A multi-material three-dimensional printing apparatus is provided. The provided apparatus includes two or more print stations. Each of the print stations includes a substrate, a transportation device, a dispersion device, a compaction device, a printing device, a fixing device, and a fluidized materials removal device. The apparatus also includes an assembly apparatus in communication with the two or more print stations via the transportation device. The apparatus also includes one or more transfer devices in communication with the assembly apparatus. The apparatus also includes a computing and controlling device configured to control the operations of the two or more print stations, the assembly apparatus and the one or more transfer devices.

A multi-material three-dimensional printing apparatus is provided. The provided apparatus includes two or more print stations. Each of the print stations includes a substrate, a transportation device, a dispersion device, a compaction device, a printing device, a fixing device, and a fluidized materials removal device. The apparatus also includes an assembly apparatus in communication with the two or more print stations via the transportation device. The apparatus also includes one or more transfer devices in communication with the assembly apparatus. The apparatus also includes a computing and controlling device configured to control the operations of the two or more print stations, the assembly apparatus and the one or more transfer devices.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

A three-dimensional, additive manufacturing system is disclosed. The first and second printer modules form sequences of first patterned single-layer objects and second patterned single-layer objects on the first and second carrier substrates, respectively. The patterned single-layer objects are assembled into a three-dimensional object on the assembly plate of the assembly station. A controller controls the sequences and patterns of the patterned single-layer objects formed at the printer modules, and a sequence of assembly of the first patterned single-layer objects and the second patterned single-layer objects into the three-dimensional object on the assembly plate. The first transfer module transfers the first patterned single-layer objects from the first carrier substrate to the assembly apparatus in a first transfer zone and the second transfer module transfers the second patterned single-layer objects from the second carrier substrate to the assembly apparatus in a second transfer zone. The first and second printer modules are configured to deposit first and second materials under first and second deposition conditions, respectively. The first and second materials are different and/or the first and second deposition conditions are different.

A material deposition head includes a body portion and at least one nozzle. The body portion includes a first end, a second end, and a first exterior surface extending from the first end to the second end. The at least one nozzle is coupled to the body portion at or near the second end. The nozzle defines a second exterior surface and a material delivery channel that is fluidically coupled to a fluidized powder source configured to provide a plurality of particles of a material. At least one of the first exterior surface or the second exterior surface includes a microtextured surface configured to reduce a wettability of molten particles of the plurality of particles thereon.

The present invention discloses a composite device for high-precision laser additive/subtractive manufacturing, which consists of a sealed shaping chamber, an inert protective gas source and a machine-shaping platform; wherein, the inert protective gas source is connected to the sealed shaping chamber; and the machine-shaping platform is arranged in the sealed shaping chamber, as well as there is a light path selection system is arranged right above the machine-shaping platform; in addition, there is a machining position is equipped on the machine-shaping platform, meanwhile, there are lead screws are arranged under the machine-shaping platform.

The present invention discloses a composite device for high-precision laser additive/subtractive manufacturing, which consists of a sealed shaping chamber, an inert protective gas source and a machine-shaping platform; wherein, the inert protective gas source is connected to the sealed shaping chamber; and the machine-shaping platform is arranged in the sealed shaping chamber, as well as there is a light path selection system is arranged right above the machine-shaping platform; in addition, there is a machining position is equipped on the machine-shaping platform, meanwhile, there are lead screws are arranged under the machine-shaping platform.

A binder jet printer for additive manufacturing includes a build chamber and at least one further build chamber, a powder supply source configured to provide powder to both of the build chambers, a leveling assembly for leveling the powder beds in the build chambers to form leveled powder beds in the build chambers, a print head configured for depositing binder on the leveled powder beds, a radiant configured to irradiate the powder beds, and a control unit. The control unit is configured to control the powder supply source to provide powder to the build chamber and the further build chamber, control the leveling assemblies in both build chambers, control the print head to deposit binder on the leveled powder beds, wait a predetermined time for the deposited binder to soak into the powder beds, and control the radiant to irradiate the soaked powder beds in the build chambers.

Modular additive manufacturing systems, related methods for simultaneously building three-dimensional parts in successively bonded layers, and related computer readable storage medium. A plurality of build assemblies is laid out along at least one direction of a manufacturing path defining a loop, and at least one build assembly is functioning to build a three-dimensional part from build material according to build instructions. A guidable module is guided via a guiding assembly along the manufacturing path to repeatedly perform at least one step necessary to build the three-dimensional part on each functioning build assembly.

The invention belongs to a related field of electronic manufacturing technology, and particularly relates to a conformal manufacturing device and a method for a complex curved-surface electronic system, the system includes a support platform and a six-degree-of-freedom spherical motor linkage platform, a 3D measurement module, a laser lift-off module, a curved-surface transfer printing module and a conformal jet printing module respectively mounted on the support platform and independently controllable, and specific structures and work modes of these key components are improved. The invention further discloses a corresponding manufacturing method. Through the invention, multiple process flows required in conformal manufacturing process of the complex curved-surface electronic system are effectively integrated into an integrated device, so as to realize conformal hybrid manufacturing of the rigid/flexible curved-surface electronic system with arbitrary area, and the invention has advantages of high precision, high efficiency and high automation, which greatly broadens the application scope of the curved-surface electronic manufacturing technology.