A metal porous body including a frame of a three-dimensional network structure, wherein the metal porous body has an outer appearance of a sheet shape, the frame is an alloy containing at least nickel and chromium, and is dissolved with iron in solid state, and the number of aluminum oxide powder adhered to the surface of the frame is 10 or less in 1 cm.sup.2 of the apparent area of the metal porous body.

A metal porous body including a frame of a three-dimensional network structure, wherein the metal porous body has an outer appearance of a sheet shape, the frame is an alloy containing at least nickel and chromium, and is dissolved with iron in solid state, and the number of aluminum oxide powder adhered to the surface of the frame is 10 or less in 1 cm.sup.2 of the apparent area of the metal porous body.

A hardfaced product includes a substrate and a hard composite material bonded to the substrate. The composite material includes boron carbide as a wear-resistant material and a matrix alloy including manganese and at least one of copper, silver, gold, platinum or palladium. The hardfaced product can be made by applying a molten matrix alloy to a substrate wherein the matrix alloy is combined with a wear-resistant material. The matrix alloy includes manganese and at least one of copper, silver, gold, platinum or palladium. The wear-resistant material includes boron carbide.

A hardfaced product includes a substrate and a hard composite material bonded to the substrate. The composite material includes boron carbide as a wear-resistant material and a matrix alloy including manganese and at least one of copper, silver, gold, platinum or palladium. The hardfaced product can be made by applying a molten matrix alloy to a substrate wherein the matrix alloy is combined with a wear-resistant material. The matrix alloy includes manganese and at least one of copper, silver, gold, platinum or palladium. The wear-resistant material includes boron carbide.

This disclosure provides a graded composition including at least a first, second, and third material property zone each having a crystallographic configuration distinct from other zones. In some implementations, the graded composition has a first material in the first material property zone including a metal, the first material composed of metallic bonds between metal atoms present in the first material property zone; a second material that at least partially overlaps the first material in the first material property zone including carbon, the second material composed of covalent bonds between the carbon in the second material and the metal in the first material; and, a third material that at least partially overlaps the second material property zone including carbon, the third material composed of covalent bonds between the carbon of the third material. Each crystallographic configuration may include a cubic crystallographic lattice, a hexagonal lattice, a face or body-centered cubic lattice.

This disclosure provides a graded composition including at least a first, second, and third material property zone each having a crystallographic configuration distinct from other zones. In some implementations, the graded composition has a first material in the first material property zone including a metal, the first material composed of metallic bonds between metal atoms present in the first material property zone; a second material that at least partially overlaps the first material in the first material property zone including carbon, the second material composed of covalent bonds between the carbon in the second material and the metal in the first material; and, a third material that at least partially overlaps the second material property zone including carbon, the third material composed of covalent bonds between the carbon of the third material. Each crystallographic configuration may include a cubic crystallographic lattice, a hexagonal lattice, a face or body-centered cubic lattice.

A water-soluble composition includes reducible copper ions or copper nanoparticles complexed with a reactive polymer. The reactive polymer can be crosslinked using suitable irradiation to provide copper-containing water-insoluble complexes. The water-soluble composition can be used to provide various articles and electrically-conductive materials that can be assembled in electronic devices. The reactive polymer has greater than 1 mol % of recurring units comprising sulfonic acid or sulfonate groups, at least 5 mol % of recurring units comprising a pendant group capable of crosslinking via [2+2] photocycloaddition, and optionally at least 1 mol % of recurring units comprising a pendant amide, amine, hydroxyl, lactam, phosphonic acid, or carboxylic acid group.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.

A printable lithium composition is provided. The printable lithium composition includes lithium metal powder; a polymer binder, wherein the polymer binder is compatible with the lithium powder; and a rheology modifier, wherein the rheology modifier is compatible with the lithium powder and the polymer binder. The printable lithium composition may further include a solvent compatible with the lithium powder and with the polymer binder.