A method of forming a cutting element comprises forming a first material comprising discrete coated particles within a container. The first material is pressed to form a first green structure comprising interbonded coated particles. A second material comprising additional discrete coated particles is formed over the first green structure within the container. The second material is pressed to form a second green structure comprising additional interbonded coated particles. The first green structure and the second green structure are sintered to form a multi-layered cutting table. Additional methods of forming a cutting element, a cutting element, and an earth-boring tool are also described.

A method of forming a cutting element comprises forming a first material comprising discrete coated particles within a container. The first material is pressed to form a first green structure comprising interbonded coated particles. A second material comprising additional discrete coated particles is formed over the first green structure within the container. The second material is pressed to form a second green structure comprising additional interbonded coated particles. The first green structure and the second green structure are sintered to form a multi-layered cutting table. Additional methods of forming a cutting element, a cutting element, and an earth-boring tool are also described.

Particles for joining material are such that an organic protective film is formed on the surface of copper nanoparticles, and have a BET specific surface area in a range of 3.5 m.sup.2/g to 8 m.sup.2/g, and a BET diameter in a range of 80 nm to 200 nm, wherein the organic protective film is included in a range of 0.5% to 2.0% by mass with respect to the particles for joining material. When the particles for joining material are analyzed by using the Time-Of-Flight Secondary Ion Mass Spectrometry (TOF-SIMS) method, respective detected amounts of C.sub.3H.sub.3O.sub.3.sup.− ions and C.sub.3H.sub.4O.sub.2.sup.− ions are in a range of 0.05 times to 0.2 times a detected amount of Cu.sup.+ ions, and a detected amount of ions of C.sub.5 or more is in a range less than 0.005 times the detected amount of Cu.sup.+ ions.

A cutter assembly for a cutting tool has a super-hard volume of super-hard material having a proximal end and a distal end and including a cavity; and a cover member. The super-hard volume has a super-hard surface at the distal end including a cutting edge. The cavity has a cavity open end at the distal end. The super-hard surface includes a cavity peripheral area coterminous with the cavity open end and the cover member has a cover peripheral area configured to mate with the cavity peripheral area to allow the cover member to cover the cavity at the cavity open end, the covered cavity providing a housing chamber within the super-hard volume. A method of making a cutter assembly is also disclosed.

A method of additively manufacturing is provided. The method may include successively depositing and fusing together layers of a superalloy powder mixture comprised of a base material powder and a eutectic powder, to build up an additive portion, which eutectic powder has a solidus temperature lower than the solidus temperature of the base material powder. The method may also include heat treating the additive portion at a temperature greater than 1200° C. to heal cracks and/or fill pores and to homogenize the alloy of which the additive portion is comprised. The additive portion alloy has a chemistry defined by the superalloy powder mixture. The base material powder may be formed of a nickel-base superalloy with an aluminum content by weight of at least 1.5%. The eutectic powder may be a nickel-base alloy including by weight about 6% to about 11% chromium, about 5% to about 9% titanium, and about 9% to about 13% zirconium, with balance nickel as its primary components.

A layer manufacturing apparatus comprising: (a) a main chamber; (b) one or more energy emission devices; (c) one or more work piece supports; (d) a plurality of material delivery devices; wherein the plurality of material delivery devices are connected to one or more spools that are located external of the main chamber.

A layer manufacturing apparatus comprising: (a) a main chamber; (b) one or more energy emission devices; (c) one or more work piece supports; (d) a plurality of material delivery devices; wherein the plurality of material delivery devices are connected to one or more spools that are located external of the main chamber.

A joining material for bonding overlapping components of a power electronic device together via a liquid phase sintering process. The joining material includes a mixture of composite particles. Each of the composite particles exhibits a core-shell structure having a core made of a copper-based material and a shell surrounding the core that is made of a low melting point material having a melting temperature or a solidus temperature less than that of the copper-based material of the core. The mixture of composite particles includes a first particulate fraction having a first median particle size and a second particulate fraction having a second median particle size. The first median particle size is at least one order of magnitude larger than the second median particle size.

A joining material for bonding overlapping components of a power electronic device together via a liquid phase sintering process. The joining material includes a mixture of composite particles. Each of the composite particles exhibits a core-shell structure having a core made of a copper-based material and a shell surrounding the core that is made of a low melting point material having a melting temperature or a solidus temperature less than that of the copper-based material of the core. The mixture of composite particles includes a first particulate fraction having a first median particle size and a second particulate fraction having a second median particle size. The first median particle size is at least one order of magnitude larger than the second median particle size.

An integrated method for manufacturing a high-temperature resistant thin-walled component by preforming by laying a metal foil strip. The integrated manufacturing method includes: designing a preform, preparing a support die, determining a thickness of a foil strip, determining a width of the foil strip, developing a laying process, laying an A foil strip and a B foil strip, obtaining an AB laminated preform, bulging the preform, performing a reactive synthesis and a densification process of a bulged component, and performing a subsequent treatment of the thin-walled component. Various embodiments obtain an integral thin-walled preform with a complex structure, a uniform wall thickness and a shape close to the final part by continuously laying a metal foil strip with an appropriate width.