Patent classifications
B22F2007/042
ELECTRODE MATERIAL FOR ALUMINUM ELECTROLYTIC CAPACITORS AND METHOD FOR PRODUCING SAME
The present invention provides an electrode material for aluminum electrolytic capacitors, the electrode material being capable of exhibiting a high capacitance required for capacitors and having suppressed equivalent series resistance (ESR), and provides a method for producing the electrode material.
The present invention provides an electrode material for aluminum electrolytic capacitors, comprising a sintered body of an aluminum alloy powder on at least one surface of a substrate, wherein the substrate is an aluminum foil substrate or an aluminum alloy foil substrate, and the aluminum alloy powder contains Fe in an amount of 2 to 499 mass ppm.
LASER BROADBAND CLADDING DEVICE
The present invention relates to the broadband laser cladding apparatus and more particularly to the field of 3D forming. The broadband laser cladding apparatus includes a mirror assembly and a multifunctional reflective optics assembly. The mirror assembly is configured to transmit the laser from the laser generator to the multifunctional reflective optics assembly. The multifunctional reflective optics assembly comprises an upper focusing mirror assembly to receive and redirect the laser to form the cladding spot on the work piece, as well as a reflective mirror assembly to receive and redirect the laser to form the pre-heating and slow-cooling spots outside the cladding spot, wherein the reflective mirror assembly is adjoining with the bottom edge of the upper focusing mirror assembly.
LASER BROADBAND CLADDING DEVICE
The present invention relates to the broadband laser cladding apparatus and more particularly to the field of 3D forming. The broadband laser cladding apparatus includes a mirror assembly and a multifunctional reflective optics assembly. The mirror assembly is configured to transmit the laser from the laser generator to the multifunctional reflective optics assembly. The multifunctional reflective optics assembly comprises an upper focusing mirror assembly to receive and redirect the laser to form the cladding spot on the work piece, as well as a reflective mirror assembly to receive and redirect the laser to form the pre-heating and slow-cooling spots outside the cladding spot, wherein the reflective mirror assembly is adjoining with the bottom edge of the upper focusing mirror assembly.
Shrinkable support structures
A variety of additive manufacturing techniques can be adapted to fabricate a substantially net shape object from a computerized model using materials that can be debound and sintered into a fully dense metallic part or the like. However, during sintering, the net shape will shrink as binder escapes and the base material fuses into a dense final part. If the foundation beneath the object does not shrink in a corresponding fashion, the resulting stresses throughout the object can lead to fracturing, warping or other physical damage to the object resulting in a failed fabrication. To address this issue, a variety of techniques are disclosed for substrates and build plates that contract in a manner complementary to the object during debinding and sintering.
POWDERED MATERIAL PREFORM AND PROCESS OF FORMING SAME
A powdered material preform includes a pressed powdered metal or other powdered material, where the preform is processed and sealed so that a skin or shell is formed at the outer surface of the preform (such as via melting an outer layer or surface of the preform or via adding an outer layer around the preform or via a combination thereof), with an inner portion of the preform comprising pressed powdered material. The skinned preform may comprise a shape that is generally similar to that of a final product or part to be formed, or may simply comprise a puck or shape of approximately the same mass of the shape being formed, and the skinned preform is suitable for use in subsequent densification and/or consolidation processes or combinations thereof to form the final, fully processed part.
POWDERED MATERIAL PREFORM AND PROCESS OF FORMING SAME
A powdered material preform includes a pressed powdered metal or other powdered material, where the preform is processed and sealed so that a skin or shell is formed at the outer surface of the preform (such as via melting an outer layer or surface of the preform or via adding an outer layer around the preform or via a combination thereof), with an inner portion of the preform comprising pressed powdered material. The skinned preform may comprise a shape that is generally similar to that of a final product or part to be formed, or may simply comprise a puck or shape of approximately the same mass of the shape being formed, and the skinned preform is suitable for use in subsequent densification and/or consolidation processes or combinations thereof to form the final, fully processed part.
COMPOSITE MEMBER, HEAT RADIATION MEMBER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING COMPOSITE MEMBER
A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m.Math.K and a coefficient of linear expansion not greater than 10 ppm/K.
COMPOSITE MEMBER, HEAT RADIATION MEMBER, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING COMPOSITE MEMBER
A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 ?m, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m.Math.K and a coefficient of linear expansion not greater than 10 ppm/K.
Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.
Method of manufacturing a feedthrough insulator for an active implantable medical device incorporating a post conductive paste filled pressing step
A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of forming a ceramic body in a green state, or, stacking discrete layers of ceramic in a green state upon one another and laminating together. The ceramic body has a first side opposite a second side. At least one via hole is formed straight through the ceramic body extending between the first and second sides. At least one via hole is filled with a conductive paste. The ceramic body and the conductive paste are then dried. The ceramic body and the conductive paste are isostatically pressed at above 1000 psi to remove voids and to form a closer interface for sintering. The ceramic body and the conductive paste are sintered together to form the feedthrough dielectric body. The feedthrough dielectric body is hermetically sealed to a ferrule.