Patent classifications
B08B3/14
Method And Apparatus For Support Removal Using Directed Atomized And Semi-Atomized Fluid
An apparatus and method for removing support material from and/or smoothing surfaces of an additively manufactured part (the “AM part”) is disclosed. The apparatus may include a chamber, a support surface within the chamber, one or more nozzles within the chamber, a tank positioned below the nozzles, and a diverter positioned between the nozzles and the tank. The support surface may be configured to support the AM part and may have one or more openings configured to allow the fluid to pass through the opening(s). The nozzles may be configured to spray a fluid at the AM part, and the spray may be an atomized or semiatomized spray of the fluid. The diverter comprises an umbrella or a diverter shield and diverts sprayed fluid from directly impacting the fluid being collected in the tank, whereby foaming of the fluid in the tank is reduced.
Method And Apparatus For Support Removal Using Directed Atomized And Semi-Atomized Fluid
An apparatus and method for removing support material from and/or smoothing surfaces of an additively manufactured part (the “AM part”) is disclosed. The apparatus may include a chamber, a support surface within the chamber, one or more nozzles within the chamber, a tank positioned below the nozzles, and a diverter positioned between the nozzles and the tank. The support surface may be configured to support the AM part and may have one or more openings configured to allow the fluid to pass through the opening(s). The nozzles may be configured to spray a fluid at the AM part, and the spray may be an atomized or semiatomized spray of the fluid. The diverter comprises an umbrella or a diverter shield and diverts sprayed fluid from directly impacting the fluid being collected in the tank, whereby foaming of the fluid in the tank is reduced.
Wash pad with debris conveyor apparatus
A wash fluid and debris containment system includes a wash pad, a collecting trough, and a conveyor. The wash pad includes a support base and a top surface that rests on the support base. The top surface is configured to direct flow of wash fluid and debris to an edge of the top surface. The collecting trough extends along the edge to receive the wash fluid and debris from the top surface. The conveyor is positioned in at least a portion of the collecting trough and operable to remove the debris from an opposite end of the collecting trough from where the wash fluid is removed.
Wash pad with debris conveyor apparatus
A wash fluid and debris containment system includes a wash pad, a collecting trough, and a conveyor. The wash pad includes a support base and a top surface that rests on the support base. The top surface is configured to direct flow of wash fluid and debris to an edge of the top surface. The collecting trough extends along the edge to receive the wash fluid and debris from the top surface. The conveyor is positioned in at least a portion of the collecting trough and operable to remove the debris from an opposite end of the collecting trough from where the wash fluid is removed.
Apparatus And Method For Processing Semiconductor Wafer Surface With Ozone-Containing Fluid
An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus includes an ozone generator, a solvent flask, a gas-liquid mixing device, and a processing chamber capable of receiving the semiconductor wafer. The apparatus may also include one or more gas-liquid separation devices and switching valves. The processing chamber allows the ozone-containing fluids to enter the processing chamber for treating the wafer surface. The effectiveness of the treatment is ensured by enhancing the ozone concentration of the ozone-containing fluids inside the processing chamber, in either or both gas and liquid phases. The employment of a micro chamber as the processing chamber also helps to reduce the consumption of the treatment gas and liquid, as well as the resulted waste emission.
Apparatus And Method For Processing Semiconductor Wafer Surface With Ozone-Containing Fluid
An apparatus and a method for processing one or more surfaces of a semiconductor wafer with one or more ozone-containing fluids are provided. The apparatus includes an ozone generator, a solvent flask, a gas-liquid mixing device, and a processing chamber capable of receiving the semiconductor wafer. The apparatus may also include one or more gas-liquid separation devices and switching valves. The processing chamber allows the ozone-containing fluids to enter the processing chamber for treating the wafer surface. The effectiveness of the treatment is ensured by enhancing the ozone concentration of the ozone-containing fluids inside the processing chamber, in either or both gas and liquid phases. The employment of a micro chamber as the processing chamber also helps to reduce the consumption of the treatment gas and liquid, as well as the resulted waste emission.
Method and system for the in-situ removal of carbonaceous deposits from heat exchanger tube bundles
The present invention comprises a method and system for the in-situ cleaning of a heat exchanger tube bundle of carbonaceous deposits. Using the method and system, an organic solvent is brought into fluid communication with one or more heat exchanger tube bundles in a closed system. The closed system is formed at the site of operation of the heat exchanger tube bundles and without having to remove the heat exchanger tube bundles from their shells or other associated equipment. Once the closed system is formed, the organic solvent is brought to a temperature at which it is effective to remove carbonaceous deposits from the heat exchanger tube bundle and flowed through the equipment associated with the heat exchanger tube bundles so as to contact the heat exchanger tube bundles and remove carbonaceous deposits that have formed therein. In some embodiments, the spent organic solvent may be recovered, such as through the removal of suspended hydrocarbons, and reused in the method and system for cleaning heat exchanger tube bundles.
LOTUS EFFECT WASHING MACHINE
This washing machine for a railway vehicle includes a water texturing system, mixing water with particles able to produce textured water having super-hydrophoby properties making it possible to implement a lotus cleaning effect on the surface on which the textured water flows; a textured water spraying system, fed by the water texturing system and using at least one appropriate spraying device to spray the textured water on a surface of the railway vehicle to be cleaned.
LOTUS EFFECT WASHING MACHINE
This washing machine for a railway vehicle includes a water texturing system, mixing water with particles able to produce textured water having super-hydrophoby properties making it possible to implement a lotus cleaning effect on the surface on which the textured water flows; a textured water spraying system, fed by the water texturing system and using at least one appropriate spraying device to spray the textured water on a surface of the railway vehicle to be cleaned.
PROCESS AND SYSTEM FOR WASHING ITEMS RESULTING FROM AN INDUSTRIAL PRODUCTION BY USING SOLVENTS
An industrial washing process for various items such as precision small parts, mechanical parts, printed circuits, lenses, watchmaking articles, jewelry, eyewear or the like, includes regeneration of the used solvent by means of a first distillation and the step of drying the material in a vacuum chamber. The regeneration step includes at least one step of distillation through thermocompression carried out by compressing the solvent vapors by a pump and conveying them to an exchanger at higher pressure and temperature than the distiller. In this way the liquid to be evaporated can be used to condense the vapors with total recovery of the condensation energy, in this way avoiding the use of external thermal energy sources and obtaining a very high distillation capacity with lower energy consumption compared to a traditional condenser, and can also be used in a vacuum distillation step, if necessary, to further concentrate the distillation residues.