A method for preparing an anhydrous nanoparticle dispersion, comprising providing an aqueous medium comprising a surfactant and a quantity of surfactant-coated nanoparticles suspended in the aqueous medium; (i.) estimating an average particle length and an average particle diameter of the surfactant-coated nanoparticles suspended in the aqueous medium, and estimating a quantity of the surfactant-coated nanoparticles in the aqueous medium; estimating a surface area (SA) of the surfactant-coated nanoparticles in the aqueous medium based on the average particle length and the average particle diameter and the quantity of the surfactant-coated nanoparticles; adjusting a ratio of the quantity of the surfactant-coated nanoparticles to a quantity of the surfactant to a desired value to form a precursor aqueous solution; diluting the precursor aqueous solution with an organic solvent to provide a suspension of surfactant-coated nanoparticles in the solvent, and heating the suspension at about 100° C. for about 20 min to remove remaining water.

A method of additively manufacturing a structure for use in a reactionary process includes forming a material from metal or metal oxide particles, a dispersion solvent, and a binder. The method also includes depositing the material onto a build platform and curing the material to form a structure for use in a reactionary process. The structure includes the metal or metal oxide particles and is configured to provide a reaction when exposed to a reactant.

Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 Ω*m to about 742.5×E-9 Ω*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.

An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

A method for preparing a nano spherical oxide dispersion strengthening phase using a micron oxide is proposed for the first time. First, a micron oxide is used as a raw material to prepare a nano oxide with a completely amorphous structure/matrix alloy composite powder by mechanical ball milling in stages. In the first stage, ball milling is performed, causing the oxide to break and transform in structure, and achieving nano-sizing and completely amorphization, to prepare a composite powder with a completely amorphous structure nano oxide uniformly distributed in the matrix alloy powder; and in the second stage, the composite powder obtained in the first stage and the remaining matrix alloy powder are uniformly mixed by ball milling. Then, the uniformly mixed powder is sequentially subjected to hot forming, hot rolling, and heat treatment, to obtain a nano spherical oxide dispersion strengthened alloy.

An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor.

An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

Provided is a method of making colloidal platinum nanoparticles. The method includes three consecutive steps: dissolving platinum powders by a halogen-containing oxidizing agent in HCl to obtain an inorganic platinum solution containing an inorganic platinum compound; adding a reducing agent into the same reaction vessel to form a mixture solution and heating the mixture solution to undergo a reduction reaction and produce a composition containing platinum nanoparticles, residues and a gas, and guiding the gas out of the reaction vessel, wherein the amount of the residues is less than 15% by volume of the mixture solution; and adding a medium into the same reaction vessel to disperse the platinum nanoparticles to obtain colloidal platinum nanoparticles. The method is simple, safe, time-effective, cost-effective, and has the advantage of high yield.

A dispersion which contains a dispersant and particles selected from among metal particles and metal oxide particles, and which is characterized in that: the dispersant has a chemical structure that is able to be bonded or adsorbed to the particles; and the dispersant contains a low-molecular-weight dispersant that has at least one peak within a molecular weight region of 31 or more but less than 1,000 in the molecular weight distribution curve in terms of polyethylene glycol as determined by gel permeation chromatography and a high-molecular-weight dispersant that has at least one peak within a molecular weight region of 1,000 or more but 40,000 or less in the above-described molecular weight distribution curve.

A three-dimensional printing kit can include a binder fluid and a particulate build material. The particulate build material can include metal particles in an amount from about 95 wt % to about 99.995 wt % and carbon black particles in an amount from about 0.005 wt % to about 2 wt %, wherein weight percentages are based on a total weight of the particulate build material.

There is provided an inexpensive silver particle dispersing solution being usable as a slurry for ink jet, a method for producing the same, and a method for producing a conductive film using the silver particle dispersing solution. In a silver particle dispersing solution containing a silver powder and a solvent, the silver powder has an average primary particle diameter (D.sub.SEM) of 0.15 to 0.5 μm, and the ratio (D.sub.50/D.sub.SEM) of a particle diameter (D.sub.50), which corresponds to 50% of accumulation in volume-based cumulative distribution of the silver powder, to the average primary particle diameter (D.sub.SEM) is not less than 1.7, the silver powder having a fatty acid adhered to the surface thereof, and the solvent containing a monohydric higher alcohol having a carbon number of 6 to 12, butyl carbitol or butyl carbitol acetate as the main component thereof.