A three-dimensional (3D) printer and method are provided, including a substrate, a liquid deposition device configured to deposit a liquid dispersion including a suspension of a particulate material in a liquid vehicle, the liquid vehicle including a solvent but devoid of a binder material, onto the substrate to form a non-patterned layer on the substrate, a solvent removal device configured to remove at least a portion of the solvent from the liquid vehicle from the non-patterned layer to form a dried non-patterned layer, and a liquid binder print head configured to deposit a liquid binder onto the dried non-patterned layer to form a printed pattern on the dried non-patterned layer.

The reaction between aluminum metal and water holds promise for producing hydrogen; however, solid aluminum metal is difficult to manage and use, and the reactivity between aluminum and water is often difficult to control. Certain embodiments of the disclosure are related to a water-stable aluminum slurry comprising a plurality of activated aluminum particles dispersed in a fluid carrier. In some embodiments, the reactivity of the aluminum slurry in the presence of water may be easily controlled with the addition of various additives (e.g., surfactants). Additionally, methods of making and using the water-stable aluminum slurry to controllable manage the reactivity between aluminum and water are presented herein.

The invention relates to a pretreatment process for a brazing composition that comprises metallic particles with a granulometry in the order of the micrometer or nanometer, one or several binders and one or several solvents, said process comprising: a desolvation step of the brazing composition, so as to obtain a desolvated brazing composition, then a compacting step of the desolvated brazing composition so as to obtain a preform of metallic particles, said preform being able to be used for the sintering of an electronic, photonic, thermal or mechanical component onto a substrate, the brazing composition being represented either by a brazing paste, or by a suspension of metallic or metallic oxalate grains in suspension in a solvent.

The invention relates to a pretreatment process for a brazing composition that comprises metallic particles with a granulometry in the order of the micrometer or nanometer, one or several binders and one or several solvents, said process comprising: a desolvation step of the brazing composition, so as to obtain a desolvated brazing composition, then a compacting step of the desolvated brazing composition so as to obtain a preform of metallic particles, said preform being able to be used for the sintering of an electronic, photonic, thermal or mechanical component onto a substrate, the brazing composition being represented either by a brazing paste, or by a suspension of metallic or metallic oxalate grains in suspension in a solvent.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E−9 Ω*m to about 742.5×E−9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

Provided is a method for producing a composite alloy for use in an electrode for an alkaline storage battery, including a powder preparation step of preparing a hydrogen storage alloy powder containing Ti and Cr and having a BCC structure, an etching step of applying an acid to the hydrogen storage alloy powder prepared in the powder preparation step, a Pd film forming step of coating the surface of the hydrogen storage alloy powder subjected to the etching step with Pd using a substitution plating method, and a heat treatment step of heating the hydrogen storage alloy powder having a Pd film formed, at said heating being a temperature of 500° C. or less, wherein in the Pd coating forming step, the hydrogen storage alloy powder is coated with Pd under the condition that the Pd element weight ratio of the composite alloy to be produced is 0.47% or more.

Provided is a method for producing a composite alloy for use in an electrode for an alkaline storage battery, including a powder preparation step of preparing a hydrogen storage alloy powder containing Ti and Cr and having a BCC structure, an etching step of applying an acid to the hydrogen storage alloy powder prepared in the powder preparation step, a Pd film forming step of coating the surface of the hydrogen storage alloy powder subjected to the etching step with Pd using a substitution plating method, and a heat treatment step of heating the hydrogen storage alloy powder having a Pd film formed, at said heating being a temperature of 500° C. or less, wherein in the Pd coating forming step, the hydrogen storage alloy powder is coated with Pd under the condition that the Pd element weight ratio of the composite alloy to be produced is 0.47% or more.

A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.

A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.

This disclosure relates to a fine silver particle dispersion including: (1) 65 to 95.4% by weight of fine silver particles which have an average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having a primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, and (3) 0.1 to 1.0% by weight of ethyl cellulose having a weight average molecular weight of 10,000 to 120,000.