Example nanoparticles may include an iron-based core, and a shell. The shell may include a non-magnetic, anti-ferromagnetic, or ferrimagnetic material. Example alloy compositions may include an iron-based grain, and a grain boundary. The grain boundary may include a non-magnetic, anti-ferromagnetic, or ferrimagnetic material. Example techniques for forming iron-based core-shell nanoparticles may include depositing a shell on an iron-based core. The depositing may include immersing the iron-based core in a salt composition for a predetermined period of time. The depositing may include milling the iron-based core with a salt composition for a predetermined period of time. Example techniques for treating a composition comprising core-shell nanoparticles may include nitriding the composition.

Example nanoparticles may include an iron-based core, and a shell. The shell may include a non-magnetic, anti-ferromagnetic, or ferrimagnetic material. Example alloy compositions may include an iron-based grain, and a grain boundary. The grain boundary may include a non-magnetic, anti-ferromagnetic, or ferrimagnetic material. Example techniques for forming iron-based core-shell nanoparticles may include depositing a shell on an iron-based core. The depositing may include immersing the iron-based core in a salt composition for a predetermined period of time. The depositing may include milling the iron-based core with a salt composition for a predetermined period of time. Example techniques for treating a composition comprising core-shell nanoparticles may include nitriding the composition.

Method for interconnecting components of an electronic system comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles, more than 95.0%, preferably more than 99.0% of the mass of the metal nanoparticles comprising a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles, more than 95.0%, preferably more than 99.0% of the mass of the metal nanoparticles comprising a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system, the method comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles. the metal nanoparticles comprising for more than 95.0%, preferably for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one agglomerate in which the stabilizing agent binds them together and maintains at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer by bringing the agglomerate into contact with at least one destabilizing agent configured to desorb the stabilizing agent from the metal nanoparticles in order to aggregate and coalesce said metal nanoparticles between themselves, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system, the method comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles. the metal nanoparticles comprising for more than 95.0%, preferably for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one agglomerate in which the stabilizing agent binds them together and maintains at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer by bringing the agglomerate into contact with at least one destabilizing agent configured to desorb the stabilizing agent from the metal nanoparticles in order to aggregate and coalesce said metal nanoparticles between themselves, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Methods for forming samples of noble metal bipyramid nanocrystals having very low size and shape polydispersities from samples of mixed noble metal nanocrystals are provided. The samples include those comprising high purity, substantially monodisperse, plasmonic gold bipyramid nanocrystals. Also provided are methods of growing secondary twinned metal nanocrystals using the noble metal bipyramid nanocrystals as seed particles. Like the seed bipyramid nanocrystals from which they are grown, the secondary nanocrystals are twinned nanocrystals and may also be characterized by very low size and shape polydispersities. Secondary twinned nanocrystals grown by these methods include enlarged metal bipyramid nanocrystals and nanocrystals with anisotropic “dumbbell” shapes having a variety of tip geometries. Methods for using noble metal bipyramid nanocrystals as plasmonic heaters to heat reaction solutions via plasmonic-photothermal radiation-to-heat conversion are also provided.

Provided herein are methods of preparing tetrahexahedra nanoparticles and methods of using the tetrahexahedra nanoparticles as an oxidative catalyst.

The present invention relates to novel gold nanocrystals and nanocrystal shape distributions that have surfaces that are substantially free from organic impurities or films. Specifically, the surfaces are “clean” relative to the surfaces of gold nanoparticles made using chemical reduction processes that require organic reductants and/or surfactants to grow gold nanoparticles from gold ions in solution.

The invention includes novel electrochemical manufacturing apparatuses and techniques for making the gold-based nanocrystals. The invention further includes pharmaceutical compositions thereof and the use of the gold nanocrystals or suspensions or colloids thereof for the treatment or prevention of diseases or conditions for which gold therapy is already known and more generally for conditions resulting from pathological cellular activation, such as inflammatory (including chronic inflammatory) conditions, autoimmune conditions, hypersensitivity reactions and/or cancerous diseases or conditions. In one embodiment, the condition is mediated by MIF (macrophage migration inhibiting factor).

Disclosed is a double frame nanoparticle synthesis method including: forming a first platinum layer of a closed loop structure on an edge region of a 2-dimensional gold nanoparticle; removing a portion of the gold nanoparticle in an exposed inner region thereof free of the first platinum layer, thereby forming a single frame structure; growing a first gold thin film on the single frame structure; forming a second platinum layer on inner and outer edge regions of the first gold thin film; removing a portion of the first gold thin film in an exposed region thereof free of the second platinum layer, thereby forming a double frame structure, wherein the double frame structure has an inner frame of a closed loop structure, and an outer frame having a closed loop structure surrounding the inner frame, and partially connected to the inner frame; and forming a second gold thin film on a surface of the double frame structure.