Patent classifications
B22F1/0545
Plurality of flaky magnetic metal particles, pressed powder material, and rotating electric machine
Provided is a plurality of flaky magnetic metal particles of embodiments, each flaky magnetic metal particle having a flat surface having either or both of a plurality of concavities and a plurality of convexities, the concavities or convexities being arranged in a first direction and each having a width of 0.1 μm or more, a length of 1 μm or more, and an aspect ratio of 2 or higher; and a magnetic metal phase containing at least one primary element selected from the group consisting of iron (Fe), cobalt (Co), and nickel (Ni). The flaky magnetic metal particles have an average thickness of between 10 nm and 100 μm inclusive, and the average value of the ratio of the average length within the flat surface with respect to the thickness is between 5 and 10,000 inclusive.
Plurality of flaky magnetic metal particles, pressed powder material, and rotating electric machine
Provided is a plurality of flaky magnetic metal particles of embodiments, each flaky magnetic metal particle having a flat surface having either or both of a plurality of concavities and a plurality of convexities, the concavities or convexities being arranged in a first direction and each having a width of 0.1 μm or more, a length of 1 μm or more, and an aspect ratio of 2 or higher; and a magnetic metal phase containing at least one primary element selected from the group consisting of iron (Fe), cobalt (Co), and nickel (Ni). The flaky magnetic metal particles have an average thickness of between 10 nm and 100 μm inclusive, and the average value of the ratio of the average length within the flat surface with respect to the thickness is between 5 and 10,000 inclusive.
SILVER SINTERING PREPARATION AND THE USE THEREOF FOR THE CONNECTING OF ELECTRONIC COMPONENTS
A silver sintering preparation in the form of a silver sintering paste comprising 70 to 95 wt.-% of coated silver particles (A) and 5 to 30 wt.-% of organic solvent (B) or in the form of a silver sintering preform comprising 74.5 to 100 wt.-% of coated silver particles (A) and 0 to 0.5 wt.-% of organic solvent (B), wherein the coating of the coated silver particles (A) comprises silver acetylacetonate (silver 2,4-pentanedionate) and/or at least one silver salt of the formula C.sub.nH.sub.2n+1COOAg with n being an integer in the range of 7 to 10, and wherein the at least one silver salt is thermally decomposable at >160° C.
METHOD OF MAKING SILVER NANOPARTICLES
A method of synthesis of silver nanoparticles (AgNP's) using an orange peel extract is described. The method includes preparing an orange peel extract by cutting a portion of an orange peel into smaller pieces and washing the cut orange peel pieces with de-ionized water to form a washed orange peel. The method further includes boiling the washed orange peel in de-ionized water for at least 3 minutes to form an extract solution and filtering the extract solution from the orange peel to obtain the orange peel extract. The method further includes forming a synthesis mixture of at least one silver salt and the orange peel extract and reacting the silver salt and the orange peel extract to form the silver nanoparticles within 1 minute. The silver nanoparticles find application in detection of mercury ions in an aqueous solution.
Method of manufacturing copper nano-ink and copper nano-ink
A method of manufacturing a copper nano-ink includes: a step of preparing a copper nanoparticle aqueous dispersion liquid including copper nanoparticles and anions; and a step of storing the copper nanoparticle aqueous dispersion liquid at 5° C. or less after the step of preparing, wherein in the step of storing, a copper ion concentration of the copper nanoparticle aqueous dispersion liquid is controlled to be greater than or equal to 0.1 g/L and less than or equal to 1.0 g/L and an anion concentration is controlled to be greater than or equal to 0.5 g/L and less than or equal to 8.0 g/L.
COPPER PARTICLES AND METHOD FOR PRODUCING SAME
Copper particles are provided that each include a core particle made of copper and a coating layer that coats the surface of the core particle, wherein the coating layer is made of a copper salt of an aliphatic organic acid. It is also preferable that the copper particles have an infrared absorption peak in a range of 1504 to 1514 cm.sup.−1 and no infrared absorption peak in a range of 1584 to 1596 cm.sup.−1. It is also preferable that, in thermogravimetric analysis of the copper particles, the temperature at which the ratio of the mass loss value to the mass loss value at 500° C. reaches 10% is from 150° C. to 220° C. A method is also provided for producing copper particles, the method including bringing core particles made of copper into contact with a solution containing a copper salt of an aliphatic organic acid to thereby coat the surface of the core particles.
Method for preparing dispersed metal nanoparticles and metal nanoparticles prepared thereby
The present disclosure relates to a dispersed metal nanoparticle synthesis method and metal nanoparticles prepared thereby. Specifically, the present disclosure relates to a method of effectively preparing a dispersed metal nanoparticle using Taylor vortex flow even when using a small amount of stabilizer or using no stabilizer, and well-dispersed nanoparticles obtained thereby.
PLASMON HIERARCHICAL STRUCTURE HAVING NANOGAP AND MANUFACTURING METHOD THEREFOR
A plasmonic hierarchical structure according to an embodiment includes a nanogap formed between metal nanoparticles. The nanogap has a width of 1 nm to 100 nm. The metal nanoparticles comprise at least one selected from the group consisting of gold (Au), silver (Ag), copper (Cu), platinum (Pt), and palladium (Pd). The plasmonic hierarchical structure further includes silica (SiO.sub.2) nanoparticles or CdSe quantum dots. A method for producing a plasmonic hierarchical structure according to an embodiment includes: injecting a metal nanoparticle solution into a micropipette; releasing the metal nanoparticle solution by bringing the micropipette into contact with a substrate; and forming a meniscus of the released metal nanoparticle solution, thereby producing a plasmonic hierarchical structure.
SILVER SINTERING COMPOSITION CONTAINING COPPER ALLOY FOR METAL BONDING
This invention relates to a silver sintering composition. In particular, the present invention relates to a silver sintering composition containing a copper alloy, which is capable of being stably sintered on various metal substrates such as copper, gold or silver with good adhesion and sintering strength.
Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
A method for fabricating a single electron transistor is provided. A substrate includes a substantially planar surface with a source electrode, a drain electrode, and a gate electrode thereon, with the source and drain electrodes spaced apart from one another by a gap. The source electrode and the drain electrode are electrified, and a single nanometer-scale conductive particle is electrospray deposited in the gap. The single nanometer-scale conductive particle has an effective size of not greater than 10 nanometers. At least one carbon nanotube is deposited on the substrate and subjected to dielectrophoresis to position the carbon nanotube within 1 nanometer of the single nanometer-scale conductive particle. The at least one carbon nanotube establishes a first connection between the source electrode and the single nanometer-scale conductive particle and a second connection between the drain electrode and the single nanometer-scale conductive particle.