A high-performance permanent magnet is provided. A permanent magnet expressed by a composition formula: R.sub.pFe.sub.qM.sub.rCu.sub.tCo.sub.100-p-q-r-t-. The magnet comprises a metal structure including a cell phase having a Th.sub.2Zn.sub.17 crystal phase, and a Cu-rich phase provided to divide the cell phase and having a Cu concentration higher than that of the Th.sub.2Zn.sub.17 crystal phase. An Fe concentration of the Th.sub.2Zn.sub.17 crystal phase is not less than 30 atomic % nor more than 45 atomic %. An average length of the Cu-rich phase is not less than 30 nm nor more than 250 nm.

A high-performance permanent magnet is provided. A permanent magnet expressed by a composition formula: R.sub.pFe.sub.qM.sub.rCu.sub.tCo.sub.100-p-q-r-t-. The magnet comprises a metal structure including a cell phase having a Th.sub.2Zn.sub.17 crystal phase, and a Cu-rich phase provided to divide the cell phase and having a Cu concentration higher than that of the Th.sub.2Zn.sub.17 crystal phase. An Fe concentration of the Th.sub.2Zn.sub.17 crystal phase is not less than 30 atomic % nor more than 45 atomic %. An average length of the Cu-rich phase is not less than 30 nm nor more than 250 nm.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

A permanent magnet is expressed by a composition formula: R.sub.pFe.sub.qM.sub.rCu.sub.sCo.sub.100-p-q-r-s. The magnet includes a crystal grain having a main phase including a TbCu.sub.7 crystal phase, and a volume ratio of the TbCu.sub.7 crystal phase to the main phase is 95% or more.

A permanent magnet is expressed by a composition formula: R.sub.pFe.sub.qM.sub.rCu.sub.sCo.sub.100-p-q-r-s. The magnet includes a crystal grain having a main phase including a TbCu.sub.7 crystal phase, and a volume ratio of the TbCu.sub.7 crystal phase to the main phase is 95% or more.

A method to achieve full densification and grain size control for sintering metal materials, wherein raw material powder is deagglomerated to obtain deagglomerated powder with dispersion. The deagglomerated powder is granulated by spray granulation. The granulated particles are processed by high-pressure die pressing and cold isostatic pressing. The powder compact is sintered by two-step pressureless sintering. The first step is to heat up the powder compact to a higher temperature and hold for a short time to obtain 75-85% theoretical density; the second step is to cool down powder compact to a lower temperature and hold for a long time. The two-step sintering can decrease the sintering temperature, so that the powder compact can be densified at a lower temperature. Thus, the obtained refractory metal product is densified, with ultrafine grains, uniform grain size distribution, and outstanding mechanical properties.

The present disclosure relates to new materials comprising Al, Co, Cr, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 2.2-8.6 wt. % Al, 4.9-65.0 wt. % Co, 4.3-42.0 wt. % Cr, and 4.8-88.6 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, the sigma phase, the bcc phase, and combinations thereof. The new alloys may realize improved high temperature properties.

The present disclosure relates to new materials comprising Al, Co, Cr, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 2.2-8.6 wt. % Al, 4.9-65.0 wt. % Co, 4.3-42.0 wt. % Cr, and 4.8-88.6 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, the sigma phase, the bcc phase, and combinations thereof. The new alloys may realize improved high temperature properties.

The present disclosure relates to new materials comprising Al, Co, Fe, and Ni. The new materials may realize a single phase field of a face-centered cubic (fcc) solid solution structure immediately below the solidus temperature of the material. The new materials may include at least one precipitate phase and have a solvus temperature of at least 1000° C. The new materials may include 4.4-11.4 wt. % Al, 4.9-42.2 wt. % Co, 4.6-28.9 wt. % Fe, and 44.1-86.1 wt. % Ni. In one embodiment, the precipitate is selected from the group consisting of the L1.sub.2 phase, the B2 phase, and combinations thereof. The new alloys may realize improved high temperature properties.