A method for selectively irradiating a powder layer in additive manufacturing of a component. The method including: determining an irradiation pattern of the layer for additive manufacturing, wherein a first partial pattern is defined which is intended for continuous irradiation and comprises a plurality of irradiation vectors and wherein a second partial pattern is defined, which is intended for a pulsed irradiation, with the first and the second partial pattern being selected in such a manner that the second partial pattern connects irradiation vectors of the first partial pattern, and irradiating the layer in accordance with the irradiation patterns defined. A computer program product, an irradiating device, and a control unit for controlling an irradiating device are included.

An additive manufacturing system includes one or more light sources and one or more light valves that can be written with two-dimensional gray scale patterns that the light valves impose on beams from the one or more light sources to obtain one or more patterned beams. The one or more patterned beams are steered to each area of a plurality of areas on a layer of powder. The two-dimensional gray scale patterns are selected to achieve desired material properties at each pixel position of the patterned beam incident on the layer of powder. The light valves may modulate one or more of amplitude, phase, or coherence. The material properties may include one or more of Young's modulus, porosity, grain size, and crystalline microstructure.

An additive manufacturing system includes one or more light sources and one or more light valves that can be written with two-dimensional gray scale patterns that the light valves impose on beams from the one or more light sources to obtain one or more patterned beams. The one or more patterned beams are steered to each area of a plurality of areas on a layer of powder. The two-dimensional gray scale patterns are selected to achieve desired material properties at each pixel position of the patterned beam incident on the layer of powder. The light valves may modulate one or more of amplitude, phase, or coherence. The material properties may include one or more of Young's modulus, porosity, grain size, and crystalline microstructure.

Equipment for selectively depositing, by shockwave-induced spraying, at least one particle on a deposition surface of a receiver substrate. The equipment including at least one laser source that emits a laser beam, a substrate carrier to which the substrate is fastened, a shockwave-generating layer having a first surface oriented toward the laser beam and a second surface oriented toward the deposition surface of the substrate, an optical system for directing and focusing the laser beam toward a focal region of the first surface. The second surface including a plurality of cavities, each cavity housing at least one particle. The laser beam generates a plasma in the focal region on the first surface and a shockwave that propagates within the generating layer from the first surface to the second surface in order to spray at least one particle in the direction of the deposition surface of the substrate.

Equipment for selectively depositing, by shockwave-induced spraying, at least one particle on a deposition surface of a receiver substrate. The equipment including at least one laser source that emits a laser beam, a substrate carrier to which the substrate is fastened, a shockwave-generating layer having a first surface oriented toward the laser beam and a second surface oriented toward the deposition surface of the substrate, an optical system for directing and focusing the laser beam toward a focal region of the first surface. The second surface including a plurality of cavities, each cavity housing at least one particle. The laser beam generates a plasma in the focal region on the first surface and a shockwave that propagates within the generating layer from the first surface to the second surface in order to spray at least one particle in the direction of the deposition surface of the substrate.

Equipment for selectively depositing, by shockwave-induced spraying, at least one particle on a deposition surface of a receiver substrate. The equipment including at least one laser source that emits a laser beam, a substrate carrier to which the substrate is fastened, a shockwave-generating layer having a first surface oriented toward the laser beam and a second surface oriented toward the deposition surface of the substrate, an optical system for directing and focusing the laser beam toward a focal region of the first surface. The second surface including a plurality of cavities, each cavity housing at least one particle. The laser beam generates a plasma in the focal region on the first surface and a shockwave that propagates within the generating layer from the first surface to the second surface in order to spray at least one particle in the direction of the deposition surface of the substrate.

A method of printing a three-dimensional object. The method includes: supplying a print material to a plurality of ejector conduits arranged in an array, the ejector conduits comprising first ends configured to accept the print material and second ends comprising ejector nozzles; advancing the print material in one or more of the ejector conduits of the array until the print material is disposed in the ejector nozzle of the one or more ejector conduits; heating the print material positioned in at least one of the ejector nozzles using radiant energy, the heating causing at least a portion of the print material to be ejected from the at least one of the ejector nozzles and onto a print substrate; and repeating both the advancing the print material and the heating the print material to form a three-dimensional object on the print substrate.

A method of printing a three-dimensional object. The method includes: supplying a print material to a plurality of ejector conduits arranged in an array, the ejector conduits comprising first ends configured to accept the print material and second ends comprising ejector nozzles; advancing the print material in one or more of the ejector conduits of the array until the print material is disposed in the ejector nozzle of the one or more ejector conduits; heating the print material positioned in at least one of the ejector nozzles using radiant energy, the heating causing at least a portion of the print material to be ejected from the at least one of the ejector nozzles and onto a print substrate; and repeating both the advancing the print material and the heating the print material to form a three-dimensional object on the print substrate.

An irradiation device for an additively manufacturing apparatus may include a working beam generation device configured to provide a working beam, a modulation beam generation device configured to provide a modulation beam, and a solid-state optical modulator that includes a crystalline material that exhibits a change in refractive index in response to photoexcitation of free electrons within the crystalline material. The irradiation device may include a power source coupled to the solid-state optical modulator and configured to introduce free electrons into the crystalline material. The modulation beam may cause photoexcitation of the free electrons within the crystalline material. The photoexcitation of the free electrons within the crystalline material may cause the crystalline material to exhibit a change in refractive index. The working beam, when incident upon the crystalline material, may exhibit a change in one or more parameters, such as a phase shift, attributable at least in part to the change in refractive index exhibited by the crystalline material.

An irradiation device for an additively manufacturing apparatus may include a working beam generation device configured to provide a working beam, a modulation beam generation device configured to provide a modulation beam, and a solid-state optical modulator that includes a crystalline material that exhibits a change in refractive index in response to photoexcitation of free electrons within the crystalline material. The irradiation device may include a power source coupled to the solid-state optical modulator and configured to introduce free electrons into the crystalline material. The modulation beam may cause photoexcitation of the free electrons within the crystalline material. The photoexcitation of the free electrons within the crystalline material may cause the crystalline material to exhibit a change in refractive index. The working beam, when incident upon the crystalline material, may exhibit a change in one or more parameters, such as a phase shift, attributable at least in part to the change in refractive index exhibited by the crystalline material.