The present invention belongs to the technical field of high throughput preparation and hot working of materials, and in particular to a high throughput micro-synthesis method of multi-component materials based on the temperature gradient field controlled by microwave energy. This invention, characterized by flexible material selection, quick temperature rising and high-efficient heating, uses microwave heating both to achieve quick preparation of small block combinatorial materials under the same temperature field in one time and to realize micro-synthesis under the different temperature gradient fields in one time including high-throughput sintering-melting and heat treatment of materials. This invention successfully overcomes drawbacks of current material preparation, such as unitary combination of components, low-efficient external heating, unique control temperature, huge material consumption and high cost during material preparation and heat treatment.

The present invention belongs to the technical field of high throughput preparation and hot working of materials, and in particular to a high throughput micro-synthesis method of multi-component materials based on the temperature gradient field controlled by microwave energy. This invention, characterized by flexible material selection, quick temperature rising and high-efficient heating, uses microwave heating both to achieve quick preparation of small block combinatorial materials under the same temperature field in one time and to realize micro-synthesis under the different temperature gradient fields in one time including high-throughput sintering-melting and heat treatment of materials. This invention successfully overcomes drawbacks of current material preparation, such as unitary combination of components, low-efficient external heating, unique control temperature, huge material consumption and high cost during material preparation and heat treatment.

A method, apparatus, and program for additive manufacturing. In one aspect, the method and program comprises forming an at least partially solidified portion within a first scan region by irradiating a build material at a first energy density value along a first irradiation path. A second at least partially solidified portion is formed within a second scan region that is spaced with respect to the first scan region, wherein the solidified portion within the first scan region is formed by irradiation a build material at a second energy density value along a second irradiation path. The space between the first scan region and the second scan region is at least partially solidified by irradiating a build material at a third energy density value that less than the first energy density value and the second energy density value.

In an example of a three-dimensional (3D) printing method, a crystalline or semi-crystalline build material is applied. A temperature of the crystalline or semi-crystalline build material is maintained within 100 C. below a melting point of the crystalline or semi-crystalline build material. A melt flow property reduction agent is applied to at least a portion of the crystalline or semi-crystalline build material, and the at least the portion of the crystalline or semi-crystalline build material in contact with the melt flow property reduction agent melts or coalesces at the temperature.

In an example of a three-dimensional (3D) printing method, a crystalline or semi-crystalline build material is applied. A temperature of the crystalline or semi-crystalline build material is maintained within 100 C. below a melting point of the crystalline or semi-crystalline build material. A melt flow property reduction agent is applied to at least a portion of the crystalline or semi-crystalline build material, and the at least the portion of the crystalline or semi-crystalline build material in contact with the melt flow property reduction agent melts or coalesces at the temperature.

The present disclosure generally relates to methods and apparatuses for laser shock peening during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed microstructural and/or physical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.

The present disclosure relates to powder-bed-based additive manufacturing methods, in which a component is produced layer by layer in a build-up process by local melting of particles in a powder bed. For example, a powder-bed-based additive manufacturing method may include: producing a component layer by layer in a build-up process by local melting of particles in a powder bed; interrupting the build-up process after a layer has been completed; post-treating a surface of the component by laser peening, wherein compressive stresses are generated at the surface of the layer that has been completed; and restarting the build-up process for producing a next layer. An installation for the powder-bed-based additive manufacturing method may include an application apparatus for an ablation medium.

The present disclosure relates to powder-bed-based additive manufacturing methods, in which a component is produced layer by layer in a build-up process by local melting of particles in a powder bed. For example, a powder-bed-based additive manufacturing method may include: producing a component layer by layer in a build-up process by local melting of particles in a powder bed; interrupting the build-up process after a layer has been completed; post-treating a surface of the component by laser peening, wherein compressive stresses are generated at the surface of the layer that has been completed; and restarting the build-up process for producing a next layer. An installation for the powder-bed-based additive manufacturing method may include an application apparatus for an ablation medium.

A composite powder comprising powder particles is disclosed. Each powder particle comprises a core element and a diffusion layer at least partially surrounding the core element. The core element comprises copper, gold or silver and an alloy element capable of forming a nitride, a carbide or a carbonitride. The diffusion layer comprises the alloy element and a nitride, carbide or carbonitride compound. The nitride, carbide or carbonitride compound comprises the alloy element.

The material properties of structures made with conductive nanoparticles are enhanced by radiation sintering followed by chemical sintering. The conductive nanoparticles may be applied to substrates by methods such as screen printing, inkjet, aerosol and electrospinning and then sintering the conductive nanoparticles on the substrates.