Processes for producing and treating thin-films comprising nanomaterials are provided. A process of producing a transparent conducting film includes printing nanomaterials on a substrate, and directing a laser beam onto the nanomaterials to weld junctions between the nanomaterials. A process for tightly integrating nanomaterials with 2D material includes locating the 2D material over the nanomaterials, and directing a laser beam towards the 2D material to produce laser shock pressure sufficient to wrap the 2D material on the nanomaterials. A process of reducing the resistivity of a transparent conducting film includes directing a first laser beam towards a transparent conducting film having nanomaterials thereon such that the nanomaterials experience laser shock pressure sufficient to compress the nanomaterials, and then directing a second laser beam towards the transparent conducting film such that junctions between the nanomaterials are fused.

Titanium dioxide/sulfonated graphene oxide/silver nanoparticle composite membrane and its preparation method and application are disclosed. Mixing graphene oxide, sodium chloroethanesulfonate, and sodium hydroxide uniformly in the water, and then adding concentrated nitric acid to obtain sulfonated graphene oxide; mixing the aqueous solution of said sulfonated graphene oxide with the aqueous solution of silver nitrate, stirring in the dark, then adding ascorbic acid, and continuing to stir to obtain a silver nanoparticle/sulfonated graphene oxide composite material; dispersing said silver nanoparticle/sulfonated graphene oxide composite material in water, and then deposited on said titanium dioxide nanorods arrays by vacuum deposition, and vacuum dried to obtain titanium dioxide/sulfonated graphene oxide/silver nanoparticle composite membrane. The membrane possessed photocatalytic effect under UV light and special wettability: super-hydrophobic oil under water/super-hydrophobic under oil, which could in situ separation and degradation of oil/water emulsion.

An additive manufacturing method includes: applying a first liquid slurry including a first liquid carrier and polymeric particles onto a substrate as droplets; applying a second liquid slurry including a second liquid carrier and metallic particles onto the substrate as droplets; heating the droplets to substantially evaporate the first liquid carrier from the polymeric particles and the second liquid carrier from the metallic particles; and applying radiant energy to the polymeric particles and the metallic particles to sinter the polymeric particles and the metallic particles. The first liquid slurry and the second liquid slurry are applied onto the substrate as separate slurries, and the polymeric particles and the metallic particles are nanoparticles.

An additive manufacturing method includes: applying a first liquid slurry including a first liquid carrier and polymeric particles onto a substrate as droplets; applying a second liquid slurry including a second liquid carrier and metallic particles onto the substrate as droplets; heating the droplets to substantially evaporate the first liquid carrier from the polymeric particles and the second liquid carrier from the metallic particles; and applying radiant energy to the polymeric particles and the metallic particles to sinter the polymeric particles and the metallic particles. The first liquid slurry and the second liquid slurry are applied onto the substrate as separate slurries, and the polymeric particles and the metallic particles are nanoparticles.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A method of producing a patterned composite metal plate includes a) providing at least two different metal and/or metal alloy powders, b) filling a container, b1) with the powders in different individual layers, or b2) making a three dimensional non-solid body of one of the powders, inserting said body in the container and filling the cavities in and around the said body completely with the other powder, c) sealing and evacuating the container, d) subjecting the container to hot isostatic pressing, e) optionally subjecting the consolidated body to hot deformation to form an intermediate body having a thickness of 50 to 200 mm, f) hot rolling the intermediate body in two perpendicular directions in order to form a plate, and optionally one or more of g) cold rolling the hot rolled plate to form a cold rolled plate h) slitting the plate and i) etching the plate.

A method of producing a patterned composite metal plate includes a) providing at least two different metal and/or metal alloy powders, b) filling a container, b1) with the powders in different individual layers, or b2) making a three dimensional non-solid body of one of the powders, inserting said body in the container and filling the cavities in and around the said body completely with the other powder, c) sealing and evacuating the container, d) subjecting the container to hot isostatic pressing, e) optionally subjecting the consolidated body to hot deformation to form an intermediate body having a thickness of 50 to 200 mm, f) hot rolling the intermediate body in two perpendicular directions in order to form a plate, and optionally one or more of g) cold rolling the hot rolled plate to form a cold rolled plate h) slitting the plate and i) etching the plate.

A bonding structure includes: a plurality of carbon nanotubes; a first bonded member, and a first metal sintered compact bonding first end portions of the plurality of carbon nanotubes and the first bonded member, wherein the first metal sintered compact enters spaces between the first end portions of the plurality of carbon nanotubes, and bonds to the plurality of carbon nanotubes while covering side faces and end faces of the first end portions of the plurality of carbon nanotubes.

Disclosed is a technology being implemented in an apparatus for coating a substrate with swarf particles. The apparatus facilitates depositing metal coating onto metal surfaces, polymers, and ceramics. In this apparatus, the grinding process is retrofitted to deposit coatings onto substrates that range from soft (e.g., polymers and aluminium) to hard (e.g., glass-ceramic) materials. The apparatus comprises a sample holder, an infeed, and a grinding wheel. The sample holder holds a substrate to be coated with swarf particles. The infeed holding a work piece. The grinding wheel is mounted at a predefined height over the infeed. The apparatus is used to perform metal coating by depositing the swarf materials on surface of the substrate. It may be noted that the swarf materials are generated by grinding the work piece with the grinding wheel.