A vibration actuator includes a vibrating body and a contact body having an annular shape. The vibrating body vibrates and includes an annular elastic body and an electro-mechanical energy conversion element. The contact body is in contact with the vibrating body and moves relative to the vibrating body. The contact body includes a base portion, a supporting portion annularly extending from the base portion in a radial direction of the annular shape of contact body, and a friction member that is on the supporting portion, is different in member from the supporting portion, and is in contact with the vibrating body. A first gap is between one end of the friction member and the supporting portion, and a second gap is between the one end of the friction member and the vibrating body.

Piezoelectrically actuated devices constructed from thin semiconductor membranes bonded directly to piezoelectric substrates are provided. Methods for fabricating these devices are also provided. The bonding of the semiconductor to the piezoelectric material does not require the use of any intermediate layers, such as bonding agents.

Provided is an actuator having a piezoelectric element, a diaphragm to which the piezoelectric element is bonded and vibrates according to expansion and contraction displacement of the piezoelectric element, and a first spacer and a second spacer configured to fix both ends of the diaphragm in expansion and contraction displacement direction of the piezoelectric element to a base member. The driving characteristics of the actuator are determined by an effective length of the diaphragm between the first spacer and the second spacer.

An acoustophoretic device is disclosed. The acoustophoretic device includes an acoustic chamber, an ultrasonic transducer, and a reflector. The ultrasonic transducer includes a piezoelectric material driven by a voltage signal to create a multi-dimensional acoustic standing wave in the acoustic chamber emanating from a non-planar face of the piezoelectric material. A method for separating a second fluid or a particulate from a host fluid is also disclosed. The method includes flowing the mixture through an acoustophoretic device. A voltage signal is sent to drive the ultrasonic transducer to create the multi-dimensional acoustic standing wave in the acoustic chamber such that the second fluid or particulate is continuously trapped in the standing wave, and then agglomerates, aggregates, clumps, or coalesces together, and subsequently rises or settles out of the host fluid due to buoyancy or gravity forces, and exits the acoustic chamber.

A multi-array ultrasound system for haptic engagement is provided. The system may include a computing device with a processing system, a tracking device communicatively coupled to the processing system, two or more ultrasound transducer arrays including a plurality of ultrasound transducers, and a driver communicatively coupled to the processing system and the two or more ultrasound transducer arrays.

A display substrate includes: a base substrate having a first side and a second side opposite to each other; a transmitter arranged on the first side of the base substrate, and configured to convert a first display electrical signal into a conduction signal; a first light-emitting element arranged on a side of the transmitter away from the base substrate, wherein the first light-emitting element emits light under a driving action of the first display electrical signal; a receiver arranged on the second side of the base substrate, and configured to receive the conduction signal and convert the conduction signal into a second display electrical signal; and a second light-emitting element arranged on a side of the receiver away from the base substrate, wherein the second light-emitting element emits light under a driving action of the second display electrical signal.

Provided are an acoustic matching sheet containing the following component (B) in the following component (A), a composition for an acoustic matching layer, an acoustic wave probe, an acoustic wave measurement apparatus, and a method for manufacturing an acoustic wave probe. (A) is at least one of a resin or a rubber; and (B) is at least one of a resin particle or a rubber particle having an acoustic velocity lower than an acoustic velocity of the component (A) and having a number average particle diameter of 1.0 μm or less.

An ultrasonic probe includes: an ultrasonic vibrator that transmits and receives an ultrasonic wave; a wire member that is electrically connected to the ultrasonic vibrator and is provided along a side surface of the ultrasonic vibrator; a shield member that is provided outside the wire member from a viewpoint of the ultrasonic vibrator and electrically protects the ultrasonic vibrator; and a first heat conduction member that is provided in contact with the ultrasonic vibrator, wherein the first heat conduction member and the shield member are thermally connected to each other.

A method for controlling damages in cleaning a semiconductor wafer comprising features of patterned structures, the method comprising: delivering a cleaning liquid over a surface of a semiconductor wafer during a cleaning process; and imparting sonic energy to the cleaning liquid from a sonic transducer during the cleaning process, wherein power is alternately supplied to the sonic transducer at a first frequency and a first power level for a first predetermined period of time and at a second frequency and a second power level for a second predetermined period of time, the first predetermined period of time and the second predetermined period of time consecutively following one another, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.

Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.