Patent classifications
B23B27/20
CUBIC BORON NITRIDE SINTERED MATERIAL AND CUTTING TOOL
A cubic boron nitride sintered material comprises cubic boron nitride particles, a binding phase, and an interfacial phase. The interfacial phase intervenes between the cubic boron nitride particles and the binding phase. The interfacial phase includes aluminum, nitrogen, boron, and oxygen. A total of an average value of the atomic concentrations of aluminum included in the interfacial phase and an average value of the atomic concentrations of nitrogen included in the interfacial phase is 50.0 at % or more. A ratio of an average value of the atomic concentrations of nitrogen included in the interfacial phase to an average value of the atomic concentrations of boron included in the interfacial phase is more than 1.00.
CUBIC BORON NITRIDE SINTERED MATERIAL AND CUTTING TOOL
A cubic boron nitride sintered material comprises cubic boron nitride particles, a binding phase, and an interfacial phase. The interfacial phase intervenes between the cubic boron nitride particles and the binding phase. The interfacial phase includes aluminum, nitrogen, boron, and oxygen. A total of an average value of the atomic concentrations of aluminum included in the interfacial phase and an average value of the atomic concentrations of nitrogen included in the interfacial phase is 50.0 at % or more. A ratio of an average value of the atomic concentrations of nitrogen included in the interfacial phase to an average value of the atomic concentrations of boron included in the interfacial phase is more than 1.00.
Cutting elements and structures
A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
Cutting elements and structures
A method of forming a supporting substrate for a cutting element comprises forming a precursor composition comprising discrete WC particles, a binding agent, and discrete particles comprising Co, Al, and one or more of C and W. The precursor composition is subjected to a consolidation process to form a consolidated structure including WC particles dispersed in a homogenized binder comprising Co, Al, W, and C. A method of forming a cutting element, a cutting element, a related structure, and an earth-boring tool are also described.
CUTTING INSERT, CUTTING TOOL, AND METHOD FOR MANUFACTURING MACHINED PRODUCT
A cutting part of a cutting insert may include a first surface including a corner, a first side, a first region, a second region and a third region. The first region may be located along the corner and the first side. The second region may be located at a more inner part than the first region. The third region may be located at a more inner part than the second region. A boundary between the corner and the first side may be a first point. A boundary between the first region and the second region may be a second point in a cross section that passes through the first point and is orthogonal to the first side. An imaginary straight line passing through the first point and the second point may be a first imaginary straight line. The first imaginary straight line may intersect with the third region.
CUBIC BORON NITRIDE SINTERED MATERIAL
A cubic boron nitride sintered material comprises 30% by volume or more and 99.9% by volume or less of cubic boron nitride grains and 0.1% by volume or more and 70% by volume or less of a binder phase, the cubic boron nitride grain having a carbon content of 0.08% by mass or less, the cubic boron nitride sintered material being free of free carbon.
ELECTRONIC DEVICE CASE AND MANUFACTURING METHOD THEREFOR
Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.
ELECTRONIC DEVICE CASE AND MANUFACTURING METHOD THEREFOR
Various embodiments relate to a case included in an electronic device, and according to one embodiment, an electronic device case comprises: an exterior case formed by processing an upper surface of a base material of the electronic device case by means of a first head of a CNC device, and at least one pattern formed by processing a lateral surface of the exterior case by means of second and third heads of the CNC device, wherein at least one pattern includes first and second patterns, the first pattern is processed at the lateral surface of the exterior case by means of the second head, and the second pattern can be processed at the first pattern by means of the third head. In addition, other various embodiments are possible.
METHOD FOR MANUFACTURING FRESNEL LENS MOLD, MACHINING APPARATUS, AND CUTTING TOOL
Provided is a method for manufacturing a Fresnel lens mold by performing cutting process on a workpiece with a cutting tool, the Fresnel lens mold having a lens surface and an upright surface alternately arranged. The cutting tool has a first cutting edge having an arc shape with a radius r and a second cutting edge continuous to the first cutting edge. A machining apparatus repeatedly performs a first process of forming, with the first cutting edge, a lens mold surface serving as a mold of a lens surface of a Fresnel lens, and a second process of forming, with the second cutting edge, an upright mold surface serving as a mold of an upright surface of the Fresnel lens to manufacture the Fresnel lens mold.
DIAMOND-COATED TOOL
In a diamond-coated tool, a flank face of a tool base material includes a first flank face continuously extending to a cutting edge, a second flank face located farther away from the cutting edge than the first flank face and located outside the first flank face when viewed from an inside of the tool base material, and a flank face-side stepped portion connecting the first flank face and the second flank face. A diamond-coated layer is provided on the first flank face and the flank face-side stepped portion.