A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.

An article, a component, and a method of making a component are provided. The article includes a pre-sintered preform having a contoured proximal face and a contoured distal face. The contoured proximal face is arranged and disposed to substantially mirror a contour of an end wall of a component and the contoured distal face is arranged and disposed to form an exterior surface including a modified surface characteristic. The component includes a first end wall, a second end wall, and an article secured to at least one of the first end wall and the second end wall, the article including a pre-sintered preform having a contoured proximal face and a contoured distal face. The contoured proximal face substantially mirrors a contour of at least one of the first end wall and the second end wall, and the contoured distal face is arranged and disposed to form an exterior surface thereover.

The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion W1 of the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion W2 of the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W1.

An objective of the present invention is to provide a sinterable bonding material capable of providing a bonded article having a long-term reliability. The present invention relates to a sinterable bonding material comprising a silver filler and resin particles, wherein the silver filler comprises a flake-shaped filler having an arithmetic average roughness (Ra) of 10 nm or less; and the resin particles have an elastic modulus (E) of 10 GPa or less, and a heat decomposition temperature of 200° C. or more. The sintered product of the sinterable bonding material of the present invention is excellent in bonding strength and heat-release characteristics, and has an improved stress relaxation ability.

A metal sintering preparation containing (A) 50 to 90% by weight of at least one metal that is present in the form of particles having a coating that contains at least one organic compound, and (B) 6 to 50% by weight organic solvent. The mathematical product of tamped density and specific surface of the metal particles of component (A) is in the range of 40,000 to 80,000 cm.sup.−1.

A method for producing a radially anisotropic sintered ring magnet by continuously repeating a step of supplying magnetic powder to a die comprising a columnar magnetic core, and a cylindrical outer die having axially connected magnetic member and non-magnetic member, with a cavity between the core and the cylindrical outer die, and a step of compression-molding the magnetic powder in a radial magnetic field applied between the magnetic core and the magnetic member of the outer die, plural times in one die, to form a final green body composed of pluralities of integrally connected green bodies; and sintering the final green body; the magnetic field being applied in a state where an upper end of the magnetic member of the cylindrical outer die is higher than an upper surface of the magnetic powder supplied.

A method for producing a radially anisotropic sintered ring magnet by continuously repeating a step of supplying magnetic powder to a die comprising a columnar magnetic core, and a cylindrical outer die having axially connected magnetic member and non-magnetic member, with a cavity between the core and the cylindrical outer die, and a step of compression-molding the magnetic powder in a radial magnetic field applied between the magnetic core and the magnetic member of the outer die, plural times in one die, to form a final green body composed of pluralities of integrally connected green bodies; and sintering the final green body; the magnetic field being applied in a state where an upper end of the magnetic member of the cylindrical outer die is higher than an upper surface of the magnetic powder supplied.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.