Patent classifications
B22F2007/042
TECHNOLOGY AND PROCESS FOR COATING A SUBSTRATE WITH SWARF PARTICLES
Disclosed is a technology being implemented in an apparatus for coating a substrate with swarf particles. The apparatus facilitates depositing metal coating onto metal surfaces, polymers, and ceramics. In this apparatus, the grinding process is retrofitted to deposit coatings onto substrates that range from soft (e.g., polymers and aluminium) to hard (e.g., glass-ceramic) materials. The apparatus comprises a sample holder, an infeed, and a grinding wheel. The sample holder holds a substrate to be coated with swarf particles. The infeed holding a work piece. The grinding wheel is mounted at a predefined height over the infeed. The apparatus is used to perform metal coating by depositing the swarf materials on surface of the substrate. It may be noted that the swarf materials are generated by grinding the work piece with the grinding wheel.
METHOD OF MANUFACTURING A SINGULATED FEEDTHROUGH INSULATOR FOR A HERMETIC SEAL OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE INCORPORATING A POST CONDUCTIVE PASTE FILLED PRESSING STEP
A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.
METHOD OF MANUFACTURING A SINGULATED FEEDTHROUGH INSULATOR FOR A HERMETIC SEAL OF AN ACTIVE IMPLANTABLE MEDICAL DEVICE INCORPORATING A POST CONDUCTIVE PASTE FILLED PRESSING STEP
A method for manufacturing a singulated feedthrough insulator for a hermetic seal of an active implantable medical device (AIMD) is described. The method begins with forming a green-state ceramic bar with a via hole filled with a conductive paste. The green-state ceramic bar is dried to convert the paste to an electrically conductive material filling via hole and then subjected to a pressing step. Following pressing, a green-state insulator is singulated from the green-state ceramic bar. The singulated green-state insulator in next sintered to form an insulator that is sized and shaped for hermetically sealing to close a ferrule opening. The thusly produced feedthrough is suitable installation in an opening in the housing of an active implantable medical device.
Electronic device having electromagnetic interference shielding layer and method of manufacturing the same
Provided is an electronic device including: an electronic component; and an electromagnetic interference shielding layer formed on at least a portion of the electronic component. The electromagnetic interference shielding layer includes: magnetic particles for electromagnetic wave absorption, each of the magnetic particles having a conductive film on a surface of the magnetic particle; and a conductive portion where conductive metal particles for electromagnetic shielding are sintered and formed on the conductive film of the magnetic particles.
Display device and apparatus, liquid metal material, related fabricating molds, methods, and apparatus
In accordance with some embodiments of the disclosed subject matter, a display device, a display apparatus, a liquid metal material, and related fabricating molds, methods, and apparatus are provided. In some embodiments, the disclosed subject matter provides a display device, comprising: a first substrate; a second substrate; and a liquid metal materiel layer sandwiched by the first substrate and the second substrate; wherein the liquid metal materiel layer comprises: a base fluid, and a plurality of liquid metal particles dispersed in the base fluid.
Display device and apparatus, liquid metal material, related fabricating molds, methods, and apparatus
In accordance with some embodiments of the disclosed subject matter, a display device, a display apparatus, a liquid metal material, and related fabricating molds, methods, and apparatus are provided. In some embodiments, the disclosed subject matter provides a display device, comprising: a first substrate; a second substrate; and a liquid metal materiel layer sandwiched by the first substrate and the second substrate; wherein the liquid metal materiel layer comprises: a base fluid, and a plurality of liquid metal particles dispersed in the base fluid.
PRINTABLE LITHIUM COMPOSITIONS
A printable lithium composition is provided. The printable lithium composition includes lithium metal powder; a polymer binder, wherein the polymer binder is compatible with the lithium powder; and a rheology modifier, wherein the rheology modifier is compatible with the lithium powder and the polymer binder. The printable lithium composition may further include a solvent compatible with the lithium powder and with the polymer binder.
ADDITIVE MANUFACTURING WITH NANOFUNCTIONALIZED PRECURSORS
Some variations provide a process for additive manufacturing of a nanofunctionalized metal alloy, comprising: providing a nanofunctionalized metal precursor containing metals and grain-refining nanoparticles; exposing a first amount of the nanofunctionalized metal precursor to an energy source for melting the precursor, thereby generating a first melt layer; solidifying the first melt layer, thereby generating a first solid layer; and repeating many times to generate a plurality of solid layers in an additive-manufacturing build direction. The additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains. Other variations provide an additively manufactured, nanofunctionalized metal alloy comprising metals selected from aluminum, iron, nickel, copper, titanium, magnesium, zinc, silicon, lithium, silver, chromium, manganese, vanadium, bismuth, gallium, or lead; and grain-refining nanoparticles selected from zirconium, tantalum, niobium, titanium, or oxides, nitrides, hydrides, carbides, or borides thereof, wherein the additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains.
Additive manufacturing with nanofunctionalized precursors
Some variations provide a process for additive manufacturing of a nanofunctionalized metal alloy, comprising: providing a nanofunctionalized metal precursor containing metals and grain-refining nanoparticles; exposing a first amount of the nanofunctionalized metal precursor to an energy source for melting the precursor, thereby generating a first melt layer; solidifying the first melt layer, thereby generating a first solid layer; and repeating many times to generate a plurality of solid layers in an additive-manufacturing build direction. The additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains. Other variations provide an additively manufactured, nanofunctionalized metal alloy comprising metals selected from aluminum, iron, nickel, copper, titanium, magnesium, zinc, silicon, lithium, silver, chromium, manganese, vanadium, bismuth, gallium, or lead; and grain-refining nanoparticles selected from zirconium, tantalum, niobium, titanium, or oxides, nitrides, hydrides, carbides, or borides thereof, wherein the additively manufactured, nanofunctionalized metal alloy has a microstructure with equiaxed grains.
Electronic component and method for producing same
The purpose of the present invention is to provide an electronic component in which a copper electrode and an inorganic substrate exhibit strong adhesion to each other. A method for producing an electronic component according to the present invention comprises: an application step wherein a paste is applied onto an inorganic substrate, which paste contains copper particles, copper oxide particles and/or nickel oxide particles, and inorganic oxide particles having a softening point; a sintering step wherein a sintered body which contains at least copper is formed by means of heating in an inert gas atmosphere at a temperature that is less than the softening point of the inorganic oxide particles but not less than the sintering temperature of the copper particles; and a softening step wherein heating is carried out in an inert gas atmosphere at a temperature that is not less than the softening point of the inorganic oxide particles.