Disclosed herein are nanohybrid and nanocomposite compositions and methods. In a specific embodiment, the method for making a nanohybrid composition includes: contacting a carrier material with metallic salt precursors to make a first mixture, contacting the first mixture with a reducing agent reacting and a surface activated agent to make a second mixture, where the metallic salt precursors undergo chemical reduction to make metallic nanoparticles, and where the metallic nanoparticles are deposited onto the carrier material, contacting the second mixture with an organosilane coupling agent to make a nanohybrid composition.

To provide a SmFeN-based anisotropic magnetic powder having excellent magnetic properties and a low oxygen content, and a production method thereof. A method of producing a SmFeN-based anisotropic magnetic powder includes preparing a SmFeN-based anisotropic magnetic powder before dispersion containing Sm, Fe, and N; and dispersing the SmFeN-based anisotropic magnetic powder before dispersion using resin-coated metal media or resin-coated ceramic media. The SmFeN-based anisotropic magnetic powder contains Sm, Fe, and N and has an average particle size in a range from 2.5 ?m to 5 ?m, a residual magnetization ?r of 150 emu/g or more, and an oxygen content of 0.4 mass % or less.

An nitrogen solid solution titanium sintered compact includes a matrix made of a titanium component having an -phase, nitrogen atoms dissolved as a solute of solid solution in a crystal lattice of the titanium component, and metal atoms dissolved as a solute of solid solution in the crystal lattice of the titanium component.

The present invention relates to a metal paste for forming a metal wiring containing a solid content of a silver particle and kneaded with a solvent. The solid content of the metal paste contains a silver particle having prescribed particle size distribution and average particle size, and using an amine compound as a protective agent. The solvent is a mixed solvent in which two organic solvents of a solvent A and a solvent B are mixed. The solvent A is dihydroterpineol or terpineol, and the solvent B is at least one organic solvent having a boiling point of 240? C. or more. The mixed solvent has a Hansen solubility parameter distance Ra from dihydroterpineol of 3.0 MPa.sup.1/2 or less. The metal paste further contains a high molecular weight ethyl cellulose as a first additive, and a polyvinyl acetal resin as a second additive.

Embodiments of the present invention relate to methods for preparing high optical density solutions of nanoparticle, such as nanoplates, silver nanoplates or silver platelet nanoparticles, and to the solutions and substrates prepared by the methods. The process can include the addition of stabilizing agents (e.g., chemical or biological agents bound or otherwise linked to the nanoparticle surface) that stabilize the nanoparticle before, during, and/or after concentration, thereby allowing for the production of a stable, high optical density solution of silver nanoplates. The process can also include increasing the concentration of silver nanoplates within the solution, and thus increasing the solution optical density.

A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 m and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.

A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 m and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.

The present disclosure describes three-dimensional printing kits, systems for three-dimensional printing, and methods of three-dimensional printing. In one example, a three-dimensional printing kit can include a particulate build material and a binding agent. The particulate build material can include metal particles. The binding agent can include a polyhydroxy polyol and a water-dispersible blocked polyisocyanate having multiple blocked isocyanate groups. The blocked isocyanate groups can include a blocking group bonded to the carbon atom of the blocked isocyanate group through a labile bond breakable by heating to a deblocking temperature. Breaking the labile bond can produce a released blocking group reacted with hydrogen and an isocyanate group.

The present invention provides a method for producing an alloy powder, and an alloy powder, a paste, and a capacitor prepared by the method, wherein the method can obtain particles with a shape more similar to a spherical shape; the solidified particles form a denser surface layer after quenching; the chemically passivated surface layer is physically compacted by impact to form a dense protective layer. The high-stability alloy powder particles have a more stable chemical property and good dispersibility.

A dispersion which contains a dispersant and particles selected from among metal particles and metal oxide particles, and which is characterized in that: the dispersant has a chemical structure that is able to be bonded or adsorbed to the particles; and the dispersant contains a low-molecular-weight dispersant that has at least one peak within a molecular weight region of 31 or more but less than 1,000 in the molecular weight distribution curve in terms of polyethylene glycol as determined by gel permeation chromatography and a high-molecular-weight dispersant that has at least one peak within a molecular weight region of 1,000 or more but 40,000 or less in the above-described molecular weight distribution curve.