An object of the present invention is to provide an electrically conductive paste having excellent bonding strength when bonded to an electronic substrate and the like, a laminated body, and a method for bonding a Cu substrate or Cu electrode to an electrical conductor. An electrically conductive paste comprising: a flake-like silver powder A having a particle size in the range of 1 μm or more and 15 μm or less and having a median diameter D50 of 2 μm or more and 5 μm or less; a silver powder B having a particle size in the range of 25 μm or more and 100 μm or less and having a median diameter D50 of 30 μm or more and 40 μm or less; a silver powder C having a particle size in the range of 10 nm or more and 190 nm or less and having a median diameter D50 of 50 nm or more and 150 nm or less; and a solvent, wherein the content of the silver powder C is more than 5.0 parts by mass and less than 90.0 parts by mass based on 100 parts by mass in total of the flake-like silver powder A, the silver powder B, and the silver powder C.

An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.

Method for interconnecting components of an electronic system comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles, more than 95.0%, preferably more than 99.0% of the mass of the metal nanoparticles comprising a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles, more than 95.0%, preferably more than 99.0% of the mass of the metal nanoparticles comprising a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one ordered agglomerate in which the metal nanoparticles are regularly disposed in three axes, the stabilizing agent binding them together and maintaining at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system, the method comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles. the metal nanoparticles comprising for more than 95.0%, preferably for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one agglomerate in which the stabilizing agent binds them together and maintains at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer by bringing the agglomerate into contact with at least one destabilizing agent configured to desorb the stabilizing agent from the metal nanoparticles in order to aggregate and coalesce said metal nanoparticles between themselves, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

Method for interconnecting components of an electronic system, the method comprising the steps of: a) depositing a sintering solution onto a first component in order to form an interconnection layer, the sintering solution comprising a solvent, metal nanoparticles dispersed in the solvent, and a stabilizing agent adsorbed onto the metal nanoparticles. the metal nanoparticles comprising for more than 95.0%, preferably for more than 99.0% of their mass a metal selected from silver, gold, copper and alloys thereof and having a polyhedral shape with an aspect ratio of more than 0.8, b) eliminating, at least partially, the solvent from the interconnection layer such as to form at least one agglomerate in which the stabilizing agent binds them together and maintains at least a portion of the metal nanoparticles at a distance from each other, c) debinding and sintering the interconnection layer by bringing the agglomerate into contact with at least one destabilizing agent configured to desorb the stabilizing agent from the metal nanoparticles in order to aggregate and coalesce said metal nanoparticles between themselves, and d) depositing a second component in contact with the interconnection layer before or during debinding or sintering.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.