The invention is a system for drying, recycling, and washing off residual resin from 3D-printed objects. Some aspects of the invention include a system for recycling solvents used to clean the 3D-printed objects in a washing chamber. The recycling system may include one or more solvent reservoirs that store a solvent for cleaning residual 3D-printing material off of 3D-printed objects, a wash chamber adapted to clean the 3D-printed objects, and a solvent recycling module. The solvent recycling module receives a saturated solvent from the one or more solvent reservoirs, evaporates or condenses the saturated solvent to remove residual 3D-printing material from the saturated solvent, and returns clean solvent to the one or more solvent reservoirs of the system.

To measure the concentration of an oxidant in an oxidative cleaning liquid used in a process of cleaning an electronic material in a simple, easy, consistent, and accurate manner without being affected by impurities included in the cleaning liquid, such as metals. A method for measuring the concentration of an oxidant in a sample liquid used as a cleaning liquid in a process of cleaning an electronic material includes decomposing at least part of an oxidant included in the sample liquid by heating or the like; measuring the amount of oxygen gas generated by decomposition of the oxidant; and determining the concentration of the oxidant in the sample liquid on the basis of the amount of the oxygen gas.

To measure the concentration of an oxidant in an oxidative cleaning liquid used in a process of cleaning an electronic material in a simple, easy, consistent, and accurate manner without being affected by impurities included in the cleaning liquid, such as metals. A method for measuring the concentration of an oxidant in a sample liquid used as a cleaning liquid in a process of cleaning an electronic material includes decomposing at least part of an oxidant included in the sample liquid by heating or the like; measuring the amount of oxygen gas generated by decomposition of the oxidant; and determining the concentration of the oxidant in the sample liquid on the basis of the amount of the oxygen gas.

The present invention provides a pump for supplying a liquid. The pump comprises: a tube member having a hose communicating with a chemical liquid inlet and a chemical liquid outlet, and a cylindrical drum provided to wind the hose, and configured to discharge a chemical liquid through a volume change caused by contraction of the hose wound around the drum; and a driver configured to provide a rotational force such that the hose is wound around the drum.

The present invention provides a pump for supplying a liquid. The pump comprises: a tube member having a hose communicating with a chemical liquid inlet and a chemical liquid outlet, and a cylindrical drum provided to wind the hose, and configured to discharge a chemical liquid through a volume change caused by contraction of the hose wound around the drum; and a driver configured to provide a rotational force such that the hose is wound around the drum.

A system for and method of removing residues, deposits, and debris from a substrate that has been marked by a chemical etching process is disclosed. The system includes one or more upper sprayers that deposit a cleaning solution to a top surface of the product as it passes beneath the one or more upper sprayers. The system further includes at least one upper brush that operates to scrub the top surface of the product after the cleaning solution has been applied thereto. The system optionally includes one or more lower sprayers and lower brushes to clean a bottom surface of the product as it is conveyed through the system. The system further includes an air knife system that assists with drying the product prior to exiting the system. The system further includes a controller that is operable to adjust various system parameters.

A system for and method of removing residues, deposits, and debris from a substrate that has been marked by a chemical etching process is disclosed. The system includes one or more upper sprayers that deposit a cleaning solution to a top surface of the product as it passes beneath the one or more upper sprayers. The system further includes at least one upper brush that operates to scrub the top surface of the product after the cleaning solution has been applied thereto. The system optionally includes one or more lower sprayers and lower brushes to clean a bottom surface of the product as it is conveyed through the system. The system further includes an air knife system that assists with drying the product prior to exiting the system. The system further includes a controller that is operable to adjust various system parameters.

A cleaning system for processing a substrate after polishing includes a sulfuric peroxide mix (SPM) module, at least two cleaning elements, and a plurality of robots. The SPM module includes a sulfuric peroxide mix (SPM) cleaner having a first container to hold a sulfuric peroxide mix liquid and five to twenty first supports to hold five to twenty substrates in the liquid in the first container, and a rinsing station having a second container to hold a rinsing liquid and five to twenty second supports to hold five to twenty substrates in the liquid in the second container. Each of the at least two cleaning elements are configured to process a single substrate at a time. Examples of a cleaning element include a megasonic cleaner, a rotating brush cleaner, a buff pad cleaner, a jet spray cleaner, a chemical spin cleaner, a spin drier, and a marangoni drier.

A cleaning system for processing a substrate after polishing includes a sulfuric peroxide mix (SPM) module, at least two cleaning elements, and a plurality of robots. The SPM module includes a sulfuric peroxide mix (SPM) cleaner having a first container to hold a sulfuric peroxide mix liquid and five to twenty first supports to hold five to twenty substrates in the liquid in the first container, and a rinsing station having a second container to hold a rinsing liquid and five to twenty second supports to hold five to twenty substrates in the liquid in the second container. Each of the at least two cleaning elements are configured to process a single substrate at a time. Examples of a cleaning element include a megasonic cleaner, a rotating brush cleaner, a buff pad cleaner, a jet spray cleaner, a chemical spin cleaner, a spin drier, and a marangoni drier.

Disclosed are an apparatus and a method for liquid-treating a substrate. An apparatus for treating a substrate includes a liquid treatment chamber that supplies a liquid onto the substrate to liquid-treat the substrate, a drying chamber that removes the remained liquid on the substrate, and a transfer unit that transfers the substrate between the liquid treatment chamber and the drying chamber, wherein the transfer unit includes a hand that supports the substrate, and a weight measuring unit that measures a weight of the remained liquid on the substrate. A weight of a remained liquid on a substrate may be measured by measuring a weight of the substrate while the substrate is transferred.