A device for treating 3D powder printing elements includes a first chamber with a first partial chamber and a second partial chamber separated by at least one screen grid. Grid meshes allow compressed powder residues to pass through. A rotation means rotates the first chamber about an axis of rotation, in particular with a rotary passage. The screen grid is inclined, in particular perpendicular, to the axis of rotation of the first chamber. A filling region allows filling the 3D powder printing elements into the first partial chamber. Gas medium is supplied in the first chamber, in particular in the first partial chamber. Gas medium suction means extract plastic powder residues from the first chamber, in particular from the second partial chamber. The gas medium suction means are mounted in or parallel to the axis of rotation and/or centered by the rotary means, in particular within the rotary passage.

The present invention provides a new filter cleaning method that has cleaning performance superior to that of ultrasonic cleaning. The method for cleaning a filter of the present invention includes the steps of: generating a shock wave; and bringing the shock wave into contact with a filter to which a filler adhered, wherein in the shock wave contacting step, a pressure applied to the filter by the shock wave is 0.07 MPa or more.

A reusable apparatus, such as a medical instrument or tool, is decontaminated by applying at least one of pressure waves, shockwaves, and ultrasound waves in a sufficient dosage to remove contamination but without adversely affecting the ability to reuse the apparatus.

A method for cleaning an object having a surface, the method including steps of (1) delivering acoustic waves to the object to dislodge debris from the surface; (2) delivering a cleaning medium to the surface to collect dislodged debris; (3) delivering the acoustic waves to the object to acoustically treat and atomize the cleaning medium and the dislodged debris; (4) applying a vacuum airflow to collect atomized cleaning medium and dislodged debris; (5) delivering a rinsing medium to the surface; (6) delivering the acoustic waves to the object to acoustically treat and atomize the rinsing medium; and (7) applying the vacuum airflow to collect atomized rinsing medium.

A sorptive wiper for cleaning is disclosed, the wipe comprising a cleaned and dried sorptive material having fewer than 150 contaminant fibers per square meter that are greater than 100 μm in length.

An apparatus includes a lens, a transducer and a driver, where the lens has a first side, a second side, and a lens radius, and the transducer has a transducer outer radius. The transducer is coupled to the first side of the lens, and the transducer outer radius is less than the lens radius. The driver has output terminals coupled to the transducer and is configured to provide an oscillating drive signal at a non-zero frequency to vibrate the lens. An o-ring is positioned between a clamp and the second side of the lens, where the o-ring has a nominal radius that is less than or equal to a nominal radius of the transducer.

A reusable apparatus, such as a medical instrument or tool, is decontaminated by applying pressure waves with direct contact of the pressure wave applicator to the reusable apparatus in an open bath in a sufficient dosage to remove contamination but without adversely affecting the ability to reuse the apparatus.

A sensor system includes: a housing having an internal wall defining an opening; a transparent window mounted within the opening; a sensor device within the housing and having at least one of a sensor output or a sensor input alignable with the transparent window; a vibration device in communication with the transparent window, where the vibration device is controllable to produce a first sonic movement; where the transparent window is movably responsive to the first sonic movement with a second sonic movement; and at least one damping member located between the transparent window and the sensor device, where the damping member substantially isolates the sensor device from at least the second sonic movement of the transparent window. A method includes determining a cleaning trigger corresponding to cleaning the transparent window; and controlling, in response to the cleaning trigger, a vibration frequency, amplitude, or duration of the vibration device.

A method for cleaning a semiconductor fabrication equipment part having gas holes used in single-wafer type semiconductor fabrication equipment for processing semiconductor wafers, wherein the semiconductor fabrication equipment part having gas holes is formed of aluminum or an aluminum alloy, and has a distribution plate having a plurality of gas holes, the method including: a step (1) of scanning a gas injection surface of the distribution plate, which is a surface facing the wafer, with a laser beam; and a step (2) of bringing the gas injection surface and insides of the gas holes into contact with a cleaning liquid containing an inorganic acid.

A substrate plate for an interchangeable container that can be inserted into an apparatus for layer-by-layer application and selective solidification of a pulverulent build material for producing a three-dimensional object is provided. The substrate plate includes a surface on which the three-dimensional object is built, and a connection interface situated opposite to the surface. A transmission element is capable of being connected to the connection interface. At least one actuator is capable of being connected in a force-fitting and/or form-fitting manner to the substrate plate or to the transmission element fastened to the substrate plate. The at least one actuator is capable of being excited to oscillate by a generator.