A copper-carbon composite forming mixture includes multiple carbon particles each plated with copper. The carbon particles prior to plating have an average size ranging between approximately 0.5 microns to 500 microns. Multiple copper particles are combined with the multiple carbon particles plated with copper to form a mixture. The mixture is either pre-heated prior to extrusion or extruded at ambient temperature to form a copper-carbon composite having a conductivity greater than a conductivity of copper at temperatures approximately 500 degrees Kelvin.

A hollow sphere structure of metal-containing tungsten carbide (WC-based cermet contains one or two metal elements to form a pseudo binary eutectic) is provided, which includes a porous shell of metal-containing metal carbide surrounding a hollow core. The hollow sphere structure has a diameter of 5 micrometers to 45 micrometers, and the porous shell has a thickness of 0.1 micrometers to 12 micrometers. The metal is cobalt, nickel, or a combination thereof

Methods for forming nanostructures of various shapes are disclosed. Nanocubes, nanowires, nanopyramids and multiply twinned particles of silver may by formed by combining a solution of silver nitrate in ethylene glycol with a solution of poly(vinyl pyrrolidone) in ethylene glycol. Hollow nanostructures may be formed by reacting a solution of solid nanostructures comprising one of a first metal and a first metal alloy with a metal salt that can be reduced by the first metal or first metal alloy. Nanostructures comprising a core with at least one nanoshell may be formed by plating a nanostructure and reacting the plating with a metal salt.

Methods for forming nanostructures of various shapes are disclosed. Nanocubes, nanowires, nanopyramids and multiply twinned particles of silver may by formed by combining a solution of silver nitrate in ethylene glycol with a solution of poly(vinyl pyrrolidone) in ethylene glycol. Hollow nanostructures may be formed by reacting a solution of solid nanostructures comprising one of a first metal and a first metal alloy with a metal salt that can be reduced by the first metal or first metal alloy. Nanostructures comprising a core with at least one nanoshell may be formed by plating a nanostructure and reacting the plating with a metal salt.

Provided are a silver powder and a method of producing the same. The method of producing the silver powder includes a first surface smoothing step of causing fine silver particles having internal voids to mechanically collide with one another; a fine powder removal step of dispersing fine silver particles present after the first surface smoothing step using high-pressure airflow while removing fine powder; and a second surface smoothing step of causing fine silver particles present after the fine powder removal step to mechanically collide with one another.

The present specification relates to a metal nanoparticle. Specifically, the present specification relates to a metal nanoparticle having a cavity.

Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste.

Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2=380.2 in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2=380.2 in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250 C., 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.

A multi-layer thermal barrier may be applied to a surface of components within an internal combustion engine. The multi-layer thermal barrier provides low thermal conductivity and low heat capacity insulation that is sealed against combustion gasses. The multi-layer thermal barrier includes two, three, or more layers, bonded to one another, e.g., a first (bonding) layer, a second (insulating) layer, and a third (sealing) layer. The insulating layer is disposed between the bonding layer and the sealing layer. The bonding layer is bonded to the component. The insulating layer includes hollow microstructures that may be sintered together to form insulation that provides a low effective thermal conductivity and low effective heat capacity. The sealing layer may be formed of a ceramic material, and the insulating layer may include deformed microstructures having a greater width than height.

A process for the synthesis of nanostructured metallic hollow spherical particles, in which the metal is deposited onto sacrificial masks formed in a polymeric colloidal solution by the electroless autocatalytic deposition method. Deposition releases only gaseous products (N.sub.2 and H.sub.2) during the oxidation thereof, which evolve without leaving contaminants in the deposit. The particulate material includes nanostructured metallic hollow spherical particles with average diameter ranging from 100 nm to 5 ?m and low density with respect to the massic metal. A process for compacting and sintering a green test specimen are also described.

The present specification relates to a hollow metal particle, an electrode catalyst including the same, an electrochemical battery including the electrode catalyst, and a method of manufacturing the hollow metal particle.