A press sintering process product carrier for carrying at least one product to be sintered in a press sintering process comprises a top side; a product receiving recess defined in the top side, and configured for receiving the product(s) therein and for carrying the product(s) on a recess bottom of the product receiving recess; a top side surface surrounding the product receiving recess; a holding groove provided in the top side surface and surrounding the product receiving recess, and a vacuum connection in fluid connection with the holding groove to allow providing a vacuum in the holding groove for holding a film, foil or sheet of material provided over the product receiving recess and the holding groove; and a recess gas inlet arranged in the product receiving recess for introducing a gas into the product receiving recess, and a recess gas outlet arranged in the product receiving recess for extracting gas from the product receiving recess to allow providing a flow of gas from the recess gas inlet to the recess gas outlet for purging the product receiving recess.

A diffusion barrier coating on a nickel-based alloy substrate comprising the diffusion barrier being coupled to the substrate between the substrate and a composite material opposite the substrate, wherein the diffusion barrier comprises a nickel phosphorus alloy material.

A diffusion barrier coating on a nickel-based alloy substrate comprising the diffusion barrier being coupled to the substrate between the substrate and a composite material opposite the substrate, wherein the diffusion barrier comprises a nickel phosphorus alloy material.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

A method for producing an electrically conductive thin film on a substrate is disclosed. Initially, a reducible metal compound and a reducing agent are dispersed in a liquid. The dispersion is then deposited on a substrate as a thin film. The thin film along with the substrate is subsequently exposed to a pulsed electromagnetic emission to chemically react with the reducible metal compound and the reducing agent such that the thin film becomes electrically conductive.

Carbon fiber reinforced steel matrix composites have carbon fiber impregnated in the steel matrix and chemically bonded to the steel. Chemical bonding is shown by the presence of a unique amorphous carbon layer at the carbon fiber/steel interface, and by canting of steel crystal edges adjacent to the interface. Methods for forming carbon fiber reinforce steel composites include sintering steel nanoparticles around a reinforcing carbon fiber structure, thereby chemically bonding a sintered steel matrix to the carbon fiber. This unique bonding likely contributes to enhanced strength of the composite, in comparison to metal matrix composites formed by other methods.

Apparatuses and methods for producing covetic materials by exciting a hydrocarbon gas with pulse microwaves to form hydrocarbon radicals in a hot first region of a microwave reactor. Graphene nanoplatelets are formed by the nucleation, growth and assembly of the hydrocarbon radicals, and contact a metal melt introduced downstream of the hot region to produce a mixture of molten metal and graphene nanoplatelets which assemble in-flight to form covetic materials. Graphene planes are infused in the metal matrix to achieve carbon loadings of at least 60%.

A method includes applying a sintering precursor material layer to each of a first surface and a second surface of a ceramic tile, and assembling a precursor assembly of a direct bonded copper (DBC) substrate by coupling a first leadframe on the sinter precursor material layer on the first surface of the ceramic tile and a second leadframe on the second surface of the sinter precursor material layer on a second surface of the ceramic tile such that the ceramic tile is disposed between the first leadframe and the second leadframe. The method further includes sinter bonding the first leadframe and the second leadframe to the ceramic tile to form a sinter bonded DBC substrate.

A method for the manufacturing of an object. The method includes receiving a desired alloy composition for the object, depositing a plurality of foils in a stack to form the object, applying heat to the stack at a first temperature to bond the plurality of foils to each other, and applying heat to the stack at a second temperature to homogenize the composition of the stack. The homogenized stack has the desired alloy composition.

The present disclosure relates to a process of manufacturing an article comprising at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite and to a product manufactured thereof and wherein the article also comprises an interlayer between the at least one body of a cemented carbide and at least one body of a metal alloy or at least one body of a metal matrix composite in order to prevent deleterious interface phases from forming.