An acoustic device (100) comprises an array of acoustic transducers (10a,10b) formed by a patterned stack (12-15) on a flexible substrate (11). The stack comprises a piezoelectric layer (13) sandwiched between respective bottom and top electrode layers (12,15), and a patterned insulation layer (14) formed by a pattern of insulation material (14m). The pattern comprises insulated areas (A14) where the insulation material (14m) is disposed between one of the electrodes (12,15) and the piezoelectric layer (13), and contact areas (A10) without the insulation material (14m) where both electrodes (12,15) contact the piezoelectric layer (13).

The invention concerns a novel acoustofluidic device to separate acoustically active particles from fluids comprising a novel device arrangement for improved acoustic pressure and particle velocity; and a method of separating particles from a fluid comprising use of same.

A display device can include a display panel including display pixels having light emitting elements, and sensing pixels including piezoelectric elements; and a driving circuit configured to drive the display panel, in which the display panel further includes a substrate; a thin film transistor array disposed on the substrate, the thin film transistor array including display driving transistors included in the display pixels; a sensor array disposed on the thin film transistor array, the sensor array including sensor driving transistors included in the sensing pixels; a piezoelectric element layer disposed on the sensor array, the piezoelectric element layer including the piezoelectric elements connected to the sensor driving transistors; and a light emitting element layer disposed on the piezoelectric element layer, the light emitting element layer including the light emitting elements, and anode electrodes of the light emitting elements are connected to the display driving transistors.

An ultrasonic sensor includes a transmission unit that is disposed on a first axis which is inclined with respect to a normal line of a surface of an object, a reception unit that is provided on a side opposite to the transmission unit of the object, on the first axis, and a transmission control unit that controls drive of the transmission unit. The transmission unit includes a plurality of transmission elements that transmit ultrasonic waves, and the plurality of transmission elements are arranged in a first direction that intersects the first axis in a plane including the normal line and the first axis. The transmission control unit delay-drives the plurality of transmission elements to align a direction of the ultrasonic wave that is transmitted from the transmission unit with the first axis.

A haptic interface of the ‘mid-air’ type, including a control circuit, a plurality of ultrasonic transducers connected to the circuit, which includes a first set of transducers emitting at a first ultrasound carrier frequency and at least a second set of transducers emitting at a second ultrasound carrier frequency different from the first; the control circuit being configured for modulating the signals sent to the transducers in order to generate, with the ultrasound waves emitted by at least a part of the transducers of the first set, an acoustic pressure detectable by touch within at least a first focal region, and generate, with the ultrasound waves emitted by at least a part of the transducers of the second set, an acoustic pressure detectable by touch within at least a second focal region.

A display module and a fabrication method thereof, and a display device, and relates to the field of display technologies, to synchronously implement a display function and a surface tactile reproduction function. The display module includes: a base substrate, a plurality of piezoelectric structures positioned on a first side of the base substrate, and at least one isolation portion positioned on the first side of the base substrate and configured to separate any two adjacent piezoelectric structures. A pixel hole is arranged in at least one of three positions, i.e., a position of the piezoelectric structure, a position of the isolation portion, and a position between the piezoelectric structure and the isolation portion. The display module also includes a plurality of pixel structures, and each of the plurality of pixel structures is positioned in one of the pixel holes.

A transducer, a method of manufacturing a transducer, and a transducing device are provided. The transducer includes a receiving unit and a transmitting unit. The receiving unit includes a first receiving electrode, a first piezoelectric film, and a second receiving electrode which are sequentially stacked, and the receiving unit is configured to convert a first acoustic wave signal into an electrical signal by using a piezoelectric effect of the first piezoelectric film. The transmitting unit is configured to receive a control signal, which is based on the electrical signal, to transmit a second acoustic wave signal.

A vibration device that includes a flat plate that has a first main surface and a second main surface; a vibrator that is configured to vibrate along a first direction parallel to the first main surface; a connecting member that connects the vibrator to the first main surface of the flat plate; a support member having a cavity or a recess in a portion thereof facing the vibrator; and a cushioning material connecting the first main surface of the flat plate to the support member, the cushioning material being disposed so as to not overlap with the vibrator in a plan view of the vibration device. A combined length of the vibrator and the connecting member in a second direction perpendicular to the first main surface of the flat plate is larger than a length of the cushioning material in the second direction.

Ultrasonic sensing approaches are described with integrated MEMS-CMOS implementations. Embodiments include ultrasonic sensor arrays for which PMUT structures of individual detector elements are at least partially integrated into the CMOS ASIC wafer. MEMS heating elements are integrated with the PMUT structures by integrating under the PMUT structures in the CMOS wafer and/or over the PMUT structures (e.g., in the protective layer). For example, embodiments can avoid wafer bonding and can reduce other post processing involved with conventional manufacturing of PMUT ultrasonic sensors, while also improving thermal response.

A micromachined ultrasonic transducer (MUT). The MUT includes: a substrate; a membrane suspending from the substrate; a bottom electrode disposed on the membrane; a piezoelectric layer disposed on the bottom electrode and an asymmetric top electrode is disposed on the piezoelectric layer. The areal density distribution of the asymmetric electrode along an axis has a plurality of local maxima, wherein locations of the plurality of local maxima coincide with locations where a plurality of anti-nodal points at a vibrational resonance frequency is located.