, the corresponding force output rod generates displacement to drive the two-dimensional hinge array unit to generate displacement, so as to push out and retract the hinge array unit and the piezoelectric array element fixedly connected below and drive the two-dimensional hinge array to generate deformation, so that the piezoelectric array elements fully fit with the surface of the workpiece to be detected. The disclosure can be applied to detection of the workpieces to be detected with flat surfaces, curved surfaces or spherical surfaces.

An ultrasound transducer array architecture and manufacturing method is provided. The method includes providing an ultrasonic transducer including a plurality of modules, each module including an ultrasonic transducer array and an application specific integrated circuit (ASIC), the ultrasonic transducer array and the ASIC electrically coupled to a flexible interconnect, the flexible interconnect coupled to a connector. The ASIC and flexible interconnect may be arranged such that each ultrasonic transducer array is directly adjacent to another ultrasonic transducer array. The ASIC may be electrically coupled to the flexible interconnect and the ASIC to the transducer array via a redistribution layer. Each of the plurality of modules may be a stack with the ultrasonic transducer array on the RDL and RDL on the ASIC, wherein the flexible interconnect extends laterally from a top surface of the ASIC and curves down to a bottom surface of the ASIC.

A piezoelectric sensor assembly, a manufacturing method thereof, a display panel and an electronic device including the same are provided. The piezoelectric sensor assembly includes: a base substrate; a plurality of ultrasonic transducers, wherein a spacing area is provided between two adjacent ultrasonic transducers; and an acoustic matching layer, wherein the acoustic matching layer includes a plurality of acoustic matching areas, and an orthographic projection of at least one acoustic matching area on the base substrate falls into an orthographic projection of the ultrasonic transducer corresponding to the acoustic matching area on the base substrate, wherein an isolation cavity is provided between two adjacent acoustic matching areas.

An ultrasound probe according to an embodiment includes a plurality of piezoelectric transducer elements and a substrate. The plurality of piezoelectric transducer elements is divided in grid sections. The piezoelectric transducer elements have an ultrasound wave transmitting/receiving surface. The substrate is provided on a rear surface of the plurality of piezoelectric transducer elements. The substrate has a wiring configured to connect a plurality of electrodes for a group of piezoelectric transducer elements to driving circuitry. The group of piezoelectric transducer elements is located in a substantially concentric circle among the plurality of piezoelectric transducer elements. The rear surface of the plurality of piezoelectric transducer elements is a surface opposite to the ultrasound wave transmitting/receiving surface.